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2012 International Conference on Electronic Packaging Technology

& High Density Packaging (ICEPT-HDP 2012)

13~16, August, 2012, Guilin, China

 

The 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012) will be held in Guilin, China, from August 13 to 16, 2012. The ICEPT-HDP 2012 is organized by Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE) and co-organized by Guilin University of Electronic Technology. As one of the most famous international conferences on electronic packaging technology, the conference has received strong support from IEEE CPMT and active involvement from IMAPS, ASME and iNEMI, and was highly appreciated by China Institute of Electronics and China Association for Science and Technology (CAST).

ICEPT-HDP 2012 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China.

We are looking forward to receiving your papers and meeting you at the conference.

 

 

CONFERENCE THEMES: Advanced Packaging & System Integration; Packaging Materials & Processes; Packaging Design and Modeling; High Density Substrate & SMT; Advanced Manufacturing Technologies and Packaging Equipment; Quality & Reliability; Solid State Lighting Packaging & Integration; Emerging Technologies etc.

 

Selected papers will be recommended for publication in IEEE/CPMT journals.

 

CALL FOR PROFESSIONAL DEVELOPMENT COURSES

The conference program includes professional development courses (PDC), the leading experts in the field may email icept2012@vip.163.com for details.

 

CALL FOR EXHIBITION/SPONSORSHIP

A tabletop exhibition featuring suppliers of materials, equipment, components, software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may email to: faith_epe@shou.net for details.

 

Guided by

Chinese Institute of Electronics (CIE)

Department of Electronic Information, Ministry of Industry and Information Technology

Department of Higher Education, Ministry of Education

Department of High and New Technology Development and Industrialization, Ministry of Science and Technology

Organized by

Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE)

IEEE-CPMT

Co-organized by

Guilin University of Electronic Technology (GUET)

Beijing Faith Consulting Co., Ltd

General Chair: Prof. Keyun BI

Organization Chair: Prof. Kailin PAN

Technical Chair: Prof. Daoguo YANG

Conference Website: http://www.icept.org

Conference Email: icept2012@vip.163.com

 

Electronic Manufacturing and Packaging Technology Society of Chinese Institute of Electronics （CIE-EMPT）
Beijing Office: Room 411,27 Zhichun Road,Haidian Dist.,Beijing,China 100191
Tel:+86-10-82356605 Fax:+86-10-82356605 E-mail:empt-cie@sohu.com
沪ICP备05012209