2026 27th International Conference on Electronic Packaging Technology
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Mr. Scott CHEN
Senior Deputy General Manager of Engineering，ASE (Advanced Semiconductor Engineering), Taiwan, China
Nano Materials and Polymer Composites for Electronic Packaging
Prof. Zhuo LI
Professor, Fudan University, China
Advanced System Packaging and Solder Interconnection
Prof. Jusheng MA
Professor, Tsinghua University, China
Dr. Wei Koh
Founder，Pacrim Technology Irvine, CA, USA
High Reliability Soldering in Semiconductor Packaging
Dr. Ning-Cheng Lee
Founder, ShinePureHi-Tech, China
Cu-Cu Hybrid Bonding and Co-Packaged Optics with Silicon Photonics
Dr. John H. LAU
Chief Scientist, Unimicron Technology Corporation, Taiwan, China
Wafer Bonding and Hybrid Bonding Technologies: From Fundamentals to Frontier Applications
Prof. Chenxi Wang
Professor, Harbin Institute of Technology, China
Photonic Components and Packaging Technologies for Optical Links
Dr. Torsten Wipiejewski
Director，Huawei Technologies Duesseldorf GmbH
Experimental Methods for Stress and Strain Analysis of Advanced Electronics Packaging
Prof. Jeffrey C. Suhling
Quina Professor and Department Chair, Department of Mechanical Engineering, and Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), Auburn University, IEEE Fellow, USA
12:05-13:00 Lunch & Break
Dr. Shaw Fong Wong, Intel
Prof. Jeffrey C. Suhling, Elected Chair, IEEE Electronics Packaging Society Chapter
Right-sized Al at the Edge: Scaling Intelligence with Big Impact
Dr. Eu Poh Leng Senior Director of External Package Innovation，NXP Semiconductors，Malaysia
The Second Wave of PLP for HPC and AI Applications
Dr. Tanja Braun
Head of Department, Fraunhofer IZM，Germany
The Impact of the Dynamic AI Market on the Advanced Packaging Supply Chain
Dr. Yu-Po, Wang
Principle Consultant, Prismark
ICSJ
ICEPT
Interactive Panel
13:00-13:10 Welcome address
Chair: Prof. Jun Yang, Southeast University
Bridging PCB and Advanced Packaging: Our Journey Toward Package-Aware Design
Mr. Liang JIA
Director in Semiconductor BU，Huatek，China
Advanced Packaging Design & Simulation Solutions and Challenges
Dr. Guangchao Lv
Senior R&D Engineer, National Center for Advanced Packaging Co., Ltd，China
Trends and Industrial Practices of STCO-Driven 3DIC Design Methodology
Dr. Michael Liu
Product Director，Empyrean Technology Co., Ltd，China
14:25-14:35 Tea Break & Networking
Chair: Dr. Michael Liu, Product Director，Empyrean Technology Co., Ltd
Physically Aware Logic Synthesis in the AI Era
Dr. Keren Zhu
Assistant Professor，Fudan University，China
Thermal Simulation of Chiplet heterogeneous Integration system
Prof. Qinzhi Xu
Research Professor，Institute of Microelectronics of Chinese Academy of Sciences, China
Panel
Low Distortion Wafer Bonding using programmable wafer deflection for advanced semiconductor manufacturing
Dr. Li GONG
General Manager, SUSS MicroTec (Shanghai) LTD
Trends in Bonding Technology Driven by the AI Era
Mr. Ren Chaoqun
General manager，Wisdom SemiTeC (Jiangsu) Technology Co.,Ltd
Technology & Fusion, enabling AI innovation
Mr. Norito Matsumura
Senior Director, Tokyo Electron
Plasma Activation in the Downstream Region of a Surface-Wave-Excited Plasma for Hybrid Bonding
Dr. Yasuhiro Morikawa
Manager, ULVAC, Inc.
The Next 3D Frontier: Equipment Perspectives on D2W Hybrid Bonding Challenges
Mr. Jonathan Abdilla
Director Technology，Besi
Fusion & Hybrid Bonding: Driving Application Performance, Power and Cost by Mixing and Matching Semiconductor Technologies
Mr.Thomas Pleschke
Business Development，EV Group (EVG)
Pushing the limit of bonding accuracy and throughput
Mr.Benz ZHAO
CTO，Guangdong iStar Technology Equipment Co., Ltd.(iSTAR)，China
Chair: Prof. Kouchi ZHANG, Academician of the Netherlands Academy of Engineering，IEEE Fellow
08:30-08:45 Welcome address
Chair: Prof. Tianchun YE, Chair of ICEPT, China
Prof. Jeffrey C. Suhling, IEEE EPS President, USA
· Plenary Talk-1：08:45-09:15
Stress Sensing Test Chips for Application to Electronics Packaging
· Plenary Talk-2：09:15-09:45
Heterogeneous and Hybrid Integration Technologies for the Era of Humanoid Robotics and the Low-Altitude Economy
Prof. Sheng Liu
Academician of CAS, Dean of School of Integrated Circuits, IEEE Fellow, Wuhan University，China
09:45-10:00 Break & Exhibition
Chair: Prof. Ricky LEE, Dean of Systems Hub, Hong Kong University of Science and Technology (Guangzhou), China, IEEE Fellow
· Plenary Talk-3：10:00-10:30
Sinterconnects® as a Platform for Double‑Sided‑sintered WBG Power Modules
Dr. Ali Roshanghias
Head of the Research Unit for Heterogeneous Integration Technologies (HIT), Silicon Austria Labs (SAL), Austria
· Plenary Talk-4：10:30-11:00
Application Practice and Prospect of Advanced Packaging Technology in Intelligent Computing Chip Systems
Mr. Daohong Yang
Director of Yangtze Laboratory, Dean of the School of Integrated Circuits, Hubei University, China
· Plenary Talk-5：11:00-11:30
Chips Z: 2.5D/3D AI EDA+ Ushering in a New Era of STCO-Driven System-Level Collaboration for Advanced Packaging
Dr. Alex Zhao
Founder and Chief Scientist，Zhuhai Silicon Chip Technology Ltd. ,China
· Plenary Talk-6：11:30-12:00
Advanced Packaging Equipment Empowers a New Ecosystem of Heterogeneous Integration
Mr. Fei Yu
Director of Marketing, Product & Solution，Beijing NAURA Microelectronics Equipment Co.,Ltd. ,China
12:00-13:00 Lunch
Cu Paste for Bonding Applications in Advanced and Power Semiconductor Devices
Prof. Chuantong CHEN
Professor，Osaka University, Japan
Thin Film Applications via Atomic Layer Deposition (ALD) in Advanced Packaging Processes
Mr. Zihao Li
Process engineer，Kokusai Electric Corporation
Composite materials for effective heat dissipation application
Mr. Bin Xu
Lecturer，University of Tokyo
Advanced Wafer Temporary Bonding and Debonding Tape Solutions for 3D Packaging
Mr.Weiqiang.SHEN
Sales Manager，Sekisui (Shanghai) International Trading CO.,LTD
Advanced Organic Substrates enabling co-package optics at scale
Mr. Bula Wang
TDI Director，AT&S
Mr. Farhang Yazdani
CEO,BroadPak Corporation
Chair: Prof.Johan LIU, Academician of the Royal Swedish Academy of Engineering Sciences, Sweden，IEEE Fellow
Glass Packaging and Its Reliability
Dr. John H Lau
Chief Scientist，Unimicron Technology Corporation, Taiwan, China
Advanced Utilisation of Machine Learning Models for Package Reliability Analysis
Dr. Karsten Meier
Senior Researcher, Assistant Director of Technische Universität Dresden，Germany
Advanced Packaging Materials Innovation through Co-creative Activities
Mr. Hidenori ABE
CTO for semiconductor materials, Executive director, Electronics Business Headquarters of Resonac Corporation
Advanced Die Attachment Technologies for Power Electronic Packaging
Dr. Li LIU
Marie Skłodowska-Curie Actions (MSCA) Postdoctoral Fellow, Delft of Technology
Application of Wafer Bonding in Advanced Packaging
Mr. Weijia Cai
CTO, WuShi Microelectronics (Suzhou) Co. Itd.
Getting ready for the challenges of Silicon Photonics
Dr. Ruby Yan
Vice president for global business center, Guangzhou Zen Semiconductor Corporation, China
15:30-15:45 Tea Break & Networking
Chair: Zhiquan Liu, Southern University of Science and Technology, China
Electromigration in Microscale Interconnects with a Coexisting Liquid-Solid Solder Matrix
Prof. Wu YUE
Dean, Lanzhou Institute of Technology, China
Holistic Chiplet Packaging Approach
A Review of a Bi-free In-containing Lead-free Mid-temperature Solder
Dr. Hongwen Zhang
R&D Director and Principal Research Metallurgist，Indium Corporation
Semiconductor Industry – Impact of Wafer Fabrication Equipment and Its Respective Processes and Critical Materials for Advanced Packaging
Dr. Kitty Pearsall
IEEE EPS DL, Independent Consultant, IEEE Fellow，USA
Q-band 4×4 Phased-Array Antenna-in-Package (AiP) for High-Efficiency mmWave NTN Applications
Dr. Li-Cheng Shen
AVP, Universal Global Scientific Industrial Co., Ltd.，Taiwan, China
Navigating the Collision of AI, Politics & Engineering Reshaping Electronics Manufacturing!
Dr.Charles E. Bauer
Senior Managing Director，TechLead Corporation，USA
Glass Packaging
Chief Scientist of Unimicron Technology Corporation, Taiwan, China
Process and Material Challenges and Solutions for Ultra-large-scale Chiplet Advanced Packaging
Dr. Hongbin Shi Principal Expert in Electronic Packaging，Awinic Technology Co., Ltd.，China
AI is accelerating the shift to advanced packaging with PLP and glass cores
Dr. Yik-Yee TAN Principal Market & technology Analyst, Yole Group，Singapore
Advances in Room-Temperature Surface-Activated Bonding for Heterogeneous Optoelectronic Integration
Prof. Ryo Takigawa Professor, Kyushu University, Japan
Moldex3D Advanced Packaging Molding Analysis Solution and Latest Technological Advancements
Dr. Leo Shen
Senior Manager，CoreTech System Co., Ltd. (Moldex3D) ，China
Opportunities and Challenges of FOPLP and Electroplating Technologies for Advanced AI Chip Packaging
Mr. Zhaowei Jia
Process Vice President，ACM Research (Shanghai), Inc.
End-to-End TGV AOI Metrology for Mass Production
Mr.Yang Yang
R&D Director，Shenzhen Hanswell Technology Co., Ltd.，China
Mastering 3D-IC Design Challenges Through Advanced Simulation
Mr. Minggang Hou Principal Engineer，Synopsys
Structured light for subtle micro- and nanomachining of transparent materials and beyond
Dr. Daniel Flamm
Principal Expert, TRUMPF SE + Co. KG
Large-Field Projection Lithography: Technical Routes and Industrial Value of Full-Wafer Exposure for Advanced Packaging
Dr. Bo-Fang Peng Founder，PURECHIP
From Round to Rectangle: NAURA Empowers the Development of Panel-Level Packaging
Mr.Yang Wang
Vice President, General Manager of PLP Business Unit，Beijing NAURA Vacuum Technology Co., Ltd.，China
Research on 10Gbps Space Balanced Photodetector Based on Metallized Fiber Resistance Welding Technology
Ms. Zhen Ma
Deputy Director, Manufacturing Center, Xi ’ an Branch, China Academy of Space Technology，Academy of Space Electronic Information Technology Xi’an, China
Transient radiation effects on packaged micro-systems
Prof. Guohe Zhang
Vice Dean and Professor of School of Microelectronics, Xi'an Jiaotong University，China
NPO/CPO Optical Engine Packaging in the AI Era: Discussions and Engineering Practices
Dr. Quan Cao
Optical Device Expert，Wuhan Fisilink Microelectronics Technology Co., Ltd. ，China
Glass substrates enable advanced semiconductor packaging: Design rules for via-via distances based on mechanic reliability
Dr. Martin Letz
senior principal scientist，SCHOTT AG
Digital lithography for advanced interconnects Toward-Zero-Compromise: Performance & Yield Co-Optimization
Mr. Kazuya Aoki
Optical Device Expert
General Manager, Global Sales Division, Technical Marketing Division and Customer Success Team, AUCC, USHIO INC.
Failure Mechanism and Reliability Evaluation of Interconnection Structures for SiP
Dr. Ling LI
Deputy Chief Engineer，Xi'an Microelectronics Technology Institute，China
Biocompatible ultrathin devices interfacing with organs
Prof. Zhi Jiang
Professor, Harbin Institute of Technology (Shenzhen)
Technological Development and Applications of Ultra-Low Loss Fiberglass-Free Film Products in the Era of High-Performance AI Computing
Dr. Yue Jiang
Deputy General Manager,Guangdong EPS Technology Co.,Ltd,China
Modeling and Simulation of Advanced Packaging with COMSOL
Mr. Zhenhong Zhong
Technical Manager, COMSOL China
Xiaoqing WEI（Submit Contact）
18392959178
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