OVERVIEW OF CONFERENCE PROGRAM：August 5-7th

　

    Note: The information is only for your reference. The final conference schedule shall prevail on the date of conference.

August 5th

Chair:  Dr.Qidong WANG, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China

PDC-1 Room 1: 08:30-10:00

PDC-1 Room 1: 08:30-10:00Advanced Packaging for High Performance Computing

Dr. Daquan YU

Xiamen University, Xiamen Sky Semiconductor Co., Ltd., China                                                                                                                                                                                            

PDC-2 Room 1: 10:20-11:50

Mechanics and Reliability of Lead-Free Solder JointsPDC-7　10:15-11:45

Prof. Jeffrey C. Suhling

Quina Distinguished Professor and Department Chair, Department of Mechanical Engineering, Auburn University, USA                                                                                                                

Chair: Prof. Wei WANG, Peking University, China

PDC-3 Room 1: 13:30-15:00

Analysis of Fracture and Delamination in Microelectronic PackagesPDC-3　13:00-14:30

Prof. Andrew Tay

National University of Singapore

PDC-4 Room 1: 15:20-16:50

PDC-4　10:30-12:00

MEOL design and process consideration for heterogeneous integrated package and substrate

Prof. Gu-Sung Kim

Kangnam University, Yongin, S Korea

Chair: Prof. Nan WANG, Shanghai University, China

PDC-5 Room 2: 08:30-10:00

PDC-6　08:30-10:00Advanced Substrates for Chiplets, Heterogeneous Integration, and Co-Packaged Optics

Dr. John H. LAU

Unimicron Technology Corporation, Taiwan, China                                                                                                                    

PDC-6 Room 2: 10:20-11:50

PDC-2　10:15-11:45Packaging of MEMS and More

Prof. Shuji Tanaka

Department of Robotics, Graduate School of Engineering, Tohoku University, Japan                                                                                

Chair: Prof. Luqiao YIN, Shanghai University, China

PDC-7 Room 2: 13:30-15:00

Innovations in Advanced Packaging TechnologyPDC-5　Room 1: 16:15-17:45

Dr. Wei Koh

Pacrim Technology Irvine, CA, USA                                                                                                           

PDC-8 Room 2: 15:20-16:50

PDC-8 Room 2 15:20-16:50Quantum Mechanics & Molecular Dynamics and Their Applications in Electronic Manufacturing

Prof. Sheng LIU

Dean of the School of Power and Mechanical Engineering and the Institute of Technological Science of Wuhan University



PDC-8 Room 2 15:20-16:50Dr. Yuzheng GUO

Dean of School of Power and Mechanical Engineering, Wuhan University

PDC-9 Room 1: 16:20-17:50

PDC-9Nano Materials and Polymer Composites for Electronic Packaging

Dr. Daniel Lu

Vice President, Henkel Corporation                                                                           

PDC-10 Room 2: 16:20-17:50

PDC-10 Room 2: 16:20-17:50High Reliability Soldering in Semiconductor Packaging

Dr. Ning-Cheng LEE

Founder of ShinePure Hi-Tech, China



August 6th

Chair: Prof. Kouchi ZHANG, Delft University of Technology, Netherlands

Welcome address: Prof. Tianchun YE, Chair of ICEPT

                                Prof. Jianhua ZHANG, Shanghai University

                                Prof. Jeffrey C. Suhling IEEE EPS                                                     

Effects of Aging on the Reliability of Electronic Products Incorporating Lead Free Solders

Prof. Jeffrey C. Suhling

Quina Distinguished Professor and Department Chair, Department of Mechanical Engineering, Auburn University, USA                                           

10:25-10:50

09:55-10:25

Multi Field Cross Scale Collaborative Design Methods and Technologies for Chip Manufacturing and Integration

Prof. Sheng LIU

Academician of CAS, Dean of School of Integrated Circuits, Executive Dean of the Institute of Technological Science, Wuhan University                                                                                                      

10:25-10:50　Tea Break & Networking

From DIP to MIP: 40 years in Semiconductor Packaging

Prof. Kees Beenakker

Delft University of Technology, the Netherlands                                                                                                                                             

zhang

Heterogeneous integration technology with high density bump for silicon-drived microdisplays

Prof. Jane ZHANG

Shanghai University, China

 

Session Talks, August 6th, 13:30-18:40

High Speed Die-to-Die Interface and Chiplet System Design in Advanced Package

Dr. Yu WANG

Sr. Design Manager, KiwiMoore Semiconductor Co., Ltd.                                                                                                                                                                                          

TANThe Synergy of PLP and Glass Core Substrate Supporting the Growing Demands of AI

Dr. Yik-Yee TAN

Principal Market & Technology Analyst, Yole Group                                                                                                                                                                                           

路Research on Failure Mechanism and Reliability Evaluation of TSV-Based 3D Integrated System

Dr. Guoguang LU

Researcher, China Electronic Product Reliability and Environmental Testing Research Institute                                                                                                                                                                                           

PVD Solutions For Advanced Packaging

Prof. Xiaojun ZHANG

Chairman, Arrayed Materials (China) Co., Ltd.                                                                                                                                                                                         

Advanced Material Solution for SiC Power Packaging

Dr. Jing ZHANG

R&D Director of Heraeus Electronics China

                                                                                                                                                                                           

孙鹏Development of Advanced Packaging Technology in NCAP China

Dr. Peng SUN

General Manager, National Centre for Advanced Packaging                                                                                                                                                                                           

钟Modeling and Simulation of Advanced Packaging with COMSOL

Zhenhong ZHONG

Technical Manager, COMSOL China                                                                                                                                                                                         

Low Temperature Bonding Realized by Electrodeposited Cu Microstrucutre Design

Dr. Yunwen WU

Associate Professor, Shanghai Jiao Tong University                                                                                                                                                                                           

蒋The Domestic Development, Research, and Application of IC  Substrate Materials

Dr. Yue JIANG

Deputy General Manager, Guangdong  EPS  Technology Co.,Ltd.                                                                                                                                                                                         

The Study of Warpage and Micro-Structure Measurement with Optical Metrological Technologies in Advanced Packaging Process

Dr. Joonho You

CEO, Nexensor Inc.                                                                                                                                                                                        

OKUNORecently High Bright LED Applications for High Level Lighting, Pant Cultivation of Agriculture, Medical, Virus Sterilization, Mini LED and Micro LED Display

ATSUSHI OKUNO

CEO, Green Planets CO.,LTD.                                                                                                                                                                                          

Advancements in Thermal Management Technologies for SiC Power Module Packaging: A Case Study

Prof. Yunhui MEI

Dean, Tiangong University                                                                                                                                                                                           

Special Session II: Hybrid Bonding Technology
August 7th

Chair: Prof. Johan LIU, Chalmers University of Technology, Sweden

08:30-09:00

08:30-09:00

Recent Advances and Trends in Cu-Cu Hybrid Bonding

Dr. John H. LAU 

Unimicron Technology Corporation, Taiwan, China                                                                                               

09:00-09:30

09:00-09:30Advanced packaging technology for AI and power semiconductors

Prof. Katsuaki Suganuma 

Osaka University, Japan                                                                                                                                       

09:30-10:00

Taku HannaManufacturing Transformation Era: Process Solutions for Wafer and Panel-Level Packaging Driven by Semiconductor Process Technology

Dr. Taku Hanna

ULVAC, Inc., Japan                                                                                                                                      

10:00-10:30

CHETBD

Mr. Scott CHEN

ASE (Advanced Semiconductor Engineering), Taiwan, China

10:30-10:45  Tea Break & Networking

Chair: Prof. Ricky LEE, Hongkong University of Science & Technology, China

10:45-11:15

10:45-11:15Semiconductor Equipment Supply Chain for FEOL Advanced Packaging

Dr. Kitty Pearsall

President of Boss Precision Inc., Independent Consultant, USA                                                            

11:15-11:45

11:15-11:45Low-Temperature Bonding Technology for Heterogeneous Integration and Advances in Sensors and Electronic Devices

Prof. Eiji Higurashi

Tohoku University, Japan

                                                                                       

11:45-12:15

liTBD

Dr. Guorong LI

Vice General Manager of the First Etching Business Unit, NAURA China

12:15-12:30

12:15-12:30The Role of the IEEE Electronics Packaging Society in the Development of Professionals and Students in Electronics Packaging

Prof. Andrew Tay

National University of Singapore                                                                                                                                                                       

ICEP Special Session

Chair: Dr. Junsha WANG, ICEP 2026 Technical Program Committee, Meisei University, Japan

Co-chair: Dr. Yasuhiro Morikawa, ICEP 2026 General Chair, ULVAC Inc., Japan

13:30-14:00

13:30-14:00Surface Activated Room Temperature Bonding for Heterogeneous Photonics Integration

Prof. Ryo Takigawa

Associate Professor, Kyushu University                                                                                                                                                                                          

14:00-14:30

14:00-14:30Polysilazane-mediated Room Temperature Bonding for Electronics Packaging 

Dr. Kai Takeuchi

Assistant Professor, Tohoku University                                                                                                                                                                                  

14:30-15:00

14:30-15:00Acid Copper Plating Process for RDL Interposer

Dr. Yamaguchi Atsuya 

R&D Center, Electronics Development Department, JCU CORPORATION                                                                                                                                                                                   

15:00-15:30

15:00-15:30Application of Magnetic Neutral Loop Discharge Plasma in Deep Etching of Low-CTE Glass Substrate for Co-Packaged Optics

Dr. Yasuhiro Morikawa

Manager, ULVAC, Inc.                                                                                                                                                                                   

Special Session: R10 Regional Interactive Session

Chairs: Dr. Shaw Fong WONG, IEEE EPS R10 Program Chair

Co-chair: Dr. Qian WANG, IEEE EPS Beijing Chapter

16:00-16:05

Greeting

Dr. Qian WANG, EPS Beijing Chapter Chair, Tsinghua University

16:05-16:25

Greeting

Dr. Shaw Fong WONG, IEEE EPS R10 Program Chair

16:25-16:50

gExploring the Correlation Between Post-Die Bond Epoxy Void and Bond Line Thickness and other Factors on Power Packaging with Silver Sintered Epoxy

James Kim

NXP Semiconductors, Malaysia                                                                                                                                                                                   

16:50-17:15

16:05-16:25Thermal and Failure Analysis of Advanced Microelectronic Devices

Prof. Andrew TAY

National University of Singapore                                                                                                                                                                                           

17:15-17:40

17:15-17:40A Novel Expansion Process Using Tape Expansion, Self-Assembly, and Tape Frozen Detachment Technique and Its application to Hybrid Bonding

Shinya Takyu

Assistant General Manager, LINTEC Corporation, Japan                                                                                                                                                              

17:40-18:05

17:40-18:05TBD

Dr. Qidong WANG

Director of Packaging and Integration R&D center of IMECAS, China                                                                                                                                                                                           

Session Talks, August 7th, 13:30-18:40

saraHybrid Copper Bonding: A Key to High-Performance 3D Integration

Prof. Sarah Eunkyung Kim

Seoul National University of Science and Technology                                                                                                                                                                                           

x64 UCIe Chiplets at 32 GT/s on Emerging Silicon Core Substrate and Advanced TIM Cooling

Farhang Yazdani

CEO, BroadPak Corporation                                                                                                                                                                        

Cruise YANGTGV Full-Process AOI Inspection Technology and Solutions

Cruise YANG

R&D Director, Shenzhen HanSuper Precision Measurement Co., Ltd.                                                                                                                                                                                           

Challenges in Advanced Packaging for High Performance Computing

Dr. Cheng YANG

Industry Expert                                                                                                                                                                                          

Thermal Cycle Reliability Challenges and Solutions for SOC Packages in Consumer Electronics

Dr. Hongbin SHI

Principal Expert in Electronic Packaging, Awinic Technology Co., Ltd.                                                                                                                                                                                          

Developments in Glass Core Substrates and Alternatives

E. Jan Vardaman

President, TechSearch International, Inc.                                                                                    

                                                                                           

Damping Property and Vibration Fatigue Lifetime Prediction of Electric Current Stressing Solders

Dr. Wangyun LI

Southwest Jiaotong University                                                                                                                                                                                           

Latest Development toward Universal Scene Adaptation for Hyperspectral Imaging (HSI)

Daiki Nakaya

Founder & CEO, Milk. Inc.                                                                                                                                                                                           

Building an Autonomous Future with AI at The Edge

Dr. Eu Poh Leng

Senior Director of External Package Innovation, NXP Semiconductors                                                                                                                                                                                           

Advanced Utilisation of Machine Learning Models for Package Reliability Analysis

Dr. Karsten Meier

Senior Researcher, Assistant Director, Technische Universität Dresden                                                                                    

                                                                                           

Advanced Packaging Technologies Enabling the AI-Era

Dr. Terry Wu

Deputy General Manager, Payton Technology                                                                                                                                                                                          

POSTER

Q

CONCURRENT EXHIBITION：August 6-7th


LPKF Shanghai Co., Ltd.

Shenzhen Leaderwe Intelligent Co., Ltd.

ShenZhen Like Automation Equipment Co.,Ltd.

Witmem

Vision Engineering Ltd.

Shenzhen Hongxin Microelectronics Technology Co., Ltd.

Ningbo Flexd Electronic Tech

Finetech GmbH & Co. KG

ACM Research (Shanghai), Inc.

GUANGDONG EPS TECHNOLOGY CO., LTD

JIACO Instruments B.V.

Guangdong iStar Technology Equipment Co., Ltd.(iSTAR)

ADVANTEST

Winifred International Technology Ltd.

Shenzhen Fitech Co., Ltd.

Beijing YSHY Technology Co., LTD.

Shanghai Fosen Electronics Co.,Ltd.

K-ANALYSIS INSTRUMENT TRADING (SHANGHAI)CO.LTD

iSABers Group Co., Ltd

COMSOL Co.,Ltd.

ExTripod Electronics Technology Limited

Shenyang Heyan Technology Co.,Ltd

Zhuhai Sichip Technology Co., Ltd.

Jiangsu Leadlap Semiconductor Technology Co., Ltd.

Suzhou Moldex Analysis Software Co PTY LTD

School of Microelectronic,Shanghai University

Beijng NAURA Microelectronics Equipment Co.,Ltd.

Ningbo Shunyu Instruments Co.,Ltd

Suzhou kedou Precision Machinery Co.,Ltd.

Asia Science Technology (Hong Kong) Co., Ltd

Ecelent Technology Suzhou Corp.

Shanghai Suoyu Intelligent Technology Co., Ltd.

Beijing Bizmate Technologies Co., Ltd. 

Shenzhen GuiHua Leser Intelligent Technology Co., Ltd.

Shenzhen HanSuper Precision Measurement Co., Ltd.