2021 22nd International Conference on Electronic Packaging Technology
English
Chinese
HOSTED BY
ORGANIZED BY
CONTACT US
School of Electronic Science and Engineering
Dongxue LIANG
0086-0592-2188342
icept2021@xmu.edu.cn
Wen YIN
0086-010-82995675
Conference Registration
Fenghua GAN
0086-021-38953725
faithsh@yeah.net
Juanjuan ZHOU
0086-010-64655241
271617588@qq.com
Conference Sponsorship
Yueru SHI
0086-13661508648
janey.shi@cepem.com.cn
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All abstracts and manuscripts must be in English and should be submitted through online submission system:
https://easychair.org/conferences/?conf=icept20210
Brief guide for authors.pdf
ICEPT-2021_Abstract-Template.docx
ICEPT-2021_Manuscript_Template.docx
All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.