Qidong WANG  Director of Packaging and Integration R&D Center at the Institute of Microelectronics of the Chinese Academy of Sciences

Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSC degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. Dr. Wang has served ICEPT as session chair nearly 10 years,  as technical chair since 2023-present.

Xin CHENG  Professor and Executive Dean of College of Semiconductors (National Graduate College for Engineers), Southern University of Science and Technology

Prof. Cheng received his Ph.D. in Electrical Engineering from the University of Michigan in 2005. He previously served as Assistant Professor and Associate Professor in the Department of Electrical and Computer Engineering at Texas A&M University. Since 2013, he has been a Professor in the Department of Materials Science and Engineering at the Southern University of Science and Technology (SUSTech), and was appointed Executive Dean of SUSTech' s College of Semiconductor (National Graduate College of Engineers) in 2024. His research and teaching focus on semiconductor materials, devices, and micro/nanofabrication, with expertise spanning semiconductor lithography, nanomanufacturing, microfluidic chips, and MEMS sensors. He has led over 10 major research projects, including the National Natural Science Foundation of China' s Major Research Instrumentation Development Program and Guangdong Provincial Key R&D Initiatives, alongside 20+ industry collaborative R&D projects. Several of these initiatives have driven technology transfer and commercialization, spawning innovative startups. Dr. Cheng' s honors include the NSF CAREER Award, DARPA Young Faculty Award, Shenzhen Municipal Government Special Allowance, and recognition as a "Pengcheng Scholar" in Shenzhen.

Chaoqun SHA  General Manager of Haiguang Information Technology Co., Ltd. 

Master of Engineering from Beijing Institute of Technology, professor-level senior engineer. Chinese nationality, no permanent right of abode abroad. From January 2011 to April 2020, he successively served as the vice president and senior vice president of Sugon Technology. Since December 2019, he has been the general manager of Haiguang Information Technology Co., Ltd., and is currently the director and general manager of the company.

Xiaowu ZHANG  Principal Scientist and PI at Institute of Microelectronics, A*STAR, Singapore

Zhang Xiaowu is best known for his pioneering work on 2.5D/3D IC integration and has received several significant awards, including "2015 IEEE CPMT Exceptional Technical Achievement Award" for his major contributions in 2.5/3D IC integration and "2017 FloTHERM® ΔTJ Award" for his excellence in electronics thermal design. He is an elected IEEE Fellow.

Xiaoguang XU  VP of BOE, CEO of BOE Sensor and Solution Business

Dr. Xu Xiaoguang joined BOE in 2009 and currently oversees the strategic planning and business operations of BOE Sensor and Solution Business. Prior to this role, he served as the Head of the Technology Strategy and Global Cooperation Center, the Chief Strategy Officer (CSO) of BOE, and the Chief Technology Officer (CTO) of BOE.

Fei XIAO  Professor at Fudan University

Professor at the Department of Materials Science, Fudan University; 2000.3-2000.12 Visiting scholar at the National Science Foundation Coatings Research Center at the University of East Michigan in the United States; 2005.1-2006.11 Visiting scholar at the Electronic Packaging Research Center of the National Science Foundation of Georgia Institute of Technology in the United States. The main research directions are electronic packaging materials, processes and reliability, and organic optoelectronic materials. Prof. Xiao has served ICEPT as session chair or technical co-chair more than 20 years, he was served as technical chair and organized ICEPT 2018 in Shanghai.

Yong LIU  Technical Expert of ONSEMI

Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015.

Rong SUN  Professor and Director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences, Director of the Center for Advanced Electronic Materials at SIAT, Dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT

Rong Sun is the director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). She is also the founding dean of Shenzhen Institute of Advanced Electronic Materials. She is doctoral supervisor, senior member of IEEE, State Council special allowance expert, and was selected as top 2% global scientists released by Stanford University in 2021.

Jian CAI  Professor at Tsinghua University

Jian CAI raduated from the Department of Materials Science at Tsinghua University in July 1998 with a PhD in Engineering, as a postdoctoral researcher at the Hong Kong University of Science and Technology from 1999 to 2001, mainly engaging in the development and research of flip chip packaging technology; From 2001 to 2002, worked in technical research and development at Shenzhen Meilongxiang Company, leading the development of enhanced heat dissipation solder ball array packaging substrates; I have been working at the Institute of Microelectronics at Tsinghua University since 2002. Prof. Cai has served ICEPT nearly 20 years, he was given an 'ICEPT Outstanding Contribution Award' in 2024.

Yanhong TIAN  Tenured Professor at the Harbin Institute of Technology, Vice director of the State Key Laboratory of Advanced Welding and Joining

Yanhong Tian, Tenured Class II Professor at Harbin Institute of Technology, National High-level Talent. Her research focuses on integrated circuit chip packaging and reliability, as well as flexible and wearable sensors and energy storage devices. She is the principal investigator of major projects funded by the National Natural Science Foundation of China, key R&D programs of the Ministry of Science and Technology, and multiple industry collaboration projects. She serves as Chair of the Micro/Nano Joining Subcommittee of the International Institute of Welding (IIW), Member of the Reliability Committee and the Semiconductor and Integration Committee of the Chinese Institute of Electronics, Member of the Welding Committee of the Chinese Mechanical Engineering Society, and Editorial Board Member of academic journals including Electron.

Shaoxi  WANG  Vice Dean and Professor of the School of Microelectronics, Northwestern Polytechnical University

He once worked in the R&D Department of Bookham Asia Pacific; has five years of R&D experience in Canada; and served as Deputy Director of the Investment Promotion Bureau of Xi'an Economic and Technological Development Zone.His main research focuses on microelectronic reliability, bio-microelectronics and integrated circuit design. He has presided over more than 20 scientific research projects, including the 173 Key Project, military pre-research projects, National Natural Science Foundation projects, Shaanxi Key R&D Program projects, and municipal-level projects, with a total research fund of more than 30 million RMB. He has published nearly 100 academic papers at home and abroad (including more than 40 SCI-indexed papers), and serves as an editorial board member and reviewer for more than 10 domestic and foreign academic journals. He has applied for more than 20 invention patents, among which the transformation of scientific and technological achievements has reached 2.4 million RMB, and has published 4 academic monographs.

Scott CHEN  Sr. VP of Central Development Engineering in ASE (Advanced Semiconductor Engineering)

Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs. 

Jianhua ZhANG  Vice President of Shanghai University

Ph.D. Supervisor, National Leading Talent, Winner of the First Shanghai Outstanding Talent AwardChair of SID Beijing Chapter; Editor-in-Chief of Moore and More (newly launched) & SCI-indexed Advance in Manufacturing Her research covers microelectronics, new displays and advanced manufacturing (applied basic research, tech development, innovation & achievement transformation). She has published in top journals, holds 100+ authorized invention patents (multiple achievements commercialized), and won 3 Shanghai Science and Technology First Prizes (2014, 2016, 2020) plus other national honors. With over a decade of service at ICEPT, she chaired the “Optoelectronic Packaging” Subcommittee (2018–2023), served as Technical Co-Chair (2024–present) and Conference Chair (2025).

Yunhui MEI  Dean of the school of science and technology, Executive Vice President of School of Electrical Engineering Tiangong University

Yunhui Mei  is a professor and executive dean of the School of Electrical Engineering, Tiangong University. He has long been engaged in the research of power electronic device packaging and reliability. In recent years, he has presided over more than 30 projects, including the national science foundation of China (NSFC) outstanding youth fund project, the Tianjin municipal distinguish youth fund project, the national defense project, aviation fund, Huawei, Azure Automobile, Huichuan Technology, etc. He has also participated in the key projects of the National Fund, 863 projects. He is the director of the China Power Supply Society, deputy director of the Component Committee, deputy director of the Expert Advisory Committee, IEEE Senior Member, editorial board member of the Journal of Power Supply, deputy director of the Tianjin Power Supply Society, etc.

Wei WANG  Permanent Professor and Doctoral Supervisor of Peking University

In 1999, he received Doctor's degree from the School of Aeronautics and Astronautics, Tsinghua University, the tutor of Academician Zengyuan.  After that, he joined the Department of Micro/Nano Electronics and the National Key Laboratory of Micro/Nano Processing Technology in the School of Information Science and Technology, Peking University.  Now he is the Executive Deputy Director of the National Key Laboratory of Micro/Nano Processing Technology and the Deputy Director of the Department of Micro/Nano Electronics, Peking University.  Director, Institute of Integrated Micro/Nano Systems (MEMS), Peking University. 

Kai ZHAO  Director of Design, Simulation and Testing Huatian Technology (Jiangsu) Co., Ltd.

Zhao Kai，Ph.D. in Microelectronics and Solid-State Electronics from Peking University, Professor, Director of Design Simulation and Testing Technology at Huatian Technology (Jiangsu) Co., Ltd. His research focuses on 2.5D advanced packaging technology and multiphysics co-design and simulation. He has successively presided over national scientific research projects such as the National Key R&D Program and the National Natural Science Foundation. He has published more than 40 papers and applied for more than ten patents.

Tao HANG  Full Professor at Shanghai Jiao Tong University,Vice Dean of the School of Materials Science and Engineering and Director of the Institute of Electronic Materials and Technology

He has worked in the University of Michigan (US), Waseda University (Japan), and Northwestern University (US) as the visiting scholar and postdoctoral fellow for 5 years. Currently, he is a full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University. His research interest mainly focused 3D packaging materials and technology (interconnection, low temperature bonding), nanostructured materials and functional thin films fabricated by electrochemical method (electrodeposition, electro-grafting, electrochemical-etching). 

Zhiquan LIU  Professor at Southern University of Science and Technology

After graduated with PhD in April 2000, he worked in Japan for more than seven years, and then returned China as a Hundred Talent Scholar of CAS. His research expertise spans across property related microstructure characterization and phase transformation, focusing on microstructure and reliability of microelectronic interconnect materials. 

Fengman LIU  Researcher at the Institute of Microelectronics, Chinese Academy of Sciences（CAS）, China

Fengman Liu received the Ph.D.degree in Microelectronics and Solid-State Electronics from the Institute of Semiconductor of CAS. His research interests include System in Packaging，Wafer level packaging and optoelectronics hybrid integration. Prof. Fengman Liu has led and joined a number of research projects, including the National Key R&D Program of China, NSFC funding and and projects from enterprises. he has published over 60 papers, hold over 30 patents and co-authored one book.

Tonglong ZHANG  Sr Expert Hisilicon 

Tonglong Zhang has 28 years of IC packaging experience. He worked at companies at various position in the semiconductor supplier chain including design house, OSAT and IDM. He has worked on design, stress and thermal, process and material development and reliability assessment. He has developed various IC packaging technologies including fine pitch cu pillar flipchip csp, large size flipchip package, 2.5D package etc. He have 10 US patents and several Chinese patents on IC packaging. 

Pei CHEN

Beijing University of Technology

Yongjun HUO  Tenured Associate Professor and Doctoral Supervisor at School of Materials Science and Engineering, Beijing Institute of Technology

Deputy director of Engineering Research Center of Highly Reliable Electronic PackagingMaterials for Extreme Environment, Ministry of Education, ChinaDeputy director of M aterials and Manufacturing Engineering Department in BlTMember ofCommittee of instructors for Students innovation and Entrepreneurship of SM SE:.Member of Steering Committee of Undergraduate Education; Member of OversightCommittee of Undergraduate Education Extensive research experience in electronic packaging materials, electronic packagingtechnology under extreme environment, more than 50 high-quality papers, published inreputable journals, incuding Scripta Materialia, MSEA and JMR&T, more than 30 papers asthe first or corresponding author.

Shuying MA  Dean of Advanced Packaging Research Institute, Huatian Technology

Dr. Shuying Ma, Senior Engineer, National Special Support Program for High level Talents, Jiangsu Province 333 High Level Talents, Jiangsu Province Double innovation Talents, Jiangsu Province Young Double innovation Talents, First level Shortage Talents in Suzhou, Industry Professor of Nanjing University. Dr. Ma, CTO of Huatian Kunshan, has rich experience in advanced packaging development and mass production, familiar with advanced packaging technologies such as WLP, Bumping, TSV, Fanout, 2.5D/3D, etc. He has established the Huatian HmaTrix advanced packaging technology platform, led the development of 12 inch embedded silicon Fanout packaging technology, 12 inch automotive image sensor wafer level packaging technology, Panel level Fanout packaging technology, 2.5D/3D eSinC technology and other advanced packaging technologies. 

Leida CHEN

Xi'an Institute of Microelectronics Technology

Yu ZHANG  Professor and Doctoral Supervisor of Guangdong University of Technology

In January 2016, ZHANG graduated from Shenzhen Institute of Advanced Technology, University of Chinese Academy of Sciences as Ph.D. , core member of "State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment Jointly Built by the Ministry of Education" and "Key Laboratory of Microelectronic Precision Manufacturing Technology and Equipment", and Class A talents introduced by the University's "100 Young Talents Program".He is mainly engaged in the research and development of advanced semiconductor packaging technologies and key materials such as microelectronics and power electronics, including micro-nano metal materials, flexible printed electronics, high-density three-dimensional interconnection technology and key materials.

Zhiwen CHEN  Associate Professor at Wuhan University

Master's and Doctoral Supervisors of Industrial Science Research Institute of Wuhan University, and teacher of Academician Liu Sheng's Research Group, mainly engaged in research on the mechanics and simulation of advanced packaging materials for chips. In the past five years, Chen has published 43 academic papers, obtained 6 invention patents (including 1 US patent), 2 PCTs, and 1 software copyright. 

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