Modeling and Simulation of Packaging Interconnection Technologies with COMSOL

   Dr. Leming HE

   Application Engineer, COMSOL China

Speaker's Biography: 

Leiming He earned his PhD in Microelectronics and Solid-State Electronics from Fudan University. He previously worked at a renowned enterprise in the semiconductor industry, where his core research areas cover power devices, MEMS devices, as well as structural design and manufacturing processes of various chips. Since joining COMSOL China, he has been in charge of technical support and customer consulting services, with a primary focus on advanced packaging processes and structural design.