2021 22nd International Conference on Electronic Packaging Technology
English
Chinese
HOSTED BY
ORGANIZED BY
CONTACT US
School of Electronic Science and Engineering
Dongxue LIANG
0086-0592-2188342
icept2021@xmu.edu.cn
Wen YIN
0086-010-82995675
Conference Registration
Fenghua GAN
0086-021-38953725
faithsh@yeah.net
Juanjuan ZHOU
0086-010-64655241
271617588@qq.com
Conference Sponsorship
Yueru SHI
0086-13661508648
janey.shi@cepem.com.cn
PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology
PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process
PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology
PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging
PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications
PDC-6: Emerging Power Packaging Technology and Process
SIAT Session: Advanced Electronic Packaging Materials Research and Application