2024 25th International Conference on Electronic Packaging Technology
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Mrs. WANG
0086-13121110782(Submit Contact)
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
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Janey SHI
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janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
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2023年8月9-11日,第24届电子封装技术国际会议(ICEPT 2023)在中国美丽新疆石河子大学胜利召开。
来自海内外700位专业人士齐聚一堂、共享硕果,推动先进封装面向技术创新、学术交流与国际合作!
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