Qidong WANG  Director of Packaging and Integration R&D Center at the Institute of Microelectronics of the Chinese Academy of Sciences

Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSC degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. Dr. Wang has served ICEPT as session chair nearly 10 years,  as technical chair since 2023-present.

Li GENG  Professor and Dean of School of Microelectronics, Xi'an Jiaotong University

Li Geng, Professor and Doctoral Supervisor at Xi'an Jiaotong University, serves as Dean of the School of Microelectronics and Director of the Institute of Micro/Nano Electronics and System Integration. Her research areas cover the design of analog-digital mixed-signal and radio frequency integrated circuits, including power management chips, low-power ADCs, power amplifiers, LNAs, biomedical chips, special chips for clean energy, and new micro/nano electronic devices.She has been awarded the K.C. Wong Education Foundation Award for Educators, the title of Distinguished Teacher of Xi'an Jiaotong University, and is a candidate for the provincial-level Distinguished Teacher reserve.

Chaoqun SHA  General Manager of Haiguang Information Technology Co., Ltd. 

Master of Engineering from Beijing Institute of Technology, professor-level senior engineer. Chinese nationality, no permanent right of abode abroad. From January 2011 to April 2020, he successively served as the vice president and senior vice president of Sugon Technology. Since December 2019, he has been the general manager of Haiguang Information Technology Co., Ltd., and is currently the director and general manager of the company.

Xiaowu ZHANG  Principal Scientist and PI at Institute of Microelectronics, A*STAR, Singapore

Zhang Xiaowu is best known for his pioneering work on 2.5D/3D IC integration and has received several significant awards, including “2015 IEEE CPMT Exceptional Technical Achievement Award” for his major contributions in 2.5/3D IC integration and “2017 FloTHERM® ΔTJ Award” for his excellence in electronics thermal design. He is an elected IEEE Fellow.

Xiaoguang XU  VP of BOE, CEO of BOE Sensor and Solution Business

Dr. Xu Xiaoguang joined BOE in 2009 and currently oversees the strategic planning and business operations of BOE Sensor and Solution Business. Prior to this role, he served as the Head of the Technology Strategy and Global Cooperation Center, the Chief Strategy Officer (CSO) of BOE, and the Chief Technology Officer (CTO) of BOE.

Fei XIAO  Professor at Fudan University

Professor at the Department of Materials Science, Fudan University; 2000.3-2000.12 Visiting scholar at the National Science Foundation Coatings Research Center at the University of East Michigan in the United States; 2005.1-2006.11 Visiting scholar at the Electronic Packaging Research Center of the National Science Foundation of Georgia Institute of Technology in the United States. The main research directions are electronic packaging materials, processes and reliability, and organic optoelectronic materials. Prof. Xiao has served ICEPT as session chair or technical co-chair more than 20 years, he was served as technical chair and organized ICEPT 2018 in Shanghai.

Yong LIU  Technical Expert of ONSEMI

Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015.

Rong SUN  Professor and Director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences, Director of the Center for Advanced Electronic Materials at SIAT, Dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT

Rong Sun is the director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). She is also the founding dean of Shenzhen Institute of Advanced Electronic Materials. She is doctoral supervisor, senior member of IEEE, State Council special allowance expert, and was selected as top 2% global scientists released by Stanford University in 2021.

Jian CAI  Professor at Tsinghua University

Jian CAI raduated from the Department of Materials Science at Tsinghua University in July 1998 with a PhD in Engineering, as a postdoctoral researcher at the Hong Kong University of Science and Technology from 1999 to 2001, mainly engaging in the development and research of flip chip packaging technology; From 2001 to 2002, worked in technical research and development at Shenzhen Meilongxiang Company, leading the development of enhanced heat dissipation solder ball array packaging substrates; I have been working at the Institute of Microelectronics at Tsinghua University since 2002. Prof. Cai has served ICEPT nearly 20 years, he was given an 'ICEPT Outstanding Contribution Award' in 2024.

Yanhong TIAN  Tenured Professor at the Harbin Institute of Technology, Vice director of the State Key Laboratory of Advanced Welding and Joining

Yanhong Tian, Tenured Class II Professor at Harbin Institute of Technology, National High-level Talent. Her research focuses on integrated circuit chip packaging and reliability, as well as flexible and wearable sensors and energy storage devices. She is the principal investigator of major projects funded by the National Natural Science Foundation of China, key R&D programs of the Ministry of Science and Technology, and multiple industry collaboration projects. She serves as Chair of the Micro/Nano Joining Subcommittee of the International Institute of Welding (IIW), Member of the Reliability Committee and the Semiconductor and Integration Committee of the Chinese Institute of Electronics, Member of the Welding Committee of the Chinese Mechanical Engineering Society, and Editorial Board Member of academic journals including Electron.

Shaoxi  WANG  Vice Dean and Professor of the School of Microelectronics, Northwestern Polytechnical University

He once worked in the R&D Department of Bookham Asia Pacific; has five years of R&D experience in Canada; and served as Deputy Director of the Investment Promotion Bureau of Xi'an Economic and Technological Development Zone.His main research focuses on microelectronic reliability, bio-microelectronics and integrated circuit design. He has presided over more than 20 scientific research projects, including the 173 Key Project, military pre-research projects, National Natural Science Foundation projects, Shaanxi Key R&D Program projects, and municipal-level projects, with a total research fund of more than 30 million RMB. He has published nearly 100 academic papers at home and abroad (including more than 40 SCI-indexed papers), and serves as an editorial board member and reviewer for more than 10 domestic and foreign academic journals. He has applied for more than 20 invention patents, among which the transformation of scientific and technological achievements has reached 2.4 million RMB, and has published 4 academic monographs.

Scott CHEN  Sr. VP of Central Development Engineering in ASE (Advanced Semiconductor Engineering)

Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs. 

Jianhua ZhANG  Vice President of Shanghai University

Ph.D. Supervisor, National Leading Talent, Winner of the First Shanghai Outstanding Talent AwardChair of SID Beijing Chapter; Editor-in-Chief of Moore and More (newly launched) & SCI-indexed Advance in Manufacturing Her research covers microelectronics, new displays and advanced manufacturing (applied basic research, tech development, innovation & achievement transformation). She has published in top journals, holds 100+ authorized invention patents (multiple achievements commercialized), and won 3 Shanghai Science and Technology First Prizes (2014, 2016, 2020) plus other national honors. With over a decade of service at ICEPT, she chaired the “Optoelectronic Packaging” Subcommittee (2018–2023), served as Technical Co-Chair (2024–present) and Conference Chair (2025).

Yunhui MEI  Dean of the school of science and technology, Executive Vice President of School of Electrical Engineering Tiangong University

Yunhui Mei  is a professor and executive dean of the School of Electrical Engineering, Tiangong University. He has long been engaged in the research of power electronic device packaging and reliability. In recent years, he has presided over more than 30 projects, including the national science foundation of China (NSFC) outstanding youth fund project, the Tianjin municipal distinguish youth fund project, the national defense project, aviation fund, Huawei, Azure Automobile, Huichuan Technology, etc. He has also participated in the key projects of the National Fund, 863 projects. He is the director of the China Power Supply Society, deputy director of the Component Committee, deputy director of the Expert Advisory Committee, IEEE Senior Member, editorial board member of the Journal of Power Supply, deputy director of the Tianjin Power Supply Society, etc.

Kai ZHAO  Director of Design, Simulation and Testing Huatian Technology (Jiangsu) Co., Ltd.

Zhao Kai，Ph.D. in Microelectronics and Solid-State Electronics from Peking University, Professor, Director of Design Simulation and Testing Technology at Huatian Technology (Jiangsu) Co., Ltd. His research focuses on 2.5D advanced packaging technology and multiphysics co-design and simulation. He has successively presided over national scientific research projects such as the National Key R&D Program and the National Natural Science Foundation. He has published more than 40 papers and applied for more than ten patents.

Wei WANG  Permanent Professor and Doctoral Supervisor of Peking University

In 1999, he received Doctor's degree from the School of Aeronautics and Astronautics, Tsinghua University, the tutor of Academician Zengyuan.  After that, he joined the Department of Micro/Nano Electronics and the National Key Laboratory of Micro/Nano Processing Technology in the School of Information Science and Technology, Peking University.  Now he is the Executive Deputy Director of the National Key Laboratory of Micro/Nano Processing Technology and the Deputy Director of the Department of Micro/Nano Electronics, Peking University.  Director, Institute of Integrated Micro/Nano Systems (MEMS), Peking University. 

Zhiquan LIU  Professor at Southern University of Science and Technology

After graduated with PhD in April 2000, he worked in Japan for more than seven years, and then returned China as a Hundred Talent Scholar of CAS. His research expertise spans across property related microstructure characterization and phase transformation, focusing on microstructure and reliability of microelectronic interconnect materials. 

Tao HANG  Full Professor at Shanghai Jiao Tong University,Vice Dean of the School of Materials Science and Engineering and Director of the Institute of Electronic Materials and Technology

He has worked in the University of Michigan (US), Waseda University (Japan), and Northwestern University (US) as the visiting scholar and postdoctoral fellow for 5 years. Currently, he is a full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University. His research interest mainly focused 3D packaging materials and technology (interconnection, low temperature bonding), nanostructured materials and functional thin films fabricated by electrochemical method (electrodeposition, electro-grafting, electrochemical-etching). 

Tonglong ZHANG  Sr Expert Hisilicon 

Tonglong Zhang has 28 years of IC packaging experience. He worked at companies at various position in the semiconductor supplier chain including design house, OSAT and IDM. He has worked on design, stress and thermal, process and material development and reliability assessment. He has developed various IC packaging technologies including fine pitch cu pillar flipchip csp, large size flipchip package, 2.5D package etc. He have 10 US patents and several Chinese patents on IC packaging. 

Fengman LIU  Researcher at the Institute of Microelectronics, Chinese Academy of Sciences（CAS）, China

Fengman Liu received the Ph.D.degree in Microelectronics and Solid-State Electronics from the Institute of Semiconductor of CAS. His research interests include System in Packaging，Wafer level packaging and optoelectronics hybrid integration. Prof. Fengman Liu has led and joined a number of research projects, including the National Key R&D Program of China, NSFC funding and and projects from enterprises. he has published over 60 papers ,hold over 30 patents and co-authored one book.

Pei CHEN

Beijing University of Technology

Shuying MA  Dean of Advanced Packaging Research Institute, Huatian Technology

Dr. Shuying Ma, Senior Engineer, National Special Support Program for High level Talents, Jiangsu Province 333 High Level Talents, Jiangsu Province Double innovation Talents, Jiangsu Province Young Double innovation Talents, First level Shortage Talents in Suzhou, Industry Professor of Nanjing University. Dr. Ma, CTO of Huatian Kunshan, has rich experience in advanced packaging development and mass production, familiar with advanced packaging technologies such as WLP, Bumping, TSV, Fanout, 2.5D/3D, etc. He has established the Huatian HmaTrix advanced packaging technology platform, led the development of 12 inch embedded silicon Fanout packaging technology, 12 inch automotive image sensor wafer level packaging technology, Panel level Fanout packaging technology, 2.5D/3D eSinC technology and other advanced packaging technologies. 

Yongjun HUO  Tenured Associate Professor and Doctoral Supervisor at School of Materials Science and Engineering, Beijing Institute of Technology

Deputy director of Engineering Research Center of Highly Reliable Electronic PackagingMaterials for Extreme Environment, Ministry of Education, ChinaDeputy director of M aterials and Manufacturing Engineering Department in BlTMember ofCommittee of instructors for Students innovation and Entrepreneurship of SM SE:.Member of Steering Committee of Undergraduate Education; Member of OversightCommittee of Undergraduate Education Extensive research experience in electronic packaging materials, electronic packagingtechnology under extreme environment, more than 50 high-quality papers, published inreputable journals, incuding Scripta Materialia, MSEA and JMR&T, more than 30 papers asthe first or corresponding author.

Leida CHEN

Xi'an Institute of Microelectronics Technology

Zhiwen CHEN  Associate Professor at Wuhan University

Master's and Doctoral Supervisors of Industrial Science Research Institute of Wuhan University, and teacher of Academician Liu Sheng's Research Group, mainly engaged in research on the mechanics and simulation of advanced packaging materials for chips. In the past five years, Chen has published 43 academic papers, obtained 6 invention patents (including 1 US patent), 2 PCTs, and 1 software copyright. 

Yu ZHANG  Professor and Doctoral Supervisor of Guangdong University of Technology

In January 2016, ZHANG graduated from Shenzhen Institute of Advanced Technology, University of Chinese Academy of Sciences as Ph.D. , core member of "State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment Jointly Built by the Ministry of Education" and "Key Laboratory of Microelectronic Precision Manufacturing Technology and Equipment", and Class A talents introduced by the University's "100 Young Talents Program".He is mainly engaged in the research and development of advanced semiconductor packaging technologies and key materials such as microelectronics and power electronics, including micro-nano metal materials, flexible printed electronics, high-density three-dimensional interconnection technology and key materials.

Fei QIN  Professor at Beijing University of Technology

Director of the Institute of Electronic Packaging Technology and Reliability at Beijing Institute of Technology. He has been engaged in research on microelectronic packaging technology and reliability for a long time, and has formed his own characteristics in this field. In 2018, he officially established the Institute of Electronic Packaging Technology and Reliability. Hosted over 30 projects including the National Natural Science Foundation of China and major national projects, and published over 200 papers in core journals and academic conferences at home and abroad, including over 80 journal papers and over 100 conference papers.

Xiaofeng YANG  Chief Engineer of China Electronic Product Reliability and Environmental Testing Research Institute (China CEPREI Laboratory）

Xiaofeng YANG, received his M.Sc. and Ph.D. degrees from Xiamen University, Xiamen, China, in 2016 and 2020. Currently, he is a Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT. His main research interests include advanced packaging reliability technology, thermal-mechanial reliability, advanced sensing technology and flexible electronics. 

Zhaozheng HOU  Director of the Technology and Platform Strategy Dept., Huawei Digital Power Technologies Co., Ltd.

Zhaozheng HOU joined Huawei in 2007, led the creation of digital control chip, power package, and power component teams. He Developed multiple products with a shipment of xx million to xx billion PCS. Since 2022, he has served as the director of Huawei's Digital Power Technology and Platform Planning Dept, responsible for the planning and development of three generations of technologies in the fields of new-type power systems, AI, and energy storage. At the same time, he is a member of the (ICEPT) Power Packaging Technology Committee, a member of the Component Professional Committee of the China Power Supply Society, and a corporate mentor of many universities. Now he has more than 60 domestic and foreign patents.

Huaiyu YE  Associate Professor at Southern University of Science and Technology (SUSTech)

Prof. Huaiyu Ye, has received BS degree in Shanghai Jiao Tong University, China, MA degree and Ph.D. degree in Delft University of Technology, the Netherlands (TUDelft). Currently, he is Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech). He has worked in Materials innovation institute (M2i) and Netherlands Organisation for Applied Scientific Research (TNO) in Europe. He has also worked in Chongqing University as Senior Researcher from 2016 to 2019. He is the committee member of the IEEE International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power Electronics Committee of the Chinese Electrical Engineering Society, and ICEPT, CSEE, EuroSimE, China SSL & IFWS. 

Haohui LONG  Deputy Director, Institute of Advanced Packaging and Integrated Systems, School of Integrated Circuits, Shanghai Jiao Tong University

Dr. Haohui Long (Fellow IET, Fellow IES, SM IEEE), He provided his service as the TC member of IEEE EPTC, ICEPT, the chair of “Advanced optoelectronics & Displays” tech committee of IEEE EPTC, chair of "Heterogeneous and Hybrid Integration" of IEEE IFETC (2022) conference, co-chair of “Advanced Packaging” and “Optoelectronics and New Display” two sessions of IEEE ICEPT (2022) conference with publishing around 40 Journal& international conference papers, and holding around 160 granted and pending US/WO/JP/PCT/CN/EP patents, including 30 US patents in LENS database. Also, he is Huawei Postdoctoral Mentor and Associate Editor for the "Moore and More" Journal. His current research interests include Heterogeneous Integration, HiSID (Heterogeneous Integration System in Display), Chip& package level reliability, and display module reliability focused on foldable and flexible, MicroLED; Design for Reliability and Failure Analysis.

Lianqiao YANG  Doctor Researcher of Advanced Display and System Applications, Ministry of Education, Shanghai University

Her current research interests include advanced packaging and thermal management of opto-electronics devices, development of advanced materials and their application in optoelectronics. She has undertaken more than 10 projects, including the National Key Research and Development Program of China, National Natural Science Foundation, Shanghai Natural Science Foundation, etc., and got support from Huawei Terminal Display and Kunshan Guangyang Chemistry (2 million+). So far, more than 50 journal articles have been published, and over 20 invention patents have been authorized.

Yue SUN  Xiaomi Communications Co., Ltd; Senior Hardware Engineer; Ph.D

Dr. Yue Sun earned his Ph.D. in Microelectronics from Delft University of Technology in the Netherlands. He is currently a Senior RF Device Expert at Xiaomi, where he leads research on RF front-end technology, focusing on device design, module packaging, and reliability. He also served as the founding Chair of the RF Session at the 2025 IEEE ICEPT Conference and has published several SCI papers in top-tier journals and conferences, including IEEE IEDM, TED, and APL.

Dr. Sun has achieved multiple innovations in mobile RF devices. In 2025, as a co-first author, he presented the world’s first paper on a low-voltage silicon-based GaN power amplifier for mobile phones at the International Electron Devices Meeting (IEDM 2025), creating notable impact across the industry. His Master’s research focused on board-level and wafer-level fan-out packaging, emphasizing design and reliability for millimeter-wave chips.

Nan WANG  Professor at School of Microelectronics, Shanghai University

Nan Wang received his B.Eng. (Hons.) and Ph.D. degrees from the Department of Electrical and Computer Engineering, National University of Singapore (NUS), Singapore, in 2009 and 2013, respectively. From 2013 to 2022, he has been a scientist at the Institute of Microelectronics (IME), A*STAR (Agency for Science, Technology and Research), Singapore, where was a principal investigator and the RF-MEMS team lead in the Sensors, Actuators, and Microsystems (SAM) Program. From 2022, he is a professor and the lead of the MEMS research team at the School of Microelectronics, Shanghai University, Shanghai, China. 

South China University of Technology

Zhiwen CHEN

The Institute of Technological Sciences, Wuhan University

Zhen CUI

Qualcomm

Jun LI

R&D Center for System Packaging and Integration, Institute of Microelectronics of The Chinese Academy of Sciences

Taijun LIU

Faculty of Electrical Engineering and Computer Science, Ningbo University

Xiuping LI

Beijing University of Posts and Telecommunications

Bo SUN

Guangdong University of Technology

Yun WANG

Fudan University

Bin XIA

Shanghai Jiaotong University

Jie XU

Southeast University

Yao ZHU

Institute of Microelectronics, A*STAR, Singapore

Meng ZHANG

Faculty of Integrated Circuit, Xidian University

Yulong ZHANG

North University of China

Daquan YU  Distinguished Professor at Xiamen University, Founder of Xiamen Sky Semiconductor Co., Ltd

Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the founder of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. Before that, he was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 200 peer-reviewed technical publications and holds more than 70 patents. 

Yanhong TIAN  Tenured Professor at the Harbin Institute of Technology, Vice director of the State Key Laboratory of Advanced Welding and Joining

Dr. Yanhong Tian is currently a Tenured Professor at the Harbin Institute of Technology and the vice director of the State Key Laboratory of Advanced Welding and Joining. She is a National High-level Talent, received the Excellent Young Scientists Fund of the National Natural Science Foundation of China, and the Funding of New Century Excellent Talents from the Ministry of Education of China. Her research interests are advanced packaging technology and reliability, flexible printed electronic materials and devices.

Jian CUI

Peking University

Hongbin SUN  Vice Dean of the School of Artificial Intelligence, Xi'an Jiaotong University

His current research interests cover embedded vision, autonomous intelligent systems and intelligent chips. He has published many papers in top-tier academic conferences and journals in AI and integrated circuits, with 4 papers winning Best Paper Awards or nominations. He holds over 40 national invention patents and has received a host of prestigious honors, including the Second-Class National Technological Invention Award, First-Class National Teaching Achievement Award, First-Class Shaanxi Provincial Natural Science Award, First-Class Natural Science Award of the Chinese Association of Automation, and the Qiushi Outstanding Young Scholar Award in AI Science and Education.

Yang HU  Associate Professor in the School of Integrated Circuits at Tsinghua University

Dr. Hu now works on high-performance AI chip architecture and compilation tools. Dr. Hu is an NSF CAREER Awardee. He has published more than 50 papers in computer architecture conferences and journals such as ISCA, HPCA, ASPLOS, MICRO, SC, DAC, ICS, RTAS, ICPP, ICCD, IEEE-TCAD, IEEE-TC, and IEEE-TPDS. His research work has won Best Paper Nomination of HPCA in 2017 and 2018. He received the Best of IEEE Computer Architecture Letters Award in 2015. He is an Associate Editor of Elsevier Chip Journal. He served as TPC track chair of DAC, and TPC member of HPCA, DAC, IWQoS, ISPASS, ICPP, ICDCS, IPDPS, and etc.. He served as NSF panelists and external reviewer of Hongkong Research Grant Council. He also served as session chair of HPCA 2022 and registration chair of ICS 2018.