Xiuzhen LU Ph.D. Shanghai University

Xiuzhen Lu obtained her Ph.D. from the Institute of Semiconductors of the Chinese Academy of Sciences. Currently, she serves as Deputy Dean at the School of Microelectronics, Shanghai University. She has successively presided over various projects, including those funded by the National Natural Science Foundation of China, the Sixth Framework Programme of the European Union, and key projects of Shanghai Municipal Science and Technology Commission. Her research primarily focuses on advanced packaging technology and reliability, thermal management materials and properties for electronic devices, and Micro-LED device integration. 

Institute of Microelectronics of Chinese Academy of Sciences, China

Lei SHI   Chairman and President of TongFu Microelectronics Co., Ltd.

PhD from Fudan University, Senior Engineer, State Council Special Allowance Expert, National Thousand Talents Plan Expert, and Innovative Leading Talent of the Ministry of Science and Technology.  The current Chairman and President of TongFu Microelectronics Co., Ltd., Director of National Enterprise Technology Center, Director of Jiangsu Province Advanced Packaging and Testing Key Laboratory, and Dean of Tongfu Microelectronics Research Institute. He also serves as the Executive Vice Chairman of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Alliance, Vice Chairman of the China Semiconductor Industry Association, Current Chairman of the Packaging and Testing Branch of the China Semiconductor Industry Association, Evaluation Expert of the National Science and Technology Major Project 02 Special Professional Group, Jiangsu Province Second Industry Professor, and Industry Professor at Nanjing University of Posts and Telecommunications and Nantong University.

Li ZHENG  CEO of JCET Group

Mr. Zheng Li is a member of the board of directors and Chief Executive Officer at JCET Group Co., Ltd.  JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly and final test. 

Ming LI  Professor of Shanghai Jiao Tong University

Graduated from Northeastern University with a bachelor's or master's degree and stayed on as a teacher. In 1999, he obtained a Ph.D. in Engineering from Kyushu University of Technology in Japan. From 1998 to 2003, he served as the Chief Researcher and Technical Director at Mitsui High tech Company (MHT) in Japan, mainly engaged in the design and research and development of electronic packaging technology and packaging materials.

Tim CHEN  General Manager of Yan Tai Darbond Technology Co., Ltd.

Tim CHEN,  National level overseas high-level expert, member of the Advisory Committee of the National Integrated Circuit Material Industry Technology Innovation Strategy Alliance, director and member of the Expert Advisory Committee of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategy Alliance, has undertaken the National Science and Technology Major Project "Research and Industrialization of Bottom Filling Materials for Low k Inverted Core TCB Process" (02 Project), Hosted the National Key R&D Program project "Application Research on Underfill Materials for Narrow Gap Large Size Chip Packaging".

Zhiyi XIAO  General Manager of Huatian Technology(Kunshan) Co., Ltd.

Leading talents in the "Double Innovation Team" in Jiangsu Province and the "Double Innovation Team" in Kunshan City, as well as "Jiangsu Science and Technology Entrepreneurs". Vice Chairman of China Semiconductor Industry Association, President of Kunshan Semiconductor Industry Association, and Expert of Jiangsu Province High end Equipment Expert Database.

Bin ZHOU  Research Professor Deputy Chief Engineer of Key Laboratory in the 5th Electronics Research Institute of the Ministry of Industry and Information Technology

Dr. Bin Zhou is the deputy chief engineer of the national key laboratory, He was named an provincial excellent middle-aged and youth and outstanding scientific and technological worker of the Chinese Institute of Electronics. Dr. Bin Zhou is the expert of Science and Technology department of Guangdong province and the deputy to Guangzhou people’s congress, he is also the member of the standards committee of China Materials and Test Team. His main research interest lies in the area of Advanced packaging, microsystem reliability and microelectronic device thermal management. 

Shu'an DU  Hygon Package Design Department Manager

Shu'an DU, Hygon package design department manager, senior professional title of the Chinese Academy of Sciences. 17 years package design experience, responsible for Hygon CPU/DCU package design and Chiplet package Architecture methodology building, finished all Hygon CPU/DCU packaging designs so far, authorized more than 40 patents in this field, and applied for 3 international patents.

Luqiao YIN Researcher of Shanghai University 

At present, the main research work includes: micro LED micro display/power device advanced packaging, package thermal management, failure analysis, etc. He has presided over more than 10 projects of the National Natural Science Foundation of China, the Shanghai Municipal Science and Technology Commission/Economic and Information Commission, and more than 10 enterprise horizontal projects, and participated in the national key projects, the "Twelfth Five-Year Plan" National Science and Technology Support Reliability Project, and the national "973" major basic research project as a core personnel. 

Wenhui ZHU  Professor of Central South University

Prof. Wenhui Zhu is professor with Central South University, China and Founder of Changsha AMQ Intelligent Technology Pte Ltd. He was elected as National Elite Talent. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He was Chief Scientist of 973 program on IC wafer level 3D integration, and has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon and UTAC.

Jingbin LI Dean of the College of Mechanical and Electrical Engineering, Shihezi University

Leading figure in the field of agricultural engineering. He is council member of the Chinese Society of Agricultural Engineering, Animal Husbandry Engineering Branch of China Agricultural Engineering Society, Agricultural Society of Xinjiang Uygur Autonomous Region, and a committee member of the Agricultural Mechanization Branch of the Chinese Society of Agricultural Machinery. His research interests are developing and applying the key technologies and equipment for the mechanical production of Xinjiang specialty crops, key technologies and equipment for livestock breeding, and image acquisition and processing systems.

Mingliang HUANG  Professor of Dalian University of Technology

Prof. Dr. Mingliang Huang, Head of Laboratory for Electronic Packaging Materials, Dean of School of Materials Science & Engineering of Dalian University of Technology, Dalian, China. Experts in the national plan for ten thousand people, Young and Middle-aged talents in Science and Technology Innovation of the Ministry of Science and Technology, Humboldt Fellow. Research interest focuses on the advanced interconnection technology and materials in electronic packaging.

Dr. Chengqiang CUI  Professor of Guangdong University of Technology

Professor of Guangdong University of Technology （GDUT）and CEO of Guang Dong FoZhiXin microelectronics Technology Research Co.Ltd.  He received his PhD in Chemistry from the University of Essex (ESSEX) in 1991, bachelor's and master's degrees in Department of Chemical Engineering , Tianjin University in 1983 and 1985, respectively. He has hosted various national R&D projects including national 02 project and 863 project. He has almost 30 years’ experience in the development and production of microelectronic advanced packaging technology and materials, especially, high-density packaging substrates. 

Yifan GUO Co-Founder of Shanghai Yibu Semiconductor Co., Ltd.

Guo obtained a Ph.D. in Engineering Science in the United States in 1988. Afterwards, Guo worked for many years at globally renowned high-tech companies such as IBM, Motorola, Skyworks, and ASE. Dr. Guo obtained a Master of Business Administration (MBA) degree in the United States in 2005 and currently serves as the Executive Vice President of Yibu Semiconductor Co., Ltd.

Dr. Hongwei LIANG  Executive Vice-President of School of Microelectronics, Dalian University of Technology

Professor Hongwei Liang, Vice Dean of School of Microelectronics, Dalian University of Technology, Director of Dalian Key Laboratory of Wide Bandgap Semiconductor Device Integration and System. He received his Ph.D. from Chinese Academy of Sciences. He is currently a member of the Nuclear Electronics and Nuclear Detection Technology Branch of the Chinese Institute of Electronics and a member of the Young Scientists Club, and a special expert of the Expert Committee of the Talent Reserve Base of the Integrated Circuit Branch of the China Semiconductor Industry Association.