2013 International Conference on Electronic Packaging Technology
August 11~14, 2013, Dalian, China
The 14th International Conference on Electronic Packaging Technology (ICEPT 2013) will be held in
ICEPT 2013 is a four-day event, featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in
CONFERENCE THEMES: Advanced Packaging & System Integration; Packaging Materials & Processes; Packaging Design and Modeling; High Density Substrate & SMT; Advanced Manufacturing Technologies and Packaging Equipment; Quality & Reliability;
Selected papers will be recommended for publication in IEEE/CPMT journals.
CALL FOR PROFESSIONAL DEVELOPMENT COURSES
The conference program includes professional development courses (PDC), and the leading experts in the field may email email@example.com for details.
CALL FOR EXHIBITION/SPONSORSHIP
A tabletop exhibition featuring suppliers of materials, equipment, components, software, manufacturers, and service providers of the electronics packaging and related industries will be held during the conference. Potential exhibitors and sponsors may email to: firstname.lastname@example.org for details.
Department of Electronic Information, Ministry of Industry and Information Technology
Department of Higher Education, Ministry of Education
Department of High and New Technology Development and Industrialization, Ministry of Science and Technology
Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese
Dalian University of Technology (DUT), China
Technically Sponsored By
General Chair: Prof. Keyun BI
Technical Chair: Prof. Mingliang HUANG, Dr. Yifan GUO
Conference Website: http://www.icept.org
Conference Email: email@example.com