Nano Materials And Polymer Composites For Electronic Packaging

  Prof. Zhuo LI

   Professor，Fudan University, China

Outline:

Nano materials and polymer composites are widely used in electronic devices as adhesives, encapsulants, thermal interface materials, insulators, dielectrics, conducting elements for interconnects. This short course will provide overview on the latest advancement of nano materials and composites, and their impact to advanced electronics packaging and integration.

Lecturer Biography:

Zhuo Li is a Professor in the College of Smart Materials and Future Energy, and a PI in the State Key Laboratory of Molecular Engineering of Polymers at Fudan University, where her research focuses on functional polymer composites for flexible sensors and electronic packaging. She earned her B.S. degree from Tongji University, followed by an M.S. from Virginia Tech and a Ph.D. from the Georgia Institute of Technology. Before joining Fudan, Dr. Li worked as a Materials Engineer at Celanese Corp. and CNPC USA Corp. She has published over 90 papers in journals such as Science Translational Medicine, Nature Communications, Advanced Materials. Currently, she serves as an Associate Editor for IEEE TCPMT, Chair of the IEEE-EPS Shanghai Chapter, Chair of the IEEE-WIE Shanghai Affinity Group, and a member of the ICEPT Packaging Materials and Processes Committee. Dr. Li was a recipient of the IEEE EPS Outstanding Young Engineer Award in 2020.