2026 27th International Conference on Electronic Packaging Technology
English
Chinese
SPONSORED BY
ORGANIZED BY
CONTACT US
Meeting Secretary
Xiaoqing WEI(Submit Contact)
18392959178
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
0086-13121110782
0086-010-64655251
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Hongyu QIAO
0086-13772049433
qiaohy@sastc.com.cn
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system:
https://easychair.org/conferences?conf=icept2026
ICEPT-2026 Author's Guide
ICEPT-2026 Abstract Template
All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.
Jan.1–Mar. 20, 2026
Mar. 20, 2026
Apr. 20, 2026
May 20, 2026
Jun. 30, 2026
Aug. 4, 2026
Aug. 5, 2026
Aug. 6-7, 2026
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