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2013 International Conference on Electronic Packaging Technology

(ICEPT 2013)

August 11~14, 2013, Dalian, China

The 14th International Conference on Electronic Packaging Technology (ICEPT 2013) will be held in Dalian, China, from August 11 to 14, 2013. The ICEPT 2013 is hosted by Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE) and organized by Dalian University of Technology. As one of the most famous international conferences on electronic packaging technology, the conference has received strong support from IEEE CPMT and active involvement from IMAPS, ASME and iNEMI, and was highly appreciated by Chinese Institute of Electronics and China Association for Science and Technology (CAST).

ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.

We are looking forward to receiving your papers and meeting you at the conference.

CONFERENCE THEMES: Advanced Packaging & System Integration; Packaging Materials & Processes; Packaging Design and Modeling; High Density Substrate & SMT; Advanced Manufacturing Technologies and Packaging Equipment; Quality & Reliability; Solid State Lighting Packaging & Integration; Emerging Technologies etc.

Selected papers will be recommended for publication in IEEE/CPMT journals.

CALL FOR PROFESSIONAL DEVELOPMENT COURSES

The conference program includes professional development courses (PDC), and the leading experts in the field may email icept2013@vip.163.com for details.

CALL FOR EXHIBITION/SPONSORSHIP

A tabletop exhibition featuring suppliers of materials, equipment, components, software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may email to: icept2013@vip.163.com for details.

Guided by

Chinese Institute of Electronics (CIE)

Department of Electronic Information, Ministry of Industry and Information Technology

Department of Higher Education, Ministry of Education

Department of High and New Technology Development and Industrialization, Ministry of Science and Technology

Hosted by

Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE)

IEEE-CPMT

Organized by

Dalian University of Technology (DUT), China

General Chair: Prof. Keyun BI

Technical Chair: Prof. Mingliang Huang, Dr. Yifan Guo

Conference Website: http://www.icept.org

Conference Email: icept2013@vip.163.com