Chairs |

| Jingbin LI Dean of the College of Mechanical and Electrical Engineering ,Shihezi University
Li Jingbin is a Professor and Ph.D. supervisor, Dean of the College of Mechanical and Electrical Engineering, and Academic leader for Agricultural Engineering at Shihezi University. Also, he is a council member of the Chinese Society of Agricultural Engineering, Animal Husbandry Engineering Branch of China Agricultural Engineering Society, Agricultural Society of Xinjiang Uygur Autonomous Region, and a committee member of the Agricultural Mechanization Branch of the Chinese Society of Agricultural Machinery. |

| Liqiang CAO Prof. of Institute of Microelectronics of Chinese Academy of Sciences, China CAO Liqiang,Research Interests : System Level Packaging and 3D Integration. Now Deputy Director and professor of Institute of microelectronics, Chinese Academy of Sciences. As the project leader and technical backbone, he has participated in 8 national scientific research projects, including major national science and technology projects and key projects of National Natural Science Foundation of China. |
Co-Chairs |

| Fei XIAO Prof. of Fudan University, China |

| Yong LIU Chief Engineer of Fairchild, USA Dr. Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015. |

| Rong SUN Professor and director of the institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences、Director of the Center for Advanced Electronic Materials at SIAT、Dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT.
Rong Sun is the director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). She is also the founding dean of Shenzhen Institute of Advanced Electronic Materials. She is doctoral supervisor, senior member of IEEE, State Council special allowance expert, and was selected as top 2% global scientists released by Stanford University in 2021. |

| Ming LI Prof. of Shanghai Jiao Tong University, China |

| Dr. Daniel SHI, Vice President, Hong Kong Applied Science and Technology Research Institute Dr SHI has 30 years of working experience in advanced semiconductor field, including 3rd generation semiconductor. Before joining ASTRI in 2007, he had worked at the City University of Hong Kong, Singapore Institute of Manufacturing Technology, Philips and Intel in different research and management positions. Dr SHI has published more than 120 international journal and conference papers. He has 30 granted patents. He received First Prize of the 2020 State Science & Technology Progress Award. |

| Zhigang LI Dean of the Information Science and Technology(School Of Cyber Science and Engineering), Shihezi University
Dr. Zhigang LI,Professor, Doctoral Supervisor.Dean of the Information Science and Technology(School Of Cyber Science and Engineering), Shihezi University, China.Director of Xinjiang Production & Construction Corps Key Laboratory of Computing Intelligence and Network Information Security, China. |

| Wenhui ZHU Prof. of Central South University, China
Prof. Wenhui Zhu is professor with Central South University, China and Founder of Changsha AMQ Intelligent Technology Pte Ltd. He was elected as National Elite Talent. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He was Chief Scientist of 973 program on IC wafer level 3D integration, and has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon and UTAC. |
Secretary |
Hongkun WANG | The College of Mechanical and Electrical Engineering ,Shihezi University |
Pan GAO | The Information Science and Technology(School Of Cyber Science and Engineering), Shihezi University |