Advanced Packaging Materials Innovation through Co-creative Activities

  Mr. Hidenori ABE 

  CTO for semiconductor materials, Executive director, Electronics Business Headquarters of Resonac   Corporation  

Abstract: 

Title: Advanced Packaging Materials Innovation through Co-creative Activities 

Abstract: Cutting-edge semiconductors, essential for the evolution of AI, are supported by advancements in both equipment and materials technologies. The emergence of chiplet technology in semiconductor packaging has enabled significant performance improvements, while also increasing packaging complexity. This trend has made collaboration between materials manufacturers and equipment suppliers more critical than ever.

Resonac, a co-creative chemical company that provides a variety of semiconductor materials such as CMP slurry, etching gas, materials for HBM, epoxy molding compounds, substrate core materials, and more, is advancing materials technology development through open innovation activities. Resonac has started a Packaging Solution Center to propose one-stop solutions for customers and has established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment, and substrates for 2.xD and 3D packages. Furthermore, in 2025, the company launched the open innovation initiative "US-JOINT" in Silicon Valley, USA, and launched a new co-creation platform, "JOINT3," in Japan to accelerate technology development through co-creation. This presentation will introduce Resonac's co-creation strategies.

Speaker's Biography: 

Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He also led the launch of "US-JOINT" and "JOINT3" in 2025. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.