The impact of the dynamic AI market on the advanced packaging supply chain

  Dr. Yu-Po, Wang

  Principle Consultant, Prismark

Abstract:

The rapid expansion of artificial intelligence (AI) is reshaping the semiconductor industry, with advanced packaging emerging as a critical enabler of performance scaling. AI processors increasingly adopt heterogeneous integration, including chiplet architectures, 2.5D/3D packaging, and high-bandwidth memory (HBM), to overcome the limitations of traditional scaling. These trends are driving strong demand for advanced packaging technologies as well as high-density substrates, PCB, and innovative thermal and power delivery solutions. At the same time, supply-chain constraints, rising manufacturing complexity, and capacity limitations are influencing market dynamics and investment strategies. This talk reviews key AI-driven market trends in advanced semiconductor packaging, substrate and PCB.

Speaker's Biography: 

Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York, U.S.A.

In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. 

He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package and as Vice President from 2022.

In 2025, he joins Prismark as Principal Consultant which covers Semiconductor market from Packaging assembly to PCB industry.

He also severs as IEEE Electronics Packaging Society Board of Governors (BoG) member and Taipei Chapter Executive Committee from 2025.

Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development as well as overall semiconductor market. He has over 83 patents in US.