Technological Development and Applications of Ultra-Low Loss Fiberglass-Free Film Products in the Era of High-Performance AI Computing
Dr. Yue Jiang
Deputy General Manager,Guangdong EPS Technology Co.,Ltd,China
Abstract:
The High-Speed PCB laminates are facing severe challenges by current AI supercomputing technologies fast development. The general requirements for High-Speed laminates: Super lower DK and DF value、Low thermal expansion、high thermal reliability performance and processing stabilities. However, the High-Speed laminates are still facing another two big problems when the signal transition speed rise from 224Gbps→448Gbps. On one hand, the PCB skew issue will become more apparent. One another hand, Ultra-HDI development will bring more CAF failure risks which definitely constrain the High-Speed PCB further development. In this article, we elaborated effective path to resolve the above problems by using low DKDF and Low-CTE non-glass resin film, to handle the problems which High-Speed designers are facing and ensure the AI supercomputing technologies further develop smoothly.
Speaker's Biography:
Yue Jiang, male, born in 1983, holds a Doctoral degree. He graduated from Hunan University in 2009. Currently, he serves as Deputy General Manager of the Marketing Department at EPS New Materials Technology Co., Ltd., Guangdong. His core work focuses on market development and application promotion of BT copper-clad laminates (CCL) for IC substrate use and low-CTE high-speed copper-clad laminates (CCL).
Jiang Yue previously worked at Fastprint Circuit Technology Co., Ltd., Guangzhou for more than five years, where he was primarily engaged in R&D of PCB process technologies and evaluation of PCB base materials (CCLs). During this period, he published one professional technical paper and obtained one utility model patent.
Afterwards, he held the position of Marketing Director at Isola and Nan Ya New Materials respectively, taking charge of marketing promotion for BT CCLs and high-speed CCL products.
Jiang Yue possesses in-depth understanding of PCB and CCL manufacturing processes, as well as the application of CCLs in PCBs and end products, and has accumulated extensive experience within this industry segment.