Qidong WANG  Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences

Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSC degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. 

Xiuzhen LU Ph.D. Shanghai University

Xiuzhen Lu obtained her Ph.D. from the Institute of Semiconductors of the Chinese Academy of Sciences. Currently, she serves as Deputy Dean at the School of Microelectronics, Shanghai University. She has successively presided over various projects, including those funded by the National Natural Science Foundation of China, the Sixth Framework Programme of the European Union, and key projects of Shanghai Municipal Science and Technology Commission. Her research primarily focuses on advanced packaging technology and reliability, thermal management materials and properties for electronic devices, and Micro-LED device integration. 

Fei XIAO Professor of Fudan University

Associate Professor and Professor at the Department of Materials Science, Fudan University; 2000.3-2000.12 Visiting scholar at the National Science Foundation Coatings Research Center at the University of East Michigan in the United States; 2005.1-2006.11 Visiting scholar at the Electronic Packaging Research Center of the National Science Foundation of Georgia Institute of Technology in the United States. The main research directions are electronic packaging materials, processes and reliability, and organic optoelectronic materials.

Yong LIU  Chief Engineer of Fairchild, USA

Dr. Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015.

Rong SUN  Professor and Director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences, Director of the Center for Advanced Electronic Materials at SIAT, Dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT

Rong Sun is the director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). She is also the founding dean of Shenzhen Institute of Advanced Electronic Materials. She is doctoral supervisor, senior member of IEEE, State Council special allowance expert, and was selected as top 2% global scientists released by Stanford University in 2021.

Scott CHEN Sr. VP of Central Development Engineering in ASE (Advanced Semiconductor Engineering)

Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs. 

Jian CAI  Professor of Tsinghua University

Graduated from the Department of Materials Science at Tsinghua University in July 1998 with a PhD in Engineering, as a postdoctoral researcher at the Hong Kong University of Science and Technology from 1999 to 2001, mainly engaging in the development and research of flip chip packaging technology; From 2001 to 2002, worked in technical research and development at Shenzhen Meilongxiang Company, leading the development of enhanced heat dissipation solder ball array packaging substrates; I have been working at the Institute of Microelectronics at Tsinghua University since 2002.

Yun-Hui MEI Professor of School of Electrical Engineering, Tiangong University

Mei Yunhui is a professor and executive dean of the School of Electrical Engineering, Tiangong University. He has long been engaged in the research of power electronic device packaging and reliability. In recent years, he has presided over more than 30 projects, including the national science foundation of China (NSFC) outstanding youth fund project, the Tianjin municipal distinguish youth fund project, the national defense project, aviation fund, Huawei, Azure Automobile, Huichuan Technology, etc. He has also participated in the key projects of the National Fund, 863 projects. He is the director of the China Power Supply Society, deputy director of the Component Committee, deputy director of the Expert Advisory Committee, IEEE Senior Member, editorial board member of the Journal of Power Supply, deputy director of the Tianjin Power Supply Society, etc.

Wei  WANG  Permanent Professor, Doctoral Supervisor of Peking University

In 1999, he received Doctor's degree from the School of Aeronautics and Astronautics, Tsinghua University, the tutor of Academician Zengyuan.  After that, he joined the Department of Micro/Nano Electronics and the National Key Laboratory of Micro/Nano Processing Technology in the School of Information Science and Technology, Peking University.  Now he is the Executive Deputy Director of the National Key Laboratory of Micro/Nano Processing Technology and the Deputy Director of the Department of Micro/Nano Electronics, Peking University.  Director, Institute of Integrated Micro/Nano Systems (MEMS), Peking University. 

Kai ZHAO  Director of Design, Simulation & Testing Huatian Technology (JiangSu) Co. Ltd.

Zhao Kai，Ph.D. in Microelectronics and Solid-State Electronics from Peking University, Professor, Director of Design Simulation and Testing Technology at Huatian Technology (Jiangsu) Co., Ltd. His research focuses on 2.5D advanced packaging technology and multiphysics co-design and simulation. He has successively presided over national scientific research projects such as the National Key R&D Program and the National Natural Science Foundation. He has published more than 40 papers and applied for more than ten patents.

Tao HANG  Full Professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University

He has worked in the University of Michigan (US), Waseda University (Japan), and Northwestern University (US) as the visiting scholar and postdoctoral fellow for 5 years. Currently, he is a full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University. His research interest mainly focused 3D packaging materials and technology (interconnection, low temperature bonding), nanostructured materials and functional thin films fabricated by electrochemical method (electrodeposition, electro-grafting, electrochemical-etching). 

Zhiquan LIU  Group Leader in Shenzhen Institute of Advanced Technology (SIAT) Chinese Academy of Sciences (CAS), Doctoral Supervisor of University of Chinese Academy of Sciences (UCAS)

Technology (SIAT) Chinese Academy of Sciences (CAS), and a Doctoral Supervisor of University of Chinese Academy of Sciences (UCAS). After graduated with PhD in April 2000, he worked in Japan for more than seven years, and then returned China as a Hundred Talent Scholar of CAS. His research expertise spans across property related microstructure characterization and phase transformation, focusing on microstructure and reliability of microelectronic interconnect materials. 

Fengman LIU  Professor of Institute of Microelectronics of Chinese Academy of Sciences（CAS）,China

Fengman Liu received the Ph.D.degree in Microelectronics and Solid-State Electronics from the Institute of Semiconductor of CAS. His research interests include System in Packaging，Wafer level packaging and optoelectronics hybrid integration. Prof. Fengman Liu has led and joined a number of research projects, including the National Key R&D Program of China, NSFC funding and and projects from enterprises. he has published over 60 papers ,hold over 30 patents and co-authored one book.

Tonglong ZHANG Sr Expert Hisilicon 

Tonglong Zhang has 28 years of IC packaging experience. He worked at companies at various position in the semiconductor supplier chain including design house, OSAT and IDM. He has worked on design, stress and thermal, process and material development and reliability assessment. He has developed various IC packaging technologies including fine pitch cu pillar flipchip csp, large size flipchip package, 2.5D package etc. He have 10 US patents and several Chinese patents on IC packaging. 

Pei CHEN

Beijing University of Technology

Yongjun HUO Ph.D. Beijing Institute of Technology, School of Materials Science and Engineering

Deputy director of Engineering Research Center of Highly Reliable Electronic PackagingMaterials for Extreme Environment, Ministry of Education, ChinaDeputy director of M aterials and Manufacturing Engineering Department in BlTMember ofCommittee of instructors for Students innovation and Entrepreneurship of SM SE:.Member of Steering Committee of Undergraduate Education; Member of OversightCommittee of Undergraduate Education Extensive research experience in electronic packaging materials, electronic packagingtechnology under extreme environment, more than 50 high-quality papers, published inreputable journals, incuding Scripta Materialia, MSEA and JMR&T, more than 30 papers asthe first or corresponding author.

Shuying MA Senior Engineer of Huatian Technology (Kunshan) Electronics Co.,Ltd.

Dr. Shuying Ma, Senior Engineer, National Special Support Program for High level Talents, Jiangsu Province 333 High Level Talents, Jiangsu Province Double innovation Talents, Jiangsu Province Young Double innovation Talents, First level Shortage Talents in Suzhou, Industry Professor of Nanjing University. Dr. Ma, CTO of Huatian Kunshan, has rich experience in advanced packaging development and mass production, familiar with advanced packaging technologies such as WLP, Bumping, TSV, Fanout, 2.5D/3D, etc. He has established the Huatian HmaTrix advanced packaging technology platform, led the development of 12 inch embedded silicon Fanout packaging technology, 12 inch automotive image sensor wafer level packaging technology, Panel level Fanout packaging technology, 2.5D/3D eSinC technology and other advanced packaging technologies. 

Leida CHEN

Xi'an Institute of Microelectronics Technology

Yu ZHANG  Associate Professor,  Master Supervisor of Guangdong University of Technology

In January 2016, ZHANG graduated from Shenzhen Institute of Advanced Technology, University of Chinese Academy of Sciences as Ph.D. , core member of "State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment Jointly Built by the Ministry of Education" and "Key Laboratory of Microelectronic Precision Manufacturing Technology and Equipment", and Class A talents introduced by the University's "100 Young Talents Program".He is mainly engaged in the research and development of advanced semiconductor packaging technologies and key materials such as microelectronics and power electronics, including micro-nano metal materials, flexible printed electronics, high-density three-dimensional interconnection technology and key materials.

Zhiwen CHEN Associate Professor of Wuhan University

Master's and Doctoral Supervisors of Industrial Science Research Institute of Wuhan University, and teacher of Academician Liu Sheng's Research Group, mainly engaged in research on the mechanics and simulation of advanced packaging materials for chips. In the past five years, Chen has published 43 academic papers, obtained 6 invention patents (including 1 US patent), 2 PCTs, and 1 software copyright. 

Xiaofeng YANG  Chief Engineer of China Electronic Product Reliability and Environmental Testing Research Institute (China CEPREI Laboratory）

Xiaofeng YANG, received his M.Sc. and Ph.D. degrees from Xiamen University, Xiamen, China, in 2016 and 2020. Currently, he is a Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT. His main research interests include advanced packaging reliability technology, thermal-mechanial reliability, advanced sensing technology and flexible electronics. 

Fei QIN  Professor of Beijing University of Technology

Director of the Institute of Electronic Packaging Technology and Reliability at Beijing Institute of Technology. He has been engaged in research on microelectronic packaging technology and reliability for a long time, and has formed his own characteristics in this field. In 2018, he officially established the Institute of Electronic Packaging Technology and Reliability. Hosted over 30 projects including the National Natural Science Foundation of China and major national projects, and published over 200 papers in core journals and academic conferences at home and abroad, including over 80 journal papers and over 100 conference papers.

Huaiyu YE  Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech)

Prof. Huaiyu Ye, has received BS degree in Shanghai Jiao Tong University, China, MA degree and Ph.D. degree in Delft University of Technology, the Netherlands (TUDelft). Currently, he is Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech). He has worked in Materials innovation institute (M2i) and Netherlands Organisation for Applied Scientific Research (TNO) in Europe. He has also worked in Chongqing University as Senior Researcher from 2016 to 2019. He is the committee member of the IEEE International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power Electronics Committee of the Chinese Electrical Engineering Society, and ICEPT, CSEE, EuroSimE, China SSL & IFWS. 

Zhaozheng HOU  Director of the Technology and Platform Strategy Dept., Huawei Digital Power Technologies Co., Ltd.

joined Huawei in 2007, led the creation of digital control chip, power package, and power component teams. He Developed multiple products with a shipment of xx million to xx billion PCS. Since 2022, he has served as the director of Huawei's Digital Power Technology and Platform Planning Dept, responsible for the planning and development of three generations of technologies in the fields of new-type power systems, AI, and energy storage. At the same time, he is a member of the (ICEPT) Power Packaging Technology Committee, a member of the Component Professional Committee of the China Power Supply Society, and a corporate mentor of many universities. Now he has more than 60 domestic and foreign patents.

Harbin Institute of Technology

Lianqiao YANG Doctor Researcher of Advanced Display and System Applications, Ministry of Education, Shanghai University

Her current research interests include advanced packaging and thermal management of opto-electronics devices, development of advanced materials and their application in optoelectronics. She has undertaken more than 10 projects, including the National Key Research and Development Program of China, National Natural Science Foundation, Shanghai Natural Science Foundation, etc., and got support from Huawei Terminal Display and Kunshan Guangyang Chemistry (2 million+). So far, more than 50 journal articles have been published, and over 20 invention patents have been authorized.

Haohui LONG Ph.D. Huawei

Dr. Haohui Long (Fellow IET, Fellow IES, SM IEEE)  is currently the Huawei Scientist, Chief Reliability Expert, He provided his service as the TC member of IEEE EPTC, ICEPT, the chair of "Advanced optoelectronics & Displays" tech committee of IEEE EPTC, chair of "Heterogeneous and Hybrid Integration" of IEEE IFETC (2022) conference, co-chair of "Advanced Packaging" and "Optoelectronics and New Display" two sessions of IEEE ICEPT (2022) conference with publishing around 40 Journal& international conference papers, and holding around 160 granted and pending US/WO/JP/PCT/CN/EP patents, including 30 US patents in LENS database.

Kelaiti XIAO Ph.D. Shanghai Institute of Microsystems, CAS

As a senior expert in the field of electronic packaging, he graduated from Tsinghua University with a bachelor's degree in Materials Science and Engineering, and later obtained a doctoral degree from the Shanghai Institute of Microsystems, Chinese Academy of Sciences.He has held technical development and management positions in well-known companies such as Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., Intel, RFMD, etc., and has formed technical and operational teams multiple times. He has also published multiple packaging technology papers and related patents.

Jintang SHANG  Professor of Southeast University

From 2008 to 2009, as a visiting scholar, he went to the Microsystem Packaging Research Center at Georgia Institute of Technology in the United States. Currently, he is a professor and doctoral supervisor at the School of Electronic Science and Engineering, Southeast University. Main research interests include the manufacturing and packaging of microelectronic mechanical systems (MEMS), biological and nanomanufacturing and packaging, integrated circuit (IC) system integration packaging technology, and advanced packaging materials for microelectronic systems.

Jian CUI

Peking University

Nan WANG Professor of School of Microelectronics, Shanghai University

Nan Wang received his B.Eng. (Hons.) and Ph.D. degrees from the Department of Electrical and Computer Engineering, National University of Singapore (NUS), Singapore, in 2009 and 2013, respectively. From 2013 to 2022, he has been a scientist at the Institute of Microelectronics (IME), A*STAR (Agency for Science, Technology and Research), Singapore, where was a principal investigator and the RF-MEMS team lead in the Sensors, Actuators, and Microsystems (SAM) Program. From 2022, he is a professor and the lead of the MEMS research team at the School of Microelectronics, Shanghai University, Shanghai, China. 

Yue SUN Ph.D. Xiaomi Communications Co., Ltd.

Dr. Yue Sun is currently employed in the Smartphone Department of Xiaomi Communications Co., Ltd., focusing on the customization and application of RF front-end devices. He earned his doctorate from Delft University of Technology in 2022. His research involves GaAs HBT and GaN HEMT processes, the reliability and application of RF power amplifiers, and the design of RF chip packaging. Dr. Sun has authored several technical papers, innovatively developed an extremely low-leakage GaN mesa manufacturing technology for high-power RF devices, and presented the first L-band GaN-based RF power limiter. Furthermore, he has written a review paper on RF devices that has been cited over 100 times. During his master's studies, he focused on board-level and wafer-level fan-out packaging, including transmission line design and packaging reliability.

The School of Microelectronics, Guangzhou International Campus of South China University of Technology

Zhiwen CHEN

The Institute of Technological Sciences, Wuhan University

Rongfu CAI

FASTPRINT

Yanwei DAI

Beijing University of Technology

Jun LI

R&D Center for System Packaging and Integration, Institute of Microelectronics of The Chinese Academy of Sciences

Taijun LIU

Faculty of Electrical Engineering and Computer Science, Ningbo University

Xiuping LI

School of Integrated Circuits, Beijing University of Posts and Telecommunications

Jing JIANG

Sky Chip Interconnection Technology Co., Ltd.

Bo SUN

School of Integrated Circuits, Guangdong University of Technology

Yun WANG

School of Microelectronics, Fudan University

Bin XIA

School of Integrated Circuits, Shanghai Jiaotong University

Jie XU

School of Information Science and Engineering, Southeast University

Anding ZHU

University College of Dublin

Yao ZHU

Institute of Microelectronics, A*STAR, Singapore

Meng ZHANG

Faculty of Integrated Circuit, Xidian University

Zhen CUI

Qualcomm

Yulong ZHANG

School of Instrument and Electronics, North University of China

Yanhong TIAN  Tenured Professor at the Harbin Institute of Technology, Vice director of the State Key Laboratory of Advanced Welding and Joining

Dr. Yanhong Tian is currently a Tenured Professor at the Harbin Institute of Technology and the vice director of the State Key Laboratory of Advanced Welding and Joining. She is a National High-level Talent, received the Excellent Young Scientists Fund of the National Natural Science Foundation of China, and the Funding of New Century Excellent Talents from the Ministry of Education of China. Her research interests are advanced packaging technology and reliability, flexible printed electronic materials and devices.

Daquan YU  Distinguished Professor of Xiamen University, Founder of Xiamen Sky Semiconductor Co., Ltd

Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the founder of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. Before that, he was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 200 peer-reviewed technical publications and holds more than 70 patents.