2024 25th International Conference on Electronic Packaging Technology
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Longnv LI
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icept@fsemi.tech
Wen YIN
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Conference Registration
Kunxia SONG
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Yico WANG
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Judy ZHOU
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juanjuan.zhou@fsemi.tech
Note: The information is only for your reference. The final conference schedule shall prevail on the date of conference.
Reliability and industrialization of a new SnZnBiInP lead-free solder series
Prof. Jusheng MA
Tsinghua University, China
Chiplet Design and Heterogeneous Integration Packaging
Dr. John H. LAU
Unimicron Technology Corporation, Taiwan, China
"Less is Moore" for Chiplets and Glass Substrates
Dr. Wei Koh
Pacrim Technology Irvine, CA, USA
The Heterogeneous Integration Package Development Trend
Mr. Scott CHEN
SVP of Central Development Engineering in ASE (Advanced Semiconductor Engineering), Taiwan, China
High Reliability Soldering in Semiconductor Packaging
Dr. Ning-Cheng Lee
ShinePure Hi-Tech, China
Multi-scale multi-field simulation for chip design
Prof. Sheng LIU
Academician of CAS, Dean of School of Power and Mechanical Engineering, Wuhan University
Prof. Yuzheng GUO
Vice Dean of School of Power and Mechanical Engineering, Wuhan University
Moisture Reliability, Failure Mechanisms and Modeling in Semiconductor Packaging
Prof. Xuejun FAN
Lamar University, Beaumont, Texas, USA
Chair: Prof. Kouchi ZHANG, Delft University of Technology, Netherlands
Welcome address: Prof. Tianchun YE, Chair of ICEPT
Prof. Yong JIANG, Tiangong University
Dr. Kitty PEARSALL, IEEE EPS
Chair: Prof. Johan LIU, Chalmers University of Technology, Sweden
Entransy and Electronics Packaging Thermal Management
Prof. Zengyuan GUO
Academician of CAS
Prof. Xiaobing LUO
Dean of the School of Energy and Power Engineering at Huazhong University of Science and Technology
DfX for Power Electronics with Super High Reliability
Semiconductor Supply Chain“Eco System”Overview
Dr. Kitty PEARSALL
IEEE EPS
Trends and Challenges of Third-Generation Semiconductor Components in Digital Power
Dr. Zhaozheng HOU
Director of the Technology Planning Dept of the R&D Mgmt Dept, Huawei Digital Power Technologies Co., Ltd.
Low Temperature Sintering of Nanosilver Paste for High Temperature Electronic Package
Prof. Yunhui MEI
Executive Vice President of School of Electrical Engineering Tiangong University
Chair: Tadatomo SUGA, Professor Emeritus of the University of Tokyo, Professor of Meisei University
Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC
Unimicron Technology Corporation
Metal/Dielectric Hybrid Bonding for Heterogenous Integration Applications
Dr. Viorel Dragoi
Chief Scientist, EV Group, Austria
Recent Advances in Semiconductor Package Warpage Management
Lamar University, Beaumont, TX
Industrial Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules via Advanced Electromagnetic-Thermal Analysis
Prof. Andrew Tay
IEEE EPS Region 10 Director
Chair: Prof. Ricky LEE, Hongkong University of Science & Technology, China
Advanced 3D Packaging for AI Application
Dr. YP WANG
Vice President, R&D Center, Siliconware Precision Industries Co., Ltd.
Manufacturing Technology Solution of Wafer / Panel Level Packaging for Chiplet Integration
Mr. Motoshi Kobayashi
General Manager of ULVAC, Inc.
2.5D/3D Packaging PVD Equipment Solution
Dr. Jianheng LUO
Packaging Product Manager of PVD Business Unit, NAURA
Applications & Challenges of TCB in Chiplet Technology
Dr. Hong XIE
Tongfu Microelectronics
Chiplets Turn 65!
Dr. Charles E. Bauer
Senior Managing Director TechLead Corporation
Overview of Oral Presentation Sessions
Friday, August 9th, 8:30-18:15 3F
Recent Progress in Surface Activated Bonding for WBG Semiconductors and All-Metal 3D Interconnects
Prof. Tadatomo SUGA
University of Tokyo & Meisei University
New interconnect material for high-reliability SiC power modules
A.Prof Chuantong CHEN
Osaka University
AI-enhanced Simulation for Power Package Design
Haibo FAN Senior Principal Engineer
Nexperia Hong Kong
Design and Process Considerations for 2.5 Interposer Technology
Prof. Gu-Sung Kim
Kangnam University
Novel MEMS Passive Elements: Wafer-level Fabrication and System Integration
A.Prof. Sixing XU
Hunan University
Study on the moisture induced failure for advanced embedded packaging
Dr. Meiying SU
Institute of Microelectronics of the Chinese Academic Sciences
Thermal Management of High-Power Electronics: from the Inside Out
Ronggui YANG Chair Professor
Peking University
Current Status and Research Progress of Packaging Materials and Processes for Power Electronics
Dr. Ju XU
Huawei 2012 Laboratory
DTCO for warpage & thermal control in wafer level advanced packaging
Xin WANG CTO, VP of R&D
Hangzhou Microsilicon Technology Co.,Ltd
Photo-patternable High-RI TiOx Spin-on Materials for Silicon Photonics Applications
Wei-Su CHEN Deputy General Manager
Quantech (Guangzhou) New Materials Co., LTD
The Application of Multiphysics Simulation in Advanced Packaging
Anran WEI Application Engineer
COMSOL China
Nano-scale TSV Development and Its Application
Ziyu LIU Associate Professor
Fudan University
Measurement and characterization in wide bandgap semiconductor devices
Dr. Xuefeng ZHENG
Xidian University
Board Level Interconnect Reliability under Harsh Conditions – Testing, Modelling and Prognostic Perspectives
Karsten Meier Senior Researcher
Assistant Director, Technische Universität Dresden
Maximize the performance of SiC device with advanced sinter technology
Jing ZHANG Head of Shanghai Innovation Center
Heraeus Electronics China, Heraeus Materials Technology Shanghai Ltd
Nanotwinned silver films for low-temperature interconnection: magnetron sputtering deposition, microstructure optimization, and thermo-compression bonding
Prof. Hongjun JI
Harbin Institute of Technology, Shenzhen
Advanced 3D Heterogeneous Integration of a 40+ TOP/W AI Core Accelerator
Farhang Yazdani CEO
BroadPak Corporation
High Density Glass Core Package Substrate
Prof. Chengqiang CUI
Guangdong University of Technology, Guang Dong FoZhiXin microelectronics Technology Research Co.Ltd.
Advanced Packaging Processes and Co-Design Simulation Solutions for 2.5D Integration
Jiaqi FAN Advanced Packaging Design Manager
National Center for Advanced Packaging Co., Ltd.(NCAP China)
Research on Cu/SiO2 Hybrid Bonding for Chiplet Integration
Dr. Junpeng FANG
School of Integrated Circuits，Tsinghua University
Flexible Hybrid Electronics for Healthcare and Robotics
Prof. Hao WU
Huazhong University of Science and Technology
AI Assisted Electronic Packaging Technology and Reliability Evaluation
A.Prof Yanwei DAI
Beijing University of Technology
TO-Based Design Optimization Methods for SiC MOSFET Power Modules
A.Prof Gaojia ZHU
Tiangong University
Glass Core Substrate: Next Gen Advanced Packaging Technology
Jiamiao TANG General Manager FCBGA
AKM Meadville Electronics (Xiamen) Co., Ltd.
Applied Reliability for Mobile and Auto Products
Huicai MA Director of Design for Reliability Department
Beijing Xiaomi Mobile Software Co., Ltd
Predictive Design and Modeling on Fan-Out Technology
Dr. Faxing CHE
Senior Member of Technical Staff, Micron Semiconductor Asia Operations Pte. Ltd
Low melting point solder for high density bonding in 3D IC technology
Yingxia LIU Assistant Professor
City University of Hong Kong
Technology Trends of Optical Interconnection in Intelligent Computing Center
Yuan ZHANG Freelancer
Thermo-mechanical fatigue life prediction of SiC power device based on finite element simulation
Dao-Hang LI Research Assistant
Heterogeneous integration of Micro-LED and CMOS for AR-display applications
Prof. Jianhua ZHANG
Vice President of Shanghai University and Executive Dean of the School of Microelectronics at Shanghai University
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