2023 24th International Conference on Electronic Packaging Technology
English
Chinese
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CONTACT US
Meeting Secretary
Hongkun WANG
0086-18099937231
icept@fsemi.tech
Wen YIN
0086-010-82995675
Pan GAO
0086-13179930011
Zhaoquan ZENG
0086-18199936165(Submit Contact)
ling ZHANG
0086-17799431176(Submit Contact)
Conference Registration
Yico WANG
0086-010-64655241
support@fsemi.tech
0086-17812205265
Manager YU
0086-15199593331(Local Contact)
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system:
https://easychair.org/my/conference?conf=icept20230
2023 Brief guide for authors abstract stage
ICEPT-2023_Abstract-Template
ICEPT-2023_Manuscript_Template
ICEPT-2023-Template-Poster
ICEPT-2023-Template-Presentation
2023 Brief guide for authors full paper stage
All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.
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