The Second Wave of PLP for HPC and AI Applications

    Dr. Tanja Braun

    Head of Department, Fraunhofer IZM, Germany   

Abstract:

Fan-out Packaging is one of the largest trends in the last decade with the possibility to scale from fraom wafer to panel level packaging. The talk will review the first wave of Fan-out Panel Level Packaging and why it has not evolved as expected. With a look on current trends and developments, the advantages of FOPLP are considered and put in context with the likely occurrence of a second wave of packaging on panel level especially for very large body size packages for HPC and AI applications.       

Speaker's Biography:

Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin. Tanja Braun is head of the department System Integration and Interconnection Technologies. Recent research is focused on Fan-out Wafer and Panel Level Packaging technologies. In 2021 she received the Exceptional Technical Achievement Award from IEEE Electronics Packaging Society (EPS) and the IMAPS Sidney J. Stein Award for her work in the field of Fan-out Wafer and Panel Level Packaging.

Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and is the IEEE EPS VP of Conferences.