2026 27th International Conference on Electronic Packaging Technology
English
Chinese
SPONSORED BY
ORGANIZED BY
CONTACT US
Meeting Secretary
Xiaoqing WEI(Submit Contact)
18392959178
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
0086-13121110782
0086-010-64655251
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Hongyu QIAO
0086-13772049433
qiaohy@sastc.com.cn
Cu-Cu Hybrid Bonding and Co-Packaged Optics
Dr. John H. LAU
Unimicron Technology Corporation, Taiwan, China
Advanced System Packaging and Solder Interconnection
Dr. Wei Koh
Pacrim Technology Irvine, CA, USA
t'TBD
Mr. Scott CHEN
ASE (Advanced Semiconductor Engineering), Taiwan, China
Nano Materials And Polymer Composites For Electronic Packaging
Prof. Zhuo LI
Fudan University, China
Low Distortion Wafer Bonding using programmable wafer deflection for advanced semiconductor manufacturing
Dr. Li GONG
General Manager, SUSS MicroTec (Shanghai) LTD
Advanced Packaging Materials Innovation through Co-creative Activities
Mr. Hidenori ABE
CTO for semiconductor materials, Executive director, Electronics Business Headquarters of Resonac Corporation
Getting ready for the challenges of Silicon Photonics
Dr. Ruby Yan
Vice president for global business center, Guangzhou Zen Semiconductor Corporation, China
Advanced Utilisation of Machine Learning Models for Package Reliability Analysis
Dr. Karsten Meier
Senior Researcher, Assistant Director of Technische Universität Dresden
Advanced Die Attachment Technologies for Power Electronic Packaging
Dr. Li LIU
Marie Skłodowska-Curie Actions (MSCA) Postdoctoral Fellow, Delft of Technology
Electromigration in Microscale Interconnects with a Coexisting Liquid-Solid Solder Matrix
Prof. Wu YUE
Dean, Lanzhou Institute of Technology, China
Cu Paste for Bonding Applications in Advanced and Power Semiconductor Devices
Prof. Chuantong CHEN
Osaka University, Japan
TBD
Wechat inquiry
Telephone inquiry
Mail inquiry