2024 25th International Conference on Electronic Packaging Technology
English
Chinese
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Meeting Secretary
Mrs. WANG
0086-13121110782(Submit Contact)
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
0086-010-64655241
0086-13121110782
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system:
All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.
March 20, 2025
April 20, 2025
May 20, 2025
June 30, 2025
August 5, 2025
August 6, 2025
August 7-8, 2025
13121110782(Submit Contact)
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