Flip Chip on Glass-Core Substrate with Micropump and Cu-Cu Hybrid Bonding
Dr. John H. LAU
Unimicron Technology Corporation, Taiwan, China
Abstract:
Flip Chip on Glass-Core Substrate with
Micropump and Cu-Cu Hybrid Bonding
Dr. John H Lau, Unimicron Technology Corporation,
Taiwan, China
In this lecture, two problems of flip chips on glass-core package substrate will be investigated.
The first problem deals with the flip chip on glass-core package substrate with microbumps
and the other deals with the flip chip on glass-core package substrate with Cu-Cu hybrid
bonding. The first problem is for high-performance applications and the second problem is for
very high-performance applications. For both cases there are two build-up layers on the glass
core’s top and bottom sides. For the microbumped flip chip the build-up layers are fabricated
by a PID (photoimageable dielectric) for the dielectric layer (5µm-thick) and electrochemical
deposition (ECD) Cu for the metal layer (3µm-thick). The pad pitch is 50µm. For comparison
purposes, a same structure with organic-core package substrate with microbump is also
considered. For Cu-Cu hybrid bonding flip chip, the build-up layers on the glass-core’s top
and bottom sides are fabricated by PECVD (plasma-enhanced chemical vapor deposition) for
the SiO2 dielectric layer (1.5µm-thick) and Cu dual-damascene for the metal layer (1.5µm-thick).
The Cu-pad pitch is 10µm. One of the key takeaways is to point out a common mistake that the
thermal coefficient of expansion of the glass-core substrate is as close as that of the silicon chip.
Some recommendations will be provided.
Speaker's Biography:
John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor
packaging, has published more than 535 peer-reviewed papers (385 are the principal
investigator), 52 issued and pending US patents (31 are the principal inventor), and 24
textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively
participating in industry/academy/society meetings/conferences to contribute, learn, and share.