CONFERENCE ORGANIZERS

Sponsored by  

Institute of Microelectronics, Chinese Academy of Sciences 

Xi'an Jiaotong University

IEEE Electronics Packaging Society (IEEE EPS)

Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)  

Organized by

School of Microelectronics, Xi'an Jiaotong University

Shaanxi Semiconductor Industry Association

Beijing Herogees Consulting Company

National Center for Advanced Packaging Co., Ltd. (NCAP China) 

Co-Organized by  

Xidian University

Northwestern Polytechnical University

IEEE Electronics Packaging Society (IEEE EPS) , Beijing Branch

Shennan Circuits Co., Ltd.

China Electronic Product Reliability and Environmental Testing Research Institute (China CEPREI Laboratory）
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