2.5D and 3D packaging, wafer-level and panel-level packaging, flip chip, Fan-Out, system integration, heterogeneous/hybrid integration.

New packaging materials, advanced packaging substrate, green materials, nano-materials, and related packaging materials for packaging/assembly processes.

Design, modeling, methodology, and simulation for system integration and packaging; methodology and simulation for electrical/thermal/optical/mechanical models, multi-scale and multi-physics modeling, process simulation.

TSV, bumping and micro copper pillar technologies, high density inter-connection technologies, nano-materials bonding technologies, interposer, redistribution layer technologies for fan-in and fan-out packaging, chip-to- wafer/panel and wafer-to-wafer interconnect technologies, thermocompression bonding, non-conventional inter-connection technologies.

Assembly, testing, manufacturing, automation technologies and equipment for Packaging manufacturing.

Test technologies for packaging, quality monitoring and evaluation, methodologies for reliability data collection and analysis, reliability modeling, life prediction, failure analysis and non-destructive diagnose.

Thermal management, interconnection and substrate technologies for power electronics, switch module, isolated/non-isolated power converter, inverter module, IPM, POL, PwrSoC, PSiP, open frame, electrical design, magnetic integration, control algorithm, firmware development, EMI modeling & optimization.

Optoelectronics and solid state lighting design, simulation, interconnection, packaging & integration, display module encapsulation & assembly, new display device and module encapsulation & assembly, mass Transfer of MicroLED, wearable, bendable, foldable and flexible electronics and display.

MEMS, NEMS, sensor, sensor packaging, implantable device packaging, microfluidics, nano- battery. 3D printing, self-alignment and assembly, wafer-level and panel-level packaging, redistribution layer, reliability, new structure and technologies for fan-out packaging.

Electrical modeling, analysis, design, integration, fabrication and characterization of novel devices, packages, and systems for RF/microwave and high-speed I/O, component optimization and power management of computing/communication systems, 5G mobile networking, wearable/flexible electronics and bio-electronics, etc.