Hybrid bonding interface Issues

Prof. Liyi LI

Southeast University, China

Abstract: 

The hybrid bonding interface is a composite interface composed of metal and dielectrics. The structure and physical and chemical properties of this interface determine its electrical interconnection performance and reliability. This report will first discuss the metal interface issues, including the preparation methods of the metal interface, and the relationship between grain texture and bonding yield. Secondly, it will discuss the dielectric layer, including the preparation methods of the dielectric layer, and the relationship between molecular structure and bonding strength.

Outline:

(1) Introduction and Category of Hybrid Bonding Interface

(2) Discussion of Metal Pads;

(3) Discussion of Dielectric surface.

Who Should Attend:

3D IC designer, manufacturers, equipment and material vendors and university researchers.

Speaker's Biography:

Dr. Liyi Li is currently a Professor in School of Integrated Circuits, Southeast University. His research interest has been focused on processes, materials and characterization of advanced packaging. He is currently responsibly for chiplet integration research area in Southeast University. He has undertaken key research projects sponsored by NSFC and other national agencies.