TBD

   Prof. Chenxi Wang

   Harbin Institute of Technology                                                                                                           

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Lecturer Biography:

Chenxi Wang a full professor in School of Materials Science and Engineering at Harbin Institute of Technology. He received the Ph.D. at The University of Tokyo in 2009. His research interests focus on wafer bonding, heterogeneous and dissimilar bonding, 3D integration and packaging, and the joining of advanced medical materials. Prof. Wang was awarded the prestigious JSPS Fellowship for Foreign Researchers and participated in the JST-CREST major project. After returning to China, he led three National Natural Science Foundation projects and undertook over 20 provincial and corporate research projects. He has published more than 130 SCI/EI-indexed papers, received seven international conference awards for best paper and presentations, and holds 16 granted patents. Additionally, he has served as a technical committee member of ICEPT. He is a Senior Member of IEEE, and a Senior Member of the Chinese Mechanical Engineering Society. He has been recognized with honors such as the National Award for Outstanding Self-Financed Students Abroad, the Dean’s Award from The University of Tokyo, and the Heilongjiang Provincial Natural Science First Prize. In education, Dr. Wang has won many first prizes in provincial and university-level teaching competitions, led four teaching research projects and co-authored two textbooks.