Honorary Chair |
| Keyun BI Honorary President of Packaging Branch, CSIA Branch of China Semiconductor Industry Association Professor and doctoral supervisor. He worked successively at the 13th Research Institute of the Ministry of Electronics, the Ministry of Information Industry, and the China Academy of Electronic Science.He served as the director of the research institute and the director of the Military Industry Foundation Institute. |
General Chair |
| Tianchun YE President of Academy of Integrated Circuit, Chinese Academy of Sciences, President of IC branch of China Semiconductor Industry Association, Secretary General of China Integrated Circuit Innovation Alliance Professor Ye Tianchun has engaged in studies on IC fabrication technology, novel devices and micro-fabrication for a long time. As subject principal and key backbone, he has completed a dozen of research subjects, which are supported by the 7th-10th“Five-Year National Key Technologies R&D Programme”, the National Climbing Project,“863”project,“973 Program”and project of Knowledge Innovation Program of the Chinese Academy of Sciences. Several achievements on deep submicron and nano-fabrication, UHF compound semiconductor and devices stand at the leading position at home or achieve international advanced level.
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Executive Chair |
| Jianhua ZHANG Professor of Shanghai University
Jianhua Zhang is the Professor and PhD Supervisor of Shanghai University. She won the National Science Fund for Distinguished Young Scholars, and the National “Ten Thousand Talents Program” for Young and Middle-Aged Scientific and Technological Innovation Leaders in 2018. She was supported by the Yangtze River Scholar Program in 2019 and the first Shanghai Outstanding Talent Award in 2024. She serves as the Chairman of the Beijing Executive Committee of the Society for Information Display (SID) and the Editor-in-Chief of the newly established high-profile journal, Moore and More. Her research focus on applied basic research, engineering technology development, and collaborative innovation and achievement transformation in the fields of new displays, microelectronics, and advanced manufacturing. She has published over 200 academic papers and been granted more than 170 invention patents. |
Co-chairs |
| KITTY PEARSALL Former-President of IEEE EPS Kitty Pearsall received the BS degree in Metallurgical Engineering and her MS and PhD degrees in Mechanical Engineering and Materials from the University of Texas. Across my 41-year career at IBM, I was appointed to strategic roles and received multiple awards. Retired, IBM Distinguished Engineer in Integrated Supply Chain since 2000 - 2013
Emeritus Member of the IBM Academy of Technology Implemented global cross-brand, cross commodity processes/products Many IBM Outstanding Technical Achievement Awards; 12 US patents; and 8 published disclosures Numerous internal IBM publications as well as 22 external publications |
| Kouchi ZHANG Professor Academician of the Dutch Academy of Engineering, IEEE Fellow Prof. Kouchi ZHANG is a Chair Professor with the Department of Microelectronics, Delft University of Technology. He had been with Philips for 20 years as Principal Scientist, Technology Domain Manager, Senior Director of Technology Strategy, and Philips Research Fellow, until 2013. He is the co-chair of advisor board of International SSL Alliance (ISA); secretary general of IEEE 'International Technology Roadmap of Wide bandgap semiconductors' (ITRW). |
| Johan LIU Professor of Shanghai University, China Prof. of Chalmers University of Science & Technology, Sweden Member of Royal Swedish Academy of Engineering, Sweden Dr. Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently a special recruited professor at Shanghai University, China (short term) and a professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden. |
| Xuejun FAN Professor of Lamar University, USA Prof. Xuejun Fan is a Regents’ Professor of Texas State University System, and a Mary Ann and Lawrence E. Faust Endowed Professor at Lamar University, Beaumont, Texas. Dr. Fan is an IEEE Fellow, and an IEEE Distinguished Lecturer. He currently serves as a member-at-large of the IEEE Electronic Packaging Society (EPS) Board of Governors. Dr. Fan gained significant experience in the microelectronics industry between 1997 and 2007, at IME, Philips and Intel. |
| Sheng LIU Academician of CAS Prof. Sheng Liu is the dean of the School of Power and Mechanical Engineering and the Institute of Technological Science of Wuhan University. He is the National Science Fund for Distinguished Young Scholars (Type B), Yangtze River Scholar Distinguished Professor, ASME Fellow, IEEE Fellow, and as a professionalism in the area of the “863 program” of the National High Technology Research and Development Program. |
| Liqiang CAO Deputy Director of Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China Research Interests : System Level Packaging and 3D Integration. Now Deputy Director and professor of Institute of microelectronics, Chinese Academy of Sciences. As the project leader and technical backbone, he has participated in 8 national scientific research projects, including major national science and technology projects and key projects of National Natural Science Foundation of China. |
| S. W. Ricky LEE Dean of Systems Hub, Hong Kong University of Science and Technology (Guangzhou) China Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute for two and a half years. Currently Dr Lee is Chair Professor of Mechanical & Aerospace Engineering Department at HKUST and Dean of Systems Hub at the HKUST Guangzhou Campus. |
Secretary |
Wen YIN | Institute of Microelectronics of Chinese Academy of Sciences, China |
Janey SHI | Beijing Herogees Consulting Company |