Chair:  Dr.Qidong WANG, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China

Advanced Packaging for High Performance Computing

Dr. Daquan YU

Xiamen University, Xiamen Sky Semiconductor Co., Ltd., China                                                                                                                                                                                            

Mechanics and Reliability of Lead-Free Solder Joints

Prof. Jeffrey C. Suhling

Quina Distinguished Professor and Department Chair, Department of Mechanical Engineering, Auburn University, USA                                                                                                                

Chair: Prof. Wei WANG, Peking University, China

Analysis of Fracture and Delamination in Microelectronic Packages

Prof. Andrew Tay

National University of Singapore

MEOL design and process consideration for heterogeneous integrated package and substrate

Prof. Gu-Sung Kim

Kangnam University, Yongin, S Korea

Chair: Prof. Nan WANG, Shanghai University, China

Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics

Dr. John H. LAU

Unimicron Technology Corporation, Taiwan, China                                                                                                                    

Packaging of MEMS and More

Prof. Shuji Tanaka

Department of Robotics, Graduate School of Engineering, Tohoku University, Japan                                                                                

Chair: Prof. Luqiao YIN, Shanghai University, China

Innovations in Advanced Packaging Technology

Dr. Wei Koh

Pacrim Technology Irvine, CA, USA                                                                                                           

Quantum Mechanics & Molecular Dynamics and Their Applications in Electronic Manufacturing

Prof. Sheng LIU

Academician of CAS, Dean of School of Power and Mechanical Engineering, Wuhan University

Dr. Yuzheng GUO

Vice Dean of School of Power and Mechanical Engineering, Wuhan University

Nano Materials and Polymer Composites for Electronic Packaging

Dr. Daniel Lu

Vice President, Henkel Corporation