Navigating the Collision of AI, Politics & Engineering Reshaping Electronics Manufacturing!

  Charles E. Bauer, Ph.D.

  Senior Managing Director，TechLead Corporation     

Abstract: 

Signals? Visible. Patterns? Not! Three forces — AI capability, reshoring pressure, and the migration of critical decisions to the software layer — collide in unpredictable ways creating a totally new dynamic in electronics manufacturing unforeseeable when viewing each independently. Not another technology adoption story, but rather, what happens when known vectors produce a competitive environment that didn't exist previously? Machine learning (aka AI) rewrites semiconductor, package and PCB design economics. Reshoring capital forces the automation question onto factory floors. And software drives partitioning, design feedback, process management/optimization, and inspection into arenas never before considered. This disruptive inflection rewards organizations recognizing it early and quietly punishes those who don't. This keynote identifies the inflection point; examines the cost of missing it; and gives practitioners practical tools to understand and analyze where their operations stand, see the patterns, and develop the necessary strategies and tactics to survive."

Speaker's Biography: 

Charles E. Bauer, Ph.D. serves as Senior Managing Director of TechLead Corporation, a technology management company specializing in the electronics packaging, interconnection and assembly industry. Dr. Bauer focuses in the areas of strategic technology planning, market analysis and business development, particularly in the international arena. Recent foci include an emphasis on medical device applications, technological innovation and education to enhance quality of life.

Combining applications experience in implantable, surgical and diagnostic medical devices with extensive background in design and manufacturing, Dr. Bauer presents a balanced perspective between technology and practical implementation for real world products. With more than 40 years’ experience spanning the range from complex interconnection technologies (printed circuit boards, hybrid and IC metallization and fabrication) through sophisticated packaging (multichip modules, system in package, 3D packaging, chiplet architectures) and assembly (die attach, wire bonding, flip chip, hybrid bonding, nano assembly, etc.) as well as nano-technology applications in electronics manufacturing, his publications exceed 280 papers, articles and columns.  He lectures throughout the world on technology, business and market topics as well as serving on several corporate boards and international corporate, government and educational institution advisory councils.

A Senior Member of IEEE, he remains active in the SMTA, JIEP, ASM and IMAPS Europe as well.  Dr. Bauer served on the Boards of both the SMTA and IMAPS and as President of IMAPS in 2001-2002.  Awards received include Tektronix Technical Innovation Award, Fellow of IMAPS, the International Leadership Award and Founder’s Award from the SMTA, Jesuit High School Hall of Fame, University of Portland Significant 75 Alumni and SMTA 25th Anniversary Luminary as founder of the Pan Pacific Microelectronics Sy.