FILE LINK 

IMPORTANT DATE

Deadline for Submission of Abstract

March 30, 2021

Deadline for Submission of Full Paper

May 30, 2021 

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CONTACT US

School of Electronic Science and Engineering

Dongxue LIANG

0086-0592-2188342

icept2021@xmu.edu.cn

Wen YIN

0086-010-82995675

Conference Registration

Fenghua GAN

0086-021-38953725

faithsh@yeah.net

Juanjuan ZHOU

0086-010-64655241

271617588@qq.com

ABOUT US

The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top four electronic packaging academic conference, which is hosted by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS)、 IEEE Electronics Packaging Society (IEEE-EPS)、Electro...