MEOL design and process consideration for heterogeneous integrated package and substrate

Prof. Gu-Sung Kim

Kangnam University, Yongin, S Korea

Outline:

Unlike the eight major semiconductor processes, it is difficult to understand the flow of the entire technology in the semiconductor back-end process due to its diversity and variability. Heterogeneous Integration is a new era technology, integration of separately manufactured into a higher-level assembly that provides functional improvements. 

The Presenter explains “What is the semiconductor Middle-End-of-Line Process and Technology”, from the assembly technology mentioned in the ITRS last version to the Heterogeneous Integration technology in the IEEE EPS HIR, in connection with‘More Moore’thru‘System Moore’. In addition, present what are considerable the coupled co-design concepts of electronic packaging, interposer, and substrate including electrical, mechanical, and thermal simulations in this area.

It will be helpful to audiences who want to easily understand the contents of numerous technologies and terms, and engineers who want to understand the middle-end-of-line processes and fine pattern substrate processes and design required in Heterogeneous Integrated System, Chaplet’s, HBM, and Interposers. 

Lecturer Biography:

Gu-Sung Kim is currently a faculty position at Kangnam University, South Korea and a founder of EPRC (Electronics Packaging Research Center).  He had 35 years experiments for R&D of Semiconductor Packaging. Prior to joining and establishing lecture/research position, Kim was a 3D IC/TSV/WLP project leader for Samsung Electronics Co., Ltd, Memory Division during 17 years. He has more 130 Patents as an inventor in Korea and USA related 3D IC, TSV, and Interposer. He published 2 semiconductor packaging handbooks and presented more 250 as a speaker and talk. He received several awards from Korea government, Society, Samsung, KSIA, SEMI, and Alfred Marquis Lifetime etc.

Kim received a Ph.D. degree in materials engineering from Rensselaer Polytechnic Institute, Troy, NY, USA., a BS degree in ceramic engineering from Yonsei University, Seoul, Korea.