Keyun BI  Honorary President of Packaging Branch, China Semiconductor Industry Association

Branch of China Semiconductor Industry Association Professor and doctoral supervisor. He worked successively at the 13th Research Institute of the Ministry of Electronics, the Ministry of Information Industry, and the China Academy of Electronic Science.He served as the director of the research institute and the director of the Military Industry Foundation Institute. He is one of the founders of ICEPT and has been serving ICEPT since 1994. In 2024,he was awarded the'ICEPT Lifetime Achievement Award' .

Tianchun YE  President of Academy of Integrated Circuit, Chinese Academy of Sciences, President of IC branch of China Semiconductor Industry Association, Secretary General of China Integrated Circuit Innovation Alliance

Professor Ye Tianchun has engaged in studies on IC fabrication technology, novel devices and micro-fabrication for a long time. As subject principal and key backbone, he has completed a dozen of research subjects, which are supported by the 7th-10th“Five-Year National Key Technologies R&D Programme”, the National Climbing Project,“863”project,“973 Program”and project of Knowledge Innovation Program of the Chinese Academy of Sciences. Several achievements on deep submicron and nano-fabrication, UHF compound semiconductor and devices stand at the leading position at home or achieve international advanced level. Professor Ye has served as general chair of ICEPT for 8 years.

Jianhua ZHANG  Vice president of Shanghai University, Executive Director of School of Microelectronics, Shanghai University

Professor Jianhua ZHANG, Ph.D. supervisor, National Leading Talent, recipient of the First Shanghai Outstanding Talent Award. Chair of the SID Beijing Chapter, Editor-in-Chief of the newly launched journal Moore and More, and Editor-in-Chief of Advance in Manufacturing (a SCI-indexed journal). She has long been engaged in applied basic research, engineering technology development, and collaborative innovation and achievement transformation in the fields of microelectronics, new displays, and advanced manufacturing. She has published numerous research papers in Nature, Nature Photonics, Science Advances, Advanced Functional Materials, and various IEEE journals such as IEEE Transactions and IEEE Electron Device Letters. She holds over 100 authorized invention patents, with many achievements successfully transformed and applied. As the first contributor, she has received three First Prizes of the Shanghai Science and Technology Award (2014, 2016, 2020) and the Shanghai Outstanding Contribution Award for Young Science and Technology Talents (2016). She has also been honored with the National March 8th Red-Banner Pacesetter and the National May 1st Labor Medal. Professor Zhang has served in ICEPT for more than ten years. From 2018 to 2023, she was Chair of the “Optoelectronic Packaging” subcommittee; since 2024, she has served as Technical Co-chair, and in 2025, she is serving as Conference Chair.

Jeffrey C. SUHLING  Professor at Auburn University, IEEE EPS President Elect 

Jeffrey C. Suhling received his Ph.D. degree in Engineering Mechanics in 1985 from the University of Wisconsin.  He then joined the Department of Mechanical Engineering at Auburn University, where he currently holds the rank of Quina Distinguished Professor and Department Chair.  Prior to becoming Department Chair, he served as Center Director for the NSF Center for Advance Vehicle Electronics (CAVE).  His research interests include applications of solid mechanics to electronics packaging, including emphasis on lead free solders and silicon sensors.  In IEEE, Dr. Suhling has been a member of the Electronics Packaging Society for the past 30 years.  He has served in several EPS leadership roles including Vice President, Education (2019-2022), Vice President, Finance (2023-2024), and President Elect (2025). 

KITTY PEARSALL  President of Boss Precision Inc., Independent Consultant,USA 

Kitty Pearsall received the BS degree in Metallurgical Engineering and her MS and PhD degrees in Mechanical Engineering and Materials from the University of Texas. Across my 41-year career at IBM, I was appointed to strategic roles and received multiple awards.

Retired, IBM Distinguished Engineer in Integrated Supply Chain since 2000 - 2013

Emeritus Member of the IBM Academy of Technology 

Implemented global cross-brand, cross commodity processes/products 

Many IBM Outstanding Technical Achievement Awards; 12 US patents; and 8 published disclosures

Numerous internal IBM publications as well as 22 external publications

Kouchi ZHANG  Academician of the Dutch Academy of Engineering, IEEE Fellow

Dr. G.Q. Zhang is chair professor for "Micro/Nanoelectronics System Integration and Reliability" of Delft University of Technology (TUD), Delft, the Netherlands. He is a member of Netherlands Academy of Engineering (NAE), honorary member of Hungarian Academy of Sciences (MTA) and IEEE Fellow. Among others, he received the prestigious IEEE “Technical Field Award”, “Outstanding Sustained Technical Contribution Award”/IEEE CPMT, and the “Excellent Contribution Award”/ICEPT. He serves as secretary-general of IEEE International Technology Roadmap of Wide bandgap power semiconductors (ITRW), and NL representative of WGEE of International Council of Academies of Engineering and Technological Science (CAETS). Prof. Zhang chaired the Technology Domain team of “More than Moore” of European’s technology platform for micro/nanoelectronics (Eniac); co-chaired the academic council of Netherlands national innovation program Point-One on “Micro/nanoelectronics and embedded system”, while he worked for Philips and NXP as Research Fellow.

Johan LIU  Professor of Shanghai University, China,Prof. of Chalmers University of Science & Technology, Sweden,Member of Royal Swedish Academy of Engineering, Sweden

Dr. Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently a special recruited professor at Shanghai University, China (short term) and a professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden. Prof. Liu has served ICEPT nearly 30 years, he was given an 'ICEPT Outstanding Contribution Award' in 2024.

Sheng LIU  Academician of CAS, Dean of School of Integrated Circuits, Executive Dean of the Institute of Technological Science, Wuhan University

Prof. Sheng Liu is dean of School of Integrated Circuits, executive dean of the Institute of Technological Science, Wuhan University. He is the National Science Fund for Distinguished Young Scholars (Type B), Yangtze River Scholar Distinguished Professor, ASME Fellow, IEEE Fellow, and as a professionalism in the area of the “863 program” of the National High Technology Research and Development Program. Prof. Liu has served ICEPT nearly 30 years from 1996-present, he was given an 'ICEPT Lifetime Achievement Award' in 2024.

Liqiang CAO  Deputy Director of Institute of Microelectronics of the Chinese Academy of Sciences

Research Interests : System Level Packaging and 3D Integration. Now Deputy Director and professor of Institute of microelectronics, Chinese Academy of Sciences. As the project leader and technical backbone, he has participated in 8 national scientific research projects, including major national science and technology projects and key projects of National Natural Science Foundation of China. Dr. Cao has served ICEPT nearly 20 years, and as technical chair for 6 years, as co-chair since 2023-present.

S. W. Ricky LEE  Dean of Systems Hub, Hong Kong University of Science and Technology (Guangzhou) China

Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute for two and a half years. Currently Dr Lee is Chair Professor of Mechanical & Aerospace Engineering Department at HKUST and Dean of Systems Hub at the HKUST Guangzhou Campus. Prof. Li has served ICEPT nearly 30 years, he was given an 'ICEPT Outstanding Contribution Award' in 2024.

Yiwu GUO  Secretary-General of Shanghai Integrated Circuit Industry Association

Yiwu GUO is an expert of the Shanghai Senior Professional and Technical Position Qualification Examination Committee and an expert of the Expert Committee of the Shanghai Integrated Circuit Industry Cluster Development Promotion Agency. He served as Secretary of the Party Committee and Deputy General Manager of Shanghai Belling Corp., Ltd.; Responsible for the company's restructuring and listing and strategic development, becoming the first listed integrated circuit company in China. He served as the director of the human resources department and the director of the cadre department of Huahong Group, and concurrently served as the deputy general manager and general manager of Shanghai Huahong Technology Development Co., Ltd.; He has rich experience in chip enterprise management and human resources operation.

Institute of Microelectronics of Chinese Academy of Sciences

Janey SHI

Beijing Herogees Consulting Company