2.5D and 3D packaging, chiplet, wafer-level/panel-level fan -out and fan-in packaging, flip chip packaging, advanced packaging thermal management, system integration, other heterogeneous integration packaging technologies.

Packaging materials, green/nano packaging materials, high-end packaging substrate, self-alignment and assembly technologies,  other packaging-related semiconductor materials and processes.

Design, modeling, methodology and simulation technologies of complex packaging, cross-scale and multi-physics modeling, process simulation technologies, etc.

TSV, TGV, bumping and micro copper pillar technologies, high density inter-connection technologies, hybrid bonding technologies, nano-materials bonding technologies, chip-to-wafer/panel and wafer-to-wafer interconnect technologies, thermocompression bonding technologies, other new inter-connection technologies.

Manufacturing, Assembly, testing and other automated packaging and testing equipment under the traction of advanced packaging technology, new principle packaging and testing equipment, main or key components and module technology of equipment.

Test technologies for packaging, new reliability experiment technologies, reliability evaluation method, methodologies for reliability data collection and analysis, reliability modeling, life prediction, failure analysis and non-destructive diagnose.

Power electronic packaging related interconnection, thermal management and substrate technology, wide bandgap semiconductor packaging technology, ultra-wide bandgap semiconductor packaging technology, IGBT, SiC, GaN hybrid packaging technology, high voltage packaging technology, high junction temperature packaging technology, multi-functional integrated packaging technology, other power semiconductor packaging technology, switching, isolated/non-isolated power supply, inverter, IPM, POL, PSiP and other power module packaging and integration methods, power module control algorithm, EMI modeling and optimization, Industrial modules and vehicle-scale groups and systems, other new energy and new power electronic modules.

Design, simulation, interconnection, packaging, reliability, and failure analysis technologies for optoelectronic and heterogenous integration within packages, including optical displays, optical communications, optical sensing, lasers, and emerging display technologies.

Interactive Design of RF Integrated Circuits and Packaging, Design of RF Packaging and Modules, RF Heterogeneous Integration Processes, Integration of RF Passive Devices, Thermal Management of RF Devices and Systems, Reliability of RF Packaging, Millimeter Wave/THz packaging, Integration of Antenna and Packaging, Suppression of RF Noise in Packaging, SAW/BAW Resonators, Filter-related Technologies, etc.

Packaging technologies suitable for increasing the bandwidth and scale of large computing power chips, integrated power supply technology for large computing power chips, efficient heat dissipation technology for large computing power chips, brain-computer interfaces, vertical power delivery, packaging and integration of emerging devices, packaging of novel two-dimensional (2D) material-based devices, quantum technologies, MEMS/NEMS packaging, sensor packaging, implantable device packaging, microfluidic 3D printing Packaging, wafer-level and panel-level packaging for MEMS and sensors, wearable/flexible and bioelectronic packaging, etc.

AI/ML-driven design, surrogate modeling, and co-optimization, ML/DL for quality control, process optimization, reliability prediction, and failure analysis, generative AI, digital twin, AI-assisted co-design of chip, package, and system integration. Advanced packaging architectures and technologies (Heterogeneous Integration, 2.5D/3D, Chiplet) for high-performance AI, power delivery, signal integrity, and thermal management for AI systems, system-level solutions, etc.