CONFERENCE ORGANIZERS
Sponsored by  

Institute of Microelectronics, Chinese Academy of Sciences

Shanghai University

IEEE Electronics Packaging Society (IEEE EPS)  

Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)  

Organized by
School of Microelectronics, Shanghai University(Shanghai School Microelectronic Industries

National Center for Advanced Packaging Co., Ltd. (NCAP China) 

Beijing Herogees Consulting Company
Co-Organized by  

IEEE Electronics Packaging Society (IEEE EPS) , Beijing Branch

Key Laboratory of Advanced Display and System Applications Ministry of Education

Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle
Shanghai Integrated Circuit and New Display Materials Engineering Research Center
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