PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology

Dr. Ning-Cheng Lee (Online)

PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process

Dr. Yifan Guo (Online)

PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology

Prof. Daquan Yu

PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging

Prof. Sheng Liu

PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications

Dr. Ziyang GAO (Online)

PDC-6: Emerging Power Packaging Technology and Process

Dr. Carlos Chow (Online)

SIAT Session: Advanced Electronic Packaging Materials Research and Application

Prof. Rong Sun