Cu-Cu Hybrid Bonding and Co-Packaged Optics with Silicon Photonics

       Dr. John H. LAU

      Chief Scientist，Unimicron Technology Corporation, Taiwan, China

Outline:

Cu-Cu hybrid bonding is one of the flip-chip bumpless assembly technologies. The advantages of hybrid bonding are: (a) higher density, (b) finer pad pitch, and (c) better electrical and thermal performance. In this lecture, 21 high-volume manufacturing (HVM) or to be HVM products and 12 new applications using hybrid bonding will be presented. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the chiplets in switch, photonic ICs (PIC) such as lasers and photodiodes, and electronic ICs (EIC) such as the laser driver and the transimpedance amplifier (TIA). The advantages of CPO are: (a) to reduce the length of the electrical interface between the PIC/EIC and the switch, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of Cu-Cu hybrid bonding and a higher level of heterogeneous integration of switch, EIC and PIC with silicon photonic, whether it is for performance, form factor, bandwidth, power consumption or cost. The content of this lecture is shown below.

· Introduction

· Origin of Hybrid Bonding

· Fundamentals of Cu-Cu Hybrid Bonding

· 21 HVM Products with Cu-Cu Hybrid Bonding

· 12 New Applications for Cu-Cu Hybrid Bonding

· Data Centers, Switch, EIC, and PIC

· OBO (on-board optics), NPO (near-board optics), CPO (co-packaged optics)

· 3D Heterogeneous Integration of Switch, PIC and EIC with Bridges and/or Glass Substrate/Interposer

· CPO with Silicon Photonics: Silicon Waveguides, Coupler, etc.

· Summary and Recommendations

Lecturer Biography:

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 25 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.             

Who Should Attend?

If you (students, engineers, and managers) are involved with any aspect of the electronics industry, you should attend this course. It is equally suited for R&D professionals and scientists. The lectures are based on the publications by many distinguish authors and the papers/books (by the lecturer).