Conference Introduction

Conference Introduction The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top four electronic packaging academic conference, which is hosted by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS)、 IEEE Electronics Packaging Society (IEEE-EPS)、Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT),organized by Beijing branch of IEEE-EPS and Beijing Faith Consulting Co., Ltd, China. ICEPT held in China every year, conference topics including Packaging Design、Manufacturing Technologies、R&D, and Photonics、MEMS、System Integrated Packaging etc..., since it inaugurated in 1994, ICEPT has been held by Tsinghua University, Fudan University, Harbin Institute of technology, Huazhong University of science and technology, Shanghai Jiaotong University, Xi'an University of Electronic Science and technology, Shanghai University, Guilin University of Electronic Science and technology, Dalian University of technology, University of Electronic Science and technology, Central South University, Hong Kong University of science and technology, Guangzhou University of technology and other universities for more than 20 sessions, and supported by relevant government units at all levels. ICEPT attracts a large number of domestic and foreign universities, research institutions, electronic packaging manufacturers participate, more than 500 Well known experts, scholars and business people from about 20 countries and regions attended each year.


Xiamen University (XMU), established in 1921 by renowned patriotic overseas Chinese leader Mr. Tan Kah Kee, is the first university founded by an overseas Chinese in the history of modern Chinese education. XMU has long been listed among China’s leading universities on the national 211 Project, 985 Project and Double First-class initiative, which have been launched by the Chinese government to support selected universities in achieving world-class standing. 

For more details about the XMU, please visit

Introduction to School of Electronic Science and Engineering (National Model Microelectronics College), Xiamen University

The electronic and semiconductor disciplines of Xiamen University (XMU) are two of the earliest electronic branches in China. In 2018, the Ministry of Education officially approved the inclusion of the School of Microelectronics of Xiamen University in the preparatory unit of the National Model Microelectronics College. In 2019, the construction of 'National Integrated Circuit (IC) Industry and Education Integration Innovation Platform' was launched by XMU under the consent of the Ministry of Education of China. The platform, which was constructed mainly based on the School of Electronic Science and Engineering, focuses on solving the troublesome issue of national industrial development, guides the upgrading of integrated circuit industry on the western coast of the Taiwan straits, highlights the advantages and characteristics of Taiwan, and provides talents and technical supports for the development of semiconductor integrated circuit industry in China, especially in Fujian Province and Xiamen. 

For more details about the College of Electronic Science and Engineering of XMU, please visit