Advanced Packaging Materials Innovation through Co-creative Activities

  Mr. Hidenori ABE 

  CTO for semiconductor materials, Executive director, Electronics Business Headquarters of Resonac   Corporation 

   Navigating the Collision of AI, Politics & Engineering Reshaping Electronics Manufacturing!

   Charles E. Bauer, Ph.D.

   Senior Managing Director，TechLead Corporation

  Getting ready for the challenges of Silicon Photonics

  Dr. Ruby Yan

  Vice president for global business center, Guangzhou Zen Semiconductor Corporation, China                                                                                                                                      

   Advanced Utilisation of Machine Learning Models for Package Reliability Analysis

   Dr. Karsten Meier 

   Senior Researcher, Assistant Director of Technische Universität Dresden 

   Advanced Die Attachment Technologies for Power Electronic Packaging

   Dr. Li LIU

   Marie Skłodowska-Curie Actions (MSCA) Postdoctoral Fellow, Delft of Technology

  Electromigration in Microscale Interconnects with a Coexisting Liquid-Solid Solder Matrix

  Prof. Wu YUE

  Dean, Lanzhou Institute of Technology, China

  A Review of a Bi-free In-containing Lead-free Mid-temperature Solder

  Hongwen Zhang

  R&D Director and Principal Research Metallurgist，Indium Corporation

   Holistic Chiplet Packaging Approach

   Dr. Tanja Braun

    Head of Department, Fraunhofer IZM

   Application of Wafer Bonding in Advanced Packaging

   Mr. Weijia Cai 

   CTO, WuShi Microelectronics (Suzhou) Co.. Itd.

  The Second Wave of PLP for HPC and AI Applications

   Dr. Tanja Braun

   Head of Department, Fraunhofer IZM                                                                                                                                                                       

   Q-band 4×4 Phased-Array Antenna-in-Package (AiP) for High-Efficiency mmWave NTN Applications

   Dr. Li-Cheng Shen

   AVP, Universal Global Scientific Industrial Co., Ltd.，Taiwan, China