Holistic Chiplet Packaging Approach

   Dr. Tanja Braun

   Head of Department, Fraunhofer IZM，Germany   

Abstract: :

The economic advantages of silicon scaling according to Moore’s Law have gone, as today, only a limited number of foundries can afford the manufacturing of high-end nodes. Now, heterogeneous integration in combination with advanced packaging are the path to achieve economic advantages and also to enable new applications. Many options for the package including silicon interposers, Fan-out on substrate, and variations of 3D stacking approaches are seen as possible solutions. However, performance of current applications requires still more transistors per system, but industry also needs a new, more economical system packaging approach. Chiplets are considered the main solution to address this challenge.

Besides all the design aspects, packaging of Chiplet-based systems also holds quite some challenges and requires advanced packaging approaches. The presentation will summarize different advanced packaging solutions as Flip Chip on organic, silicon or fan-out interposer and discuss key challenges as e.g. warpage and possible mitigation solutions.

Speaker's Biography: 

Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin. Tanja Braun is head of the department System Integration and Interconnection Technologies. Recent research is focused on Fan-out Wafer and Panel Level Packaging technologies. In 2021 she received the Exceptional Technical Achievement Award from IEEE Electronics Packaging Society (EPS) and the IMAPS Sidney J. Stein Award for her work in the field of Fan-out Wafer and Panel Level Packaging.

Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and is the IEEE EPS VP of Conferences.