Advanced Die Attachment Technologies for Power Electronic Packaging

    Dr. Li LIU

    Marie Skłodowska-Curie Actions (MSCA) Postdoctoral Fellow, Delft of Technology

Abstract:

The transition of power electronics towards higher power density, elevated temperature, and wider use of wide-bandgap (WBG) semiconductors has imposed increasingly stringent requirements on packaging materials and structures. The die attachment plays a vital role in WBG power modules, as it serves simultaneously as the thermal transport path, mechanical support, and electrical interconnection between the chip and the substrate. However, conventional die-attach materials and processes are increasingly limited by the risk of device damage during bonding, insufficient high temperature capability, and poor reliability under severe operating conditions.

This presentation will discuss the key scientific and technical issues in advanced die attachment technologies for power electronic packaging, with particular emphasis on interfacial characteristics, process-structure-property relationships, and their effects on joint performance and reliability. On this basis, Dr. Liu’s recent research on advanced die-attach materials and processing strategies will be introduced through her representative study cases. The talk aims to highlight how material design, interfacial engineering, and microstructural regulation can contribute to the development of high-performance and high-reliability die attachment solutions for next-generation power electronics.

Speaker's Biography:

Dr Li Liu is currently a Marie Skłodowska-Curie Actions (MSCA) postdoctoral fellow in the Electronic Components, Technology and Materials (ECTM) group at Delft University of Technology, where she works with Prof. Willem D. van Driel and Prof. Kouqi Zhang. She received her bachelor’s degree from Huazhong University of Science and Technology in 2012 and her Ph.D degree from Loughborough University in 2016. After completing her doctorate, she joined the School of Materials Science and Engineering at Wuhan University of Technology, where she was appointed Lecturer in 2017 and promoted to Associate Professor in 2020.

Her research focuses on power electronic packaging, with particular interests in die attachment technologies, multi-physics reliability modelling, and advanced materials characterisation. She has served as a Principal Investigator for several research projects in the field of electronic packaging. To date, she has co-authored over 80 peer-reviewed journal publications which have received more than 1000 citations, as well as 2 book chapters, and 9 patents. Her current work is mainly concerned with advanced interconnection and packaging technologies for high-reliability power electronic applications.