Driving the megawatt AI Era: Next-Gen packaging

   Mr. Scott CHEN

   Senior Vice President of Engineering, ASE (Advanced Semiconductor Engineering), Taiwan, China

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Who Should Attend:

Lecturer Biography:

Mr. Scott Chen received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And master’s degree of Executive MBA Program from NTU. He has been worked on each of assy technology, MEMS nsor, bumping, flip chip, advance package technology and SIP solution over 30 yrs.