Jingbin LI  Dean of the College of Mechanical and Electrical Engineering ,Shihezi University

Li Jingbin is a Professor and Ph.D. supervisor, Dean of the College of Mechanical and Electrical Engineering, and Academic leader for Agricultural Engineering at Shihezi University. Also, he is a council member of the Chinese Society of Agricultural Engineering, Animal Husbandry Engineering Branch of China Agricultural Engineering Society, Agricultural Society of Xinjiang Uygur Autonomous Region, and a committee member of the Agricultural Mechanization Branch of the Chinese Society of Agricultural Machinery.  

Liqiang CAO  Prof. of Institute of Microelectronics of Chinese Academy of Sciences, China

CAO Liqiang，Research Interests : System Level Packaging and 3D Integration. Now Deputy Director and professor of Institute of microelectronics, Chinese Academy of Sciences. As the project leader and technical backbone, he has participated in 8 national scientific research projects, including major national science and technology projects and key projects of National Natural Science Foundation of China.

Fei XIAO Prof. of Fudan University, China

Yong LIU  Chief Engineer of Fairchild, USA

Dr. Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015.

Rong SUN  Professor and director of the institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences、Director of the Center for Advanced Electronic Materials at SIAT、Dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT.

Rong Sun is the director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). She is also the founding dean of Shenzhen Institute of Advanced Electronic Materials. She is doctoral supervisor, senior member of IEEE, State Council special allowance expert, and was selected as top 2% global scientists released by Stanford University in 2021.

Ming LI Prof. of Shanghai Jiao Tong University, China

Dr. Daniel SHI, Vice President, Hong Kong Applied Science and Technology Research Institute 

Dr SHI has 30 years of working experience in advanced semiconductor field, including 3rd generation semiconductor. Before joining ASTRI in 2007, he had worked at the City University of Hong Kong, Singapore Institute of Manufacturing Technology, Philips and Intel in different research and management positions. Dr SHI has published more than 120 international journal and conference papers. He has 30 granted patents. He received First Prize of the 2020 State Science & Technology Progress Award. 

Zhigang LI  Dean of the Information Science and Technology（School Of Cyber Science and Engineering）, Shihezi University

Dr. Zhigang LI,Professor, Doctoral Supervisor.Dean of the Information Science and Technology（School Of Cyber Science and Engineering）, Shihezi University, China.Director of Xinjiang Production & Construction Corps Key Laboratory of Computing Intelligence and Network Information Security, China.

Prof. Wenhui Zhu is professor with Central South University, China and Founder of Changsha AMQ Intelligent Technology Pte Ltd. He was elected as National Elite Talent. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He was Chief Scientist of 973 program on IC wafer level 3D integration, and has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon and UTAC.

The Information Science and Technology（School Of Cyber Science and Engineering）, Shihezi University

Qidong WANG  Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences.

Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSc degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. 

Dr. Wei  WANG Executive Deputy Director, National Key Laboratory of Micro/Nano Processing Technology

In 1999, he received  Doctor's degree from the School of Aeronautics and Astronautics, Tsinghua University, the tutor of Academician Zengyuan.  After that, he joined the Department of Micro/Nano Electronics and the National Key Laboratory of Micro/Nano Processing Technology in the School of Information Science and Technology, Peking University.  Now he is the Executive Deputy Director of the National Key Laboratory of Micro/Nano Processing Technology and the Deputy Director of the Department of Micro/Nano Electronics, Peking University.  Director, Institute of Integrated Micro/Nano Systems (MEMS), Peking University. 

Tao HANG  Full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University.

He has worked in the University of Michigan (US), Waseda University (Japan), and Northwestern University (US) as the visiting scholar and postdoctoral fellow for 5 years. Currently, he is a full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University. His research interest mainly focused 3D packaging materials and technology (interconnection, low temperature bonding), nanostructured materials and functional thin films fabricated by electrochemical method (electrodeposition, electro-grafting, electrochemical-etching). 

Zhiquan LIU  Group Leader in Shenzhen Institute of Advanced Technology (SIAT) Chinese Academy of Sciences (CAS)、Doctoral Supervisor of University of Chinese Academy of Sciences (UCAS).

Technology (SIAT) Chinese Academy of Sciences (CAS), and a Doctoral Supervisor of University of Chinese Academy of Sciences (UCAS). After graduated with PhD in April 2000, he worked in Japan for more than seven years, and then returned China as a Hundred Talent Scholar of CAS. His research expertise spans across property related microstructure characterization and phase transformation, focusing on microstructure and reliability of microelectronic interconnect materials. 

Chuantong CHEN

Osaka University, Japan

Daoguo YANG  Professor of Guilin University of Electronic Technology、Duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices、Director of Guangxi Electronic Packaging and assembly technology Engineering Research Center.

Prof. Daoguo Yang received his Master degree from Zhejiang University, China, and Ph.D. from Delft University of Technology (TUDelft), the Netherlands. He is currently a professor of Guilin University of Electronic Technology and the duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices and the director of Guangxi Electronic Packaging and assembly technology Engineering Research Centre.

Fengman LIU  Professor of Institute of Microelectronics of Chinese Academy of Sciences（CAS）,China

Fengman Liu received the Ph.D.degree in Microelectronics and Solid-State Electronics from the Institute of Semiconductor of CAS. His research interests include System in Packaging，Wafer level packaging and optoelectronics hybrid integration. Prof. Fengman Liu has led and joined a number of research projects, including the National Key R&D Program of China, NSFC funding and and projects from enterprises. he has published over 60 papers ,hold over 30 patents and co-authored one book.

Pei CHEN

Beijing University of Technology, China

Jian CAI  Prof. of Tsinghua University, China

Mingliang HUANG  Prof. of Dalian University of Technology, China

Prof. Dr. Mingliang Huang, Head of Laboratory for Electronic Packaging Materials, Dean of School of Materials Science & Engineering of Dalian University of Technology, Dalian, China. Experts in the national plan for ten thousand people, Young and Middle-aged talents in Science and Technology Innovation of the Ministry of Science and Technology, Humboldt Fellow. Research interest focuses on the advanced interconnection technology and materials in electronic packaging.

Leida CHEN

Xi'an Institute of Microelectronics Technology, China

Sheng LIU  Prof. of Wuhan University, China

Prof. Sheng Liu is the dean of the School of Power and Mechanical Engineering and the Institute of Technological Science of Wuhan University. He is the National Science Fund for Distinguished Young Scholars (Type B), Yangtze River Scholar Distinguished Professor, ASME Fellow, IEEE Fellow, and as a professionalism in the area of the“863 program”of the National High Technology Research and Development Program. He has acquired his doctor degree in Stanford University in 1992. From 1992 to 1995, he held the title of lecturer at Florida institute of technology. 

Dr. Chengqiang CUI  Professor of Guangdong University of Technology, China

Professor of Guangdong University of Technology （GDUT）and CEO of Guang Dong FoZhiXin microelectronics Technology Research Co.Ltd.  He received his PhD in Chemistry from the University of Essex (ESSEX) in 1991, bachelor's and master's degrees in Department of Chemical Engineering , Tianjin University in 1983 and 1985, respectively. He has hosted various national R&D projects including national 02 project and 863 project. He has almost 30 years’ experience in the development and production of microelectronic advanced packaging technology and materials, especially, high-density packaging substrates. 

Tangren Microtelligence TECHNOLOGY(Ningbo) Co., Ltd.

Dalian Jafeng Automation Co., Ltd.

Fei QIN

Prof. of Beijing University of Technology, China 

PhD. Xie Bin, SPES  Vice General Manager

Xie Bin, PhD, His major research areas include advanced packaging design and reliability design for power electronics and Wide Band Gap semiconductor. He was Chief Engineer of ASTRI. He has participated in research and development for numerous projects from Hong Kong government and industry. He charged for industrialization of technology and product. Through the works of technology transfer, he speeds up the transition of technology and product to industry, and successfully supported several customers as listed company.

Xiaofeng YANG  Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT.

Xiaofeng YANG, received his M.Sc. and Ph.D. degrees from Xiamen University, Xiamen, China, in 2016 and 2020. Currently, he is a Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT. His main research interests include advanced packaging reliability technology, thermal-mechanial reliability, advanced sensing technology and flexible electronics. 

Si CHEN

The 5th Electronics Research Institute of MIIT

Huaiyu YE  Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech)

Prof. Huaiyu Ye, has received BS degree in Shanghai Jiao Tong University, China, MA degree and Ph.D. degree in Delft University of Technology, the Netherlands (TUDelft). Currently, he is Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech). He has worked in Materials innovation institute (M2i) and Netherlands Organisation for Applied Scientific Research (TNO) in Europe. He has also worked in Chongqing University as Senior Researcher from 2016 to 2019. He is the committee member of the IEEE International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power Electronics Committee of the Chinese Electrical Engineering Society, and ICEPT, CSEE, EuroSimE, China SSL & IFWS. 

Dr. Hongwei LIANG  Executive Vice-President of School of Microelectronics, Dalian University of Technology, China

Professor Hongwei Liang, Vice Dean of School of Microelectronics, Dalian University of Technology, Director of Dalian Key Laboratory of Wide Bandgap Semiconductor Device Integration and System. He received his Ph.D. from Chinese Academy of Sciences. He is currently a member of the Nuclear Electronics and Nuclear Detection Technology Branch of the Chinese Institute of Electronics and a member of the Young Scientists Club, and a special expert of the Expert Committee of the Talent Reserve Base of the Integrated Circuit Branch of the China Semiconductor Industry Association. 

Min LU  Director of Electrical Engineering Department, School of Mechanical and Electrical Engineering, Shihezi University

Lu Min，(1979-), Female, Professor, Doctor of Engineering, Director of Electrical Engineering Department, School of Mechanical and Electrical Engineering, Shihezi University, Evaluation expert of National Natural Science Foundation, Evaluation expert of Degree and Graduate Education Development Center of Ministry of Education, senior member of China Energy Society, expert of China Electric Power Association, member of the fourth Electrical Machinery Teaching Committee, member of Academic Bridge Evaluation Expert Database. 

Jianhua ZHANG  Prof. Of Shanghai University, China

Prof. Jianhua Zhang is the executive dean of School of microelectronics, Shanghai University. She won the National Science Fund for Distinguished Young Scholars in 2018. She is Yangtze River Scholar Distinguished Professor, Young and Youth Science and technology Innovation Leader s for scientific and technological innovation in the national 'ten thousand talents plan', and Science and Technology Innovation Leader.

Haohui LONG  Huawei Scientist，Huawei Postdoctoral Mentor，Chief Reliability Expert , Head of Display design for reliability & failure analysis Dept.

Haohui Long (Fellow, IES; Senior member, IEEE) received the Ph.D degree from National University of Singapore (NUS), in 2006, He received his B.S and M.S degrees from HUST, China in 1999 and 2002, respectively. After graduation at Nov.2005, he served as a failure analysis engineer with Hitachi Global Storage Technology. In 2007, he joined Chartered Semiconductor at Singapore as a senior Requalification engineer. He moved to NOKIA in 2008 as failure analysis specialist. 

Zhaojun LIU  Prof. of Southern University of Science and Technology

Hongbin CHENG

Cedar Electronics, China

Jintang SHANG  Prof. of Southeast University

Scott CHEN  Scott Chen, Sr. VP of Central Development Engineering in ASE (Advanced Semiconductor Engineering ).

Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs. 

Jian CUI

Peking University

Daquan YU  Distinguished Professor of Xiamen University，Founder of Xiamen Sky Semiconductor Co., Ltd

Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the founder of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. Before that, he was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 200 peer-reviewed technical publications and holds more than 70 patents. 

Yanhong TIAN  Tenured Professor at the Harbin Institute of Technology，Vice director of the State Key Laboratory of Advanced Welding and Joining

Dr. Yanhong Tian is currently a Tenured Professor at the Harbin Institute of Technology and the vice director of the State Key Laboratory of Advanced Welding and Joining. She is a National High-level Talent, received the Excellent Young Scientists Fund of the National Natural Science Foundation of China, and the Funding of New Century Excellent Talents from the Ministry of Education of China. Her research interests are advanced packaging technology and reliability, flexible printed electronic materials and devices.

Pan GAO  Vice Dean of the Information Science and Technology（School Of Cyber Science and Engineering）, Shihezi University

Dr. Gao Pan，boned in 1981, he is now associate dean, professor, doctoral supervisor of the School of Information Science and Technology, Shihezi University.He is member of the Chinese Association of Artificial Intelligence, member of the IEEE IES China Intelligent Agriculture and Forestry Technology Committee, and member of the Xinjiang Institute of Computer Education. His main research interests are image understanding and intelligent information processing. He has presided 2 National Natural Science Foundation projects and 12 provincial scientific research projects.

Guotao DUAN

Huazhong University of Science and Technology, China