2025 26th International Conference on Electronic Packaging Technology
English
Chinese
SPONSORED BY
ORGANIZED BY
CONTACT US
Meeting Secretary
Xiaoxiao JI（Submit Contact）
18621199790
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
0086-13121110782
0086-010-64655251
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Note: The information is only for your reference. The final conference schedule shall prevail on the date of conference.
Chair: Dr.Qidong WANG, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China
Advanced Packaging for High Performance Computing
Dr. Daquan YU
Xiamen University, Xiamen Sky Semiconductor Co., Ltd., China
Mechanics and Reliability of Lead-Free Solder Joints
Prof. Jeffrey C. Suhling
Quina Distinguished Professor and Department Chair, Department of Mechanical Engineering, Auburn University, USA
Chair: Prof. Wei WANG, Peking University, China
Analysis of Fracture and Delamination in Microelectronic Packages
Prof. Andrew Tay
National University of Singapore
MEOL design and process consideration for heterogeneous integrated package and substrate
Prof. Gu-Sung Kim
Kangnam University, Yongin, S Korea
Chair: Prof. Nan WANG, Shanghai University, China
Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics
Dr. John H. LAU
Unimicron Technology Corporation, Taiwan, China
Packaging of MEMS and More
Prof. Shuji Tanaka
Department of Robotics, Graduate School of Engineering, Tohoku University, Japan
Chair: Prof. Luqiao YIN, Shanghai University, China
Innovations in Advanced Packaging Technology
Dr. Wei Koh
Pacrim Technology Irvine, CA, USA
Quantum Mechanics & Molecular Dynamics and Their Applications in Electronic Manufacturing
Prof. Sheng LIU
Dean of the School of Power and Mechanical Engineering and the Institute of Technological Science of Wuhan University
Dr. Yuzheng GUO
Dean of School of Power and Mechanical Engineering, Wuhan University
Nano Materials and Polymer Composites for Electronic Packaging
Dr. Daniel Lu
Vice President, Henkel Corporation
Chair: Prof. Kouchi ZHANG, Academician of the Netherlands Academy of Engineering
Effects of Aging on the Reliability of Electronic Products Incorporating Lead Free Solders
Multi Field Cross Scale Collaborative Design Methods and Technologies for Chip Manufacturing and Integration
Dean of School of Power and Mechanical Engineering, Wuhan University, Executive Director of the Institute of Technological Sciences
From DIP to MIP: 40 years in Semiconductor Packaging
Prof. Kees Beenakker
Delft University of Technology, the Netherlands
TBD
Prof. ZongLiang HUO
Yangtze Memory Technologies Co., Ltd.
Heterogeneous integration technology with high density bump for silicon-drived microdisplays
Prof. Jane ZHANG
Shanghai University, China
Trends and Development Paths of Board-level Packaging
Dr. Kang ZHANG
R&D Director, Chengdu ECHINT Technology Co., Ltd.
x64 UCIe Chiplets at 32 GT/s on Emerging Silicon Core Substrate and Advanced TIM Cooling
Farhang Yazdani
CEO, BroadPak Corporation
Modeling and Simulation of Advanced Packaging with COMSOL
Zhenhong ZHONG
Technical Manager, COMSOL China
High speed die-to-die interface and chiplet system design in advanced package
Dr. Yu WANG
Sr. Design Manager, KiwiMoore Semiconductor Co., Ltd.
The synergy of PLP and Glass Core Substrate supporting the growing demands of AI
Dr. Yik-Yee TAN
Principal Market & Technology Analyst, Yole Group
Recently High Bright LED Applications for High Level Lighting, Pant Cultivation of Agriculture, Medical, Virus Sterilization, Mini LED and Micro LED Display
ATSUSHI OKUNO
CEO, Green Planets CO.,LTD.
Challenges in Advanced Packaging for High Performance Computing
Dr. Cheng YANG
Scientist, JCET Group Co., Ltd.
Flip Chip on Glass-Core Substrate with Micropump and Cu-Cu Hybrid Bonding
Hybrid Bonding as Crucial Technology for Future Applications
Prof. Viorel Dragoi
EV Group, Austria
Advancements in Bonding Technologies Enabling Innovations in Device Structures and Packaging Capabilities
Dr. Kenny Ye
Piotech, China
Low-Temperature Hybrid Bonding for Heterogeneous Integration
Prof. Chenxi Wang
Harbin Institute of Technology, China
Hybrid bonding interface Issues
Prof. Liyi LI
Southeast University, China
Pushing The Limit of Bonding Accuracy and Throughput
Mr. Bin ZHAO
iStar, China
Application of Advanced Bonding Technologies in FEOL Processes
Mr. Chaoqun REN
Wisdom SemiTeC (jiangsu) Technology Co., Ltd, China
Interface Engineering for Hybrid Bonding Interconnect
Dr. Renxi JIN
Institute of Microelectronics of the Chinese Academy of Sciences, China
Advanced Hybrid Bonding Technologies and Applications
Dr. Fengwen MU
iSABers, China
Recent Advances and Trends in Cu-Cu Hybrid Bonding
Advanced packaging technology for AI and power semiconductors
Prof. Katsuaki Suganuma
Osaka University, Japan
Manufacturing Transformation Era: Process Solutions for Wafer and Panel-Level Packaging Driven by Semiconductor Process Technology
Dr. Taku Hanna
ULVAC, Inc., Japan
Mr. Scott CHEN
ASE (Advanced Semiconductor Engineering), Taiwan, China
Semiconductor Equipment Supply Chain for FEOL Advanced Packaging
Dr. Kitty Pearsall
President of Boss Precision Inc., Independent Consultant, USA
Low-Temperature Bonding Technology for Heterogeneous Integration and Advances in Sensors and Electronic Devices
Prof. Eiji Higurashi
Tohoku University, Japan
Dr. Guorong LI
Vice General Manager of the First Etching Business Unit, NAURA China
Hybrid Copper Bonding: A Key to High-Performance 3D Integration
Prof. Sarah Eunkyung Kim
Seoul National University of Science and Technology
The Domestic Development, Research, and Application of IC Substrate Materials
Dr. Yue JIANG
Deputy General Manager, Guangdong EPS Technology Co.,Ltd.
The Study of Warpage and Micro-Structure Measurement with Optical Metrological Technologies in Advanced Packaging Process
Dr. Joonho You
CEO, Nexensor Inc.
Development of Advanced Packaging Technology in NCAP China
Dr. Peng SUN
General Manager, National Centre for Advanced Packaging
Building an Autonomous Future with AI at The Edge
Dr. Eu Poh Leng
Senior Director of External Package Innovation, NXP Semiconductors
TGV Full-Process AOI Inspection Technology and Solutions
Cruise YANG
R&D Director, Shenzhen HanSuper Precision Measurement Co., Ltd.
Advanced Utilisation of Machine Learning Models for Package Reliability Analysis
Dr. Karsten Meier
Senior Researcher, Assistant Director, Technische Universität Dresden
Thermal Cycle Reliability Challenges and Solutions for SOC Packages in Consumer Electronics
Dr. Hongbin SHI
Principal Expert in Electronic Packaging, Awinic Technology Co., Ltd.
LPKF Shanghai Co., Ltd.
Shenzhen Leaderwe Intelligent Co., Ltd
ShenZhen Like Automation Equipment Co.,Ltd.
Witmem
Vision Engineering Ltd
Shenzhen Hongxin Microelectronics Technology Co., Ltd.
Ningbo Flexd Electronic Tech
Finetech GmbH & Co. KG
ACM Research (Shanghai), Inc.
GUANGDONG EPS TECHNOLOGY CO., LTD
JIACO Insturments
Guangdong iStar Technology Equipment Co., Ltd.(iSTAR)
ADVANTEST CORPORATION
Winifred International Technology Ltd.
Shenzhen Fitech Co., Ltd.
InfraTec
K-ANALYSIS INSTRUMENT TRADING (SHANGHAI) CO.. LTD
Wechat inquiry
Telephone inquiry
Mail inquiry
