OVERVIEW OF CONFERENCE PROGRAM：August 5-7th

　

    Note: The information is only for your reference. The final conference schedule shall prevail on the date of conference.

August 5th

PDC-1 Room 1: 08:30-10:00

PDC-1 Room 1: 08:30-10:00

Advanced Packaging for High Performance Computing

Dr. Daquan YU

Xiamen University, Xiamen Sky Semiconductor Co., Ltd., China                                                                                                                                                                                            

PDC-2 Room 1: 10:20-11:50

PDC-7　10:15-11:45

Mechanics and Reliability of Lead-Free Solder Joints

Prof. Jeffrey Suhling

Quina Distinguished Professor and Department Chair, Department of Mechanical Engineering, Auburn University, USA                                                                                                                

PDC-3 Room 1: 13:30-15:00

PDC-3　13:00-14:30Analysis of Fracture and Delamination in Microelectronic Packages

Prof. Andrew Tay

National University of Singapore

PDC-4 Room 1: 15:20-16:50

PDC-4　10:30-12:00

Design and Process Considerations for 2.5D Interposer Technology

Prof. Gu-Sung Kim

Kangnam University, Yongin, S Korea

PDC-5 Room 2: 08:30-10:00

PDC-6　08:30-10:00

Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics

Dr. John H Lau

Unimicron Technology Corporation, Taiwan, China                                                                                                                    

PDC-6 Room 2: 10:20-11:50

PDC-2　10:15-11:45

Packaging of MEMS and More

Prof. Shuji Tanaka

Department of Robotics, Graduate School of Engineering, Tohoku University, Japan                                                                                

PDC-7 Room 2 13:30-15:00

PDC-5　Room 1: 16:15-17:45

Analysis of Fracture and Delamination in Microelectronic Packages

Dr. Wei Koh

Pacrim Technology Irvine, CA, USA                                                                                                           

PDC-8 Room 2 15:20-16:50

PDC-8 Room 2 15:20-16:50

TBD

Prof. Sheng LIU

Academician of CAS, Dean of School of Power and Mechanical Engineering, Wuhan University

August 6th

09:10-09:40

Effects of Aging on the Reliability of Electronic Products Incorporating Lead Free Solders

Prof. Jeffrey C. Suhling

Quina Distinguished Professor and Department Chair, Department of Mechanical Engineering, Auburn University, USA                                           

09:40-10:10

Multi Field Cross Scale Collaborative Design Methods and Technologies for Chip Manufacturing and Integration

Prof. Sheng LIU

Academician of the Chinese Academy of Sciences, Wuhan University, China

                                                                                                                       

From DIP to MIP: 40 years in Semiconductor Packaging

Prof. Kees Beenakker

Delft University of Technology, the Netherlands                                                                                                                                             

Special Session II: Hybrid Bonding Technology
iHBC-1

iHBC 13:30-14:00Recent Advances and Trends in Cu-Cu Hybrid Bonding

Dr. John H Lau

Unimicron Technology Corporation, Taiwan, China

iHBC-2

iHBC-2

Hybrid Bonding as Crucial Technology for Future Applications

Prof. Viorel Dragoi

EV Group, Austria

iHBC-3

iHBC-3

Advancements in Bonding Technologies Enabling Innovations in Device Structures and Packaging Capabilities

Dr. Kenny Ye

Piotech, China

iHBC-4

iHBC-5 15:50-16:20Low-Temperature Hybrid Bonding for Heterogeneous Integration

Prof. Chenxi Wang

Harbin Institute of Technology, China

iHBC-7

iHBC-7

Interface Engineering for Hybrid Bonding Interconnect

Dr. Renxi JIN

Institute of Microelectronics of the Chinese Academy of Sciences, China

August 7th

08:30-09:00

Flip Chip on Glass-Core Substrate with Micropump and Cu-Cu Hybrid Bonding

Dr. John H Lau 

Unimicron Technology Corporation, Taiwan, China                                                                                               

Advanced packaging technology for AI and power semiconductors

Prof. Katsuaki Suganuma 

Osaka University, Japan                                                                                                                                       

10:45-11:15

Semiconductor Equipment Supply Chain for FEOL Advanced Packaging

Dr. Kitty Pearsall

President of Boss Precision Inc., Independent Consultant, USA                                                            

11:15-11:45

Latest Trends in Low-Temperature Bonding Technology for Heterogeneous Integration and Advances in Sensors and Electronic Devices

Prof. Eiji Higurashi

Tohoku University, Japan

                                                                                       

11:45-12:15

Advanced Packaging Challenges for Chiplets and Heterogeneous Integration

Prof. Xuejun FAN

Lamar University, Beaumont, TX, USA                                                                

CONCURRENT EXHIBITION：August 6-7th

　CONCURRENT EXHIBITION