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ICEPT2020 Highlights
ICEPT Outstanding Paper AwardMulti-chip Stacking with Fine Pitch μbumps and TSVs for Heterogeneous IntegrationYangyang Yan, Guojun Wang, Hanqiang Su, Peng Sun, Fengwei Dai and Liqiang CaoThe National Center for Advanced Packaging (NCAP China)Simulati...
2021-01-20