2026 27th International Conference on Electronic Packaging Technology
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Click to Download ICEPT 2026 Conference Program: ICEPT 2026 Program Overview.pdf
Professional Development Course：
Driving the megawatt AI Era: Next-Gen packaging
Mr. Scott CHEN
Senior Vice President of Engineering, ASE (Advanced Semiconductor Engineering), Taiwan, China
Nano Materials and Polymer Composites for Electronic Packaging
Prof. Zhuo LI
Professor, Fudan University, China
Advanced System Packaging and Solder Interconnection
Prof. Jusheng MA
Professor, Tsinghua University, China
Dr. Wei Koh
Founder, Pacrim Technology Irvine, CA, USA
High Reliability Soldering in Semiconductor Packaging
Dr. Ning-Cheng LEE
Founder, SHINEPURE HI-TECH, China
Cu-Cu Hybrid Bonding and Co-Packaged Optics with Silicon Photonics
Dr. John H. LAU
Chief Scientist, Unimicron Technology Corporation, Taiwan, China
Wafer Bonding and Hybrid Bonding Technologies: From Fundamentals to Frontier Applications
Prof. Chenxi WANG
Professor, Harbin Institute of Technology, China
Photonic Components and Packaging Technologies for Optical Links
Dr. Torsten Wipiejewski
Director, Huawei Technologies Düesseldorf GmbH, Germany
Experimental Methods for Stress and Strain Analysis of Advanced Electronics Packaging
Prof. Jeffrey C. Suhling
Quina Professor and Department Chair, Department of Mechanical Engineering, and Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3), Auburn University, USA, IEEE Fellow
12:05-13:00 Lunch & Break
Dr. Shaw Fong Wong, Intel, Malaysia
Prof. Jeffrey C. Suhling, Elected Chair, IEEE Electronics Packaging Society Chapter, USA
The Journey Ahead: Scaling Physical AI
Dr. Eu Poh Leng Senior Director of External Package Innovation, NXP Semiconductors, Malaysia
The Second Wave of PLP for HPC and AI Applications
Dr. Tanja Braun
Head of Department, Fraunhofer IZM, Germany
The Impact of the Dynamic AI Market on the Advanced Packaging Supply Chain
Dr. Yu-Po Wang
Principle Consultant, Prismark, USA
High-speed transmission packaging technology and power packaging technology
Mr. Kazuyuki Nakagawa
Senior Manager, Packaging & Assembly Division，Renesas Electronics Corporation, Japan
QULET：Quantum Chiplet Integration Technology for Superconducting Quantum Computing
Dr. Jiexun YU
Doctoral candidate at School of Integrated Circuits, Tsinghua University，China
Interactive Panel
13:00-13:10 Welcome address
Chair: Prof. Jun Yang, Southeast University
Bridging PCB and Advanced Packaging: Our Journey Toward Package-Aware Design
Mr. Liang JIA
Director in Semiconductor BU, Huatek, China
Advanced Packaging Design & Simulation Solutions and Challenges
Dr. Guangchao Lv
Senior R&D Engineer, National Center for Advanced Packaging Co., Ltd., China
Trends and Industrial Practices of STCO-Driven 3DIC Design Methodology
Dr. Michael Liu
Product Director, Empyrean Technology Co., Ltd, China
14:25-14:35 Tea Break & Networking
Chair: Dr. Michael Liu, Product Director，Empyrean Technology Co., Ltd
Physically Aware Logic Synthesis in the AI Era
Dr. Keren Zhu
Assistant Professor, Fudan University, China
EDA Co-Simulation and Optimization for Structural Reliability Across the Full Chip Lifecycle: Chip Design, Packaging, System Integration, and Reliability Verification
Mr. Jian Cheng
Expert Engineer, JCET, China
Thermal Simulation of Chiplet Heterogeneous Integration System
Prof. Qinzhi Xu
Research Professor, Institute of Microelectronics of Chinese Academy of Sciences, China
15:50-16:20 Panel
Chair: Dr. Qidong WANG, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China
Dr. Kenny YE, Senior Vice President of Piotech, Inc., China
Low Distortion Wafer Bonding Using Programmable Wafer Deflection for Advanced Semiconductor Manufacturing
Dr. Li GONG
General Manager, SUSS MicroTec (Shanghai) LTD
Trends in Bonding Technology Driven by the AI Era
Dr. Haotian Tan
Senior Marketing Strategy Specialist，Wisdom SemiTeC (Jiangsu) Technology Co.,Ltd.
Technology & Fusion, Enabling AI innovation
Mr. Norito Matsumura
Senior Director, Tokyo Electron
Plasma Activation in the Downstream Region of a Surface-Wave-Excited Plasma for Hybrid Bonding
Dr. Yasuhiro Morikawa
Manager, ULVAC, Inc.
The Next 3D Frontier: Equipment Perspectives on D2W Hybrid Bonding Challenges
Mr. Jonathan Abdilla
Director Technology, Besi
Fusion & Hybrid Bonding: Driving Application Performance, Power and Cost by Mixing and Matching Semiconductor Technologies
Mr. Thomas Pleschke
Business Development, EV Group (EVG)
Innovative Equipment Solutions for Advanced Packaging of AI Chips
Mr. Benz ZHAO
CTO, Guangdong iStar Technology Equipment Co., Ltd.(iSTAR), China
16:30-20:00 Invited Reception
20:30-22:30 EPS Cup · Football Game
Chair: Prof. Kouchi ZHANG, Academician of the Netherlands Academy of Engineering，IEEE Fellow
Chair: Prof. Johan LIU, Academician of the Royal Swedish Academy of Engineering Sciences, Sweden, IEEE Fellow
08:30-08:45 Welcome address
Prof. Tianchun YE, Chair of ICEPT, China
Prof. Jeffrey C. Suhling, IEEE EPS President, USA
08:45-09:25 CP Wong Global Electronic Packaging Award–2026
Chair: Prof. Ricky LEE, Hong Kong University of Science and Technology (Guangzhou), China, IEEE Fellow
· Plenary Talk-1：August 6, 09:25-09:55
Stress Sensing Test Chips for Application to Electronics Packaging
· Plenary Talk-2：August 6, 09:55-10:25
Heterogeneous and Hybrid Integration Technologies for the Era of Humanoid Robotics and the Low-Altitude Economy
Prof. Sheng Liu
Academician of CAS, Dean of School of Integrated Circuits, Wuhan University, China, IEEE Fellow
10:25-10:40 Break & Exhibition
· Plenary Talk-3：August 6, 10:40-11:10
Sinterconnects® as a Platform for Double‑Sided‑sintered WBG Power Modules
Dr. Ali Roshanghias
Head of the Research Unit for Heterogeneous Integration Technologies (HIT), Silicon Austria Labs (SAL), Austria
· Plenary Talk-4：August 6, 11:10-11:40
Glass Packaging and Its Reliability
Dr. John H. Lau
· Plenary Talk-5：August 6, 11:40-12:10
Application Practice and Prospect of Advanced Packaging Technology in Intelligent Computing Chip Systems
Prof. Daohong Yang
Director of Yangtze Laboratory, Dean of the School of Integrated Circuits, Hubei University, China
12:10-13:00 Lunch
Holistic Chiplet Packaging Approach
Advanced Packaging Materials Innovation through Co-creative Activities
Mr. Hidenori ABE
CTO for semiconductor materials, Executive director, Electronics Business Headquarters of Resonac, Corporation, Japan
Advanced Packaging Equipment Empowers a New Ecosystem of Heterogeneous Integration
Mr. Fei YU
Director of Marketing, Product & Solution, Beijing NAURA Microelectronics Equipment Co., Ltd., China
Application of Wafer Bonding in Advanced Packaging
Mr. Weijia CAI
CTO, WuShi Microelectronics (Suzhou) Co. Ltd., China
15:30-16:10 Poster Session C
Chair: Prof. Zhiquan LIU, Southern University of Science and Technology, China
Poised for Growth: Meeting the Challenges of Silicon Photonics
Dr. Ruby YAN Vice President for Global Business Center, Guangzhou Zen Semiconductor Corporation, China
Chips Z: 2.5D/3D AI EDA+ Ushering in a New Era of STCO-Driven System-Level Collaboration for Advanced Packaging
Dr. Alex ZHAO
Founder and Chief Scientist, Zhuhai Silicon Chip Technology Ltd., China
Semiconductor Industry – Impact of Wafer Fabrication Equipment and Its Respective Processes and Critical Materials for Advanced Packaging
Dr. Kitty Pearsall
IEEE Fellow，EPS Distinguished Lecturer，EPS Past President
Navigating the Collision of AI, Politics & Engineering Reshaping Electronics Manufacturing!
Dr. Charles E. Bauer
Senior Managing Director, TechLead Corporation, USA
18:30-20:00 Closing Dinner (Invited Only)
Digital Lithography for Advanced Interconnects Toward-Zero-Compromise: Performance & Yield Co-Optimization
Mr. Kazuya Aoki
General Manager, Global Sales Division, Technical Marketing Division and Customer Success Team, AUCC, USHIO INC., Japan
A Review of a Bi-free In-containing Lead-free Mid-temperature Solder
Dr. Hongwen ZHANG
R&D Director and Principal Research Metallurgist, Indium Corporation, USA
Moldex3D Advanced Packaging Molding Analysis Solution and Latest Technological Advancements
Dr. Leo Shen
Deputy Director of R&D Division, CoreTech System Co., Ltd. (Moldex3D), China
Advances in Room-Temperature Surface-Activated Bonding for Heterogeneous Optoelectronic Integration
Prof. Ryo Takigawa Professor, Kyushu University, Japan
Opportunities and Challenges of FOPLP and Electroplating Technologies for Advanced AI Chip Packaging
Mr. Zhaowei JIA
Process Vice President, ACM Research (Shanghai), Inc., China
End-to-End TGV AOI Metrology for Mass Production
Mr. Yang YANG
R&D Director, Shenzhen Hanswell Technology Co., Ltd., China
Advanced Packaging Solutions and Thermo Mechanical Reliability Investigation for High Performance Embedded Power Modules
Dr. Jing ZHANG R&D Director, Heraeus Electronics China
NPO/CPO Optical Engine Packaging in the AI Era: Discussions and Engineering Practices
Dr. Quan CAO
Optical Device Expert, Wuhan Fisilink Microelectronics Technology Co., Ltd., China
Glass Substrates Enable Advanced Semiconductor Packaging: Design Rules for Via-Via Distances Based on Mechanic Reliability
Dr. Martin Letz
Senior Principal Scientist, SCHOTT AG, Germany
15:10-15:50 Poster Session A
Large-Field Projection Lithography: Technical Routes and Industrial Value of Full-Wafer Exposure for Advanced Packaging
Dr. Bo-Fang PENG Founder & Chief Technology Officer，PureChip Technology Co., Ltd., China
Technological Development and Applications of Ultra-Low Loss Fiberglass-Free Film Products in the Era of High-Performance AI Computing
Dr. Yue JIANG
Deputy General Manager, Guangdong EPS Technology Co., Ltd., China
Simulation of Interconnection in Advanced Packaging with COMSOL Multiphysics
Dr. Leming HE
Application Engineer, COMSOL China
Structured Light for Subtle Micro- and Nanomachining of Transparent Materials and Beyond
Dr. Daniel Flamm
Principal Expert, TRUMPF SE + Co. KG, Germany
AI Is Accelerating the Shift to Advanced Packaging with PLP and Glass Cores
Dr. Yik-Yee TAN Principal Market & technology Analyst, Yole Group, France
Electromigration in Microscale Interconnects with a Coexisting Liquid-Solid Solder Matrix
Prof. Wu YUE
Professor and Dean of the School of Materials Engineering, Lanzhou Institute of Technology, China
3D Heterogeneous Integrated DRAM for the Intelligent Era
Dr. Fujun BAI
Senior Director，Xi’an UniIC Semiconductors Co. Ltd
From Solvent Engineering to Intelligent Design and Optimization: A Multiscale Study of Sintered Interconnect Materials
Dr. Pan LIU
Associate Professor; Deputy director, Fudan University; Shanghai Engineering and Technology Research Center of Silicon Carbide Power Devices, China
From Round to Rectangle: NAURA Empowers the Development of Panel-Level Packaging
Mr. Yang WANG
Vice President, General Manager of PLP Business Unit, Beijing NAURA Vacuum Technology Co., Ltd., China
Process Challenges and Failure Analysis of Advanced Packaging Substrates and High-Density Interconnects
Ms. Anna WEI
Laboratory Manager，AT&S (Chongqing) Co., Ltd，China
Mastering 3D-IC Design Challenges Through Advanced Simulation
Mr. Minggang HOU Principal Engineer, Synopsys, USA
Transient Radiation Effects on Packaged Micro-systems
Prof. Guohe ZHANG
Vice Dean and Professor of School of Microelectronics, Xi'an Jiaotong University, China
Failure Mechanism and Reliability Evaluation of Interconnection Structures for SiP
Dr. Ling LI
Deputy Chief Engineer, Xi'an Microelectronics Technology Institute, China
Q-band 4×4 Phased-Array Antenna-in-Package (AiP) for High-Efficiency mmWave NTN Applications
Dr. Li-Cheng SHEN
AVP, Universal Global Scientific Industrial Co., Ltd., Taiwan, China
Advanced Die Attachment Technologies for Power Electronic Packaging
Dr. Li LIU
Marie Skłodowska-Curie Actions (MSCA) Postdoctoral Fellow, Delft of Technology
10:10-10:50 Poster Session B
Research on 10Gbps Space Balanced Photodetector Based on Metallized Fiber Resistance Welding Technology
Ms. Zhen MA
Deputy Director, Manufacturing Center, Academy of Space Electronic Information Technology, Xi'an Branch, China
Process and Material Challenges and Solutions for Ultra-large-scale Chiplet Advanced Packaging
Dr. Hongbin SHI Principal Expert in Electronic Packaging, Awinic Technology Co., Ltd., China
Glass Substrates for Advanced Packaging: Opportunities and Challenges
Dr. Haipeng Zhang Director of R&D，Shandong Linuo Pharmaceutical Packaging Co., Ltd.
Advanced Utilisation of Machine Learning Models for Package Reliability Analysis
Dr. Karsten Meier
Senior Researcher, Assistant Director of Technische Universität Dresden, Germany
Biocompatible Ultrathin Devices Interfacing with Organs
Prof. Zhi JIANG
Professor, Harbin Institute of Technology (Shenzhen), China
Applications and Practices of Ultrasonic Imaging Technology in Quality Control
Dr. Gujin HU
Chief Scientist, Shaoxing Xinjiyuan Electronic Technology Co., Ltd., China
Experiment and Simulation on Mechanical Properties for Electronic Packaging Reliability
Dr. Chuantao HOU
Director, Beijing Institute of Structure and Environment Engineering, China
Packaging Technologies for Smartphone RF Front-End Modules: Technical Challenges and Emerging Trends
Dr. Yue Sun
Senior Wireless Engineer，Xiaomi，China
Chair: Dr. Junsha WANG, ICEP 2026 Technical Program Committee Member, Meisei University, Japan
Dr. Yasuhiro Morikawa, ICEP 2026 General Chair, Technology Manager (Global Technology Sensing Strategy) of ULVAC, Japan
Cu Paste for Bonding Applications in Advanced and Power Semiconductor Devices
Prof. Chuantong CHEN
Professor, Osaka University, Japan
Thin Film Applications via Atomic Layer Deposition (ALD) in Advanced Packaging Processes
Mr. Zihao LI
Process Engineer, Kokusai Electric Corporation, Japan
Composite Materials for Effective Heat Dissipation Application
Mr. Bin XU
Lecturer, University of Tokyo, Japan
Advanced Wafer Temporary Bonding and Debonding Tape Solutions for 3D Packaging
Mr. Weiqiang SHEN
Sales Manager, Sekisui (Shanghai) International Trading Co., Ltd., China
08:30-08:40 Opening Remarks
Co-chair: Dr. Qidong WANG, Director of Packaging and Integration R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, China
Photonic Packaging
Dr. Yik-Yee TAN
Principal Market & technology Analyst, Yole Group, France
Advanced Organic Substrates Enabling Co-package Optics at Scale
Mr. Bula WANG
TDI Director, AT&S, China
Material Technologies Enabling Co-Packaged Optics: Challenges and Solutions in Electronic-Photonic Hybrid Integration
Dr. Yasuharu Murakami
Senior Director of the Research Institute Strategy Department, Resonac Corporation, Japan
Innovative Materials for Next-Gen Package Substrates and Co-Packaged Optics (CPO)
Mr. Habib Hichri
EVP, Senior Fellow, Global Applications and Business Development, Ajinomoto Fine Techno Corporation, USA
9:40-10:15 Panel Discussion
10:15-10:50 Break
10:50-10:55 Session Introduction (Farhang Yazdani & Qidong Wang)
Breaking the Laser Bottleneck: Simplifying Co-Packaged Optics Manufacturing with 60× Fewer DFB Lasers
Mr. Pirooz Hojabri
CEO, IC Photonics
Intelligent Manufacturing Solutions for Advanced CPO, LPO, NPO & OCS
Mr. Alex CAO
G.M. of ficonTEC, China
Challenges and Opportunities on Co-Packaged Optics Thermal-Mechanical Performance Towards High-Volume Ramping
Dr. Shaw Fong Wong
Principal Engineer & Engineering Director，Intel Corporation
11:40-12:20 Panel Discussion
Glass Packaging
Dr. John H LAU
Chief Scientist of Unimicron Technology Corporation, Taiwan, China
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