PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology

PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process

PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology

PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging

PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications

PDC-6: Emerging Power Packaging Technology and Process

SIAT Session: Advanced Electronic Packaging Materials Research and Application