2026 27th International Conference on Electronic Packaging Technology
English
Chinese
SPONSORED BY
ORGANIZED BY
CONTACT US
Meeting Secretary
Xiaoqing WEI(Submit Contact)
18392959178
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
0086-13121110782
0086-010-64655251
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Hongyu QIAO
0086-13772049433
qiaohy@sastc.com.cn
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system:
https://easychair.org/conferences?conf=icept2026
ICEPT-2026 Author's Guide
ICEPT-2026 Manuscript Template.doc
2026 Brief guide for authors full paper stage.pdf
All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.
Jan.1–Mar. 20, 2026
Mar. 20, 2026
Mar. 31, 2026
Apr. 23, 2026
May 20, 2026
Jun. 30, 2026
Aug. 4, 2026
Aug. 5, 2026
Aug. 6-7, 2026
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