PDC-1: Chiplets Heterogeneous Integration and Fan-Out Packaging

PDC-2: Progress of Advanced 3D Wafer level Packaging: 2.5 interposer, 3D IC and High- Density Fan-Out Technology

PDC-3: Application of Surface Analysis Techniques in Failure Analysis, Quality Assurance and Yield Enhancement of Semiconductor Wafer Fabrication, Assembly and Packaging Manufacturing

PDC-4: Technology and Development Trends of IC Packaging Substrate

PDC-5: Failure Analysis on Microelectronic Interconnection Materials

PDC-6: Fundamentals of High-speed Signaling for Electronic Packaging

PDC-7: Advanced Packaging Material: Key Raw Material and Application

PDC-8: Thermal and Mechanical Finite Element Analysis in Electronic Packaging ——Cases and Problems