Advanced Packaging Materials Innovation through Co-creative Activities

  Mr. Hidenori ABE 

  CTO for semiconductor materials, Executive director, Electronics Business Headquarters of Resonac   Corporation 

  Getting ready for the challenges of Silicon Photonics

  Dr. Ruby Yan

  Vice president for global business center, Guangzhou Zen Semiconductor Corporation, China                                                                                                                                      

   Advanced Utilisation of Machine Learning Models for Package Reliability Analysis

   Dr. Karsten Meier 

   Senior Researcher, Assistant Director of Technische Universität Dresden  

   Advanced Die Attachment Technologies for Power Electronic Packaging

   Dr. Li LIU

   Marie Skłodowska-Curie Actions (MSCA) Postdoctoral Fellow, Delft of Technology

  Electromigration in Microscale Interconnects with a Coexisting Liquid-Solid Solder Matrix

  Prof. Wu YUE

  Dean, Lanzhou Institute of Technology, China