Chairs |
| Yun-Hui Mei Pro. of School of Electrical Engineering, Tiangong University
Mei Yunhui is a professor and executive dean of the School of Electrical Engineering, Tiangong University. He has long been engaged in the research of power electronic device packaging and reliability. In recent years, he has presided over more than 30 projects, including the national science foundation of China (NSFC) outstanding youth fund project, the Tianjin municipal distinguish youth fund project, the national defense project, aviation fund, Huawei, Azure Automobile, Huichuan Technology, etc. He has also participated in the key projects of the National Fund, 863 projects. He is the director of the China Power Supply Society, deputy director of the Component Committee, deputy director of the Expert Advisory Committee, IEEE Senior Member, editorial board member of the Journal of Power Supply, deputy director of the Tianjin Power Supply Society, etc. |
| Qidong WANG Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSc degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. |
Co-Chairs |
| Fei XIAO Prof. of Fudan University, China Associate Professor and Professor at the Department of Materials Science, Fudan University; 2000.3 -2000.12 Visiting scholar at the National Science Foundation Coatings Research Center at the University of East Michigan in the United States; 2005.1 -2006.11 Visiting scholar at the Electronic Packaging Research Center of the National Science Foundation of Georgia Institute of Technology in the United States. The main research directions are electronic packaging materials, processes and reliability, and organic optoelectronic materials. |
| Yong LIU Chief Engineer of Fairchild, USA Dr. Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015. |
| Rong SUN Professor and director of the institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences、Director of the Center for Advanced Electronic Materials at SIAT、Dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT.
Rong Sun is the director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). She is also the founding dean of Shenzhen Institute of Advanced Electronic Materials. She is doctoral supervisor, senior member of IEEE, State Council special allowance expert, and was selected as top 2% global scientists released by Stanford University in 2021. |
| Wenhui ZHU Prof. of Central South University, China
Prof. Wenhui Zhu is professor with Central South University, China and Founder of Changsha AMQ Intelligent Technology Pte Ltd. He was elected as National Elite Talent. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He was Chief Scientist of 973 program on IC wafer level 3D integration, and has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon and UTAC. |
| Jingbin Li Dean of the College of Mechanical and Electrical Engineering, Shihezi University Leading figure in the field of agricultural engineering. He is council member of the Chinese Society of Agricultural Engineering, Animal Husbandry Engineering Branch of China Agricultural Engineering Society, Agricultural Society of Xinjiang Uygur Autonomous Region, and a committee member of the Agricultural Mechanization Branch of the Chinese Society of Agricultural Machinery. His research interests are developing and applying the key technologies and equipment for the mechanical production of Xinjiang specialty crops, key technologies and equipment for livestock breeding, and image acquisition and processing systems. |
| Dr. Hongwei LIANG Executive Vice-President of School of Microelectronics, Dalian University of Technology, China Professor Hongwei Liang, Vice Dean of School of Microelectronics, Dalian University of Technology, Director of Dalian Key Laboratory of Wide Bandgap Semiconductor Device Integration and System. He received his Ph.D. from Chinese Academy of Sciences. He is currently a member of the Nuclear Electronics and Nuclear Detection Technology Branch of the Chinese Institute of Electronics and a member of the Young Scientists Club, and a special expert of the Expert Committee of the Talent Reserve Base of the Integrated Circuit Branch of the China Semiconductor Industry Association. |
| Scott CHEN Scott Chen, Sr. VP of Central Development Engineering in ASE (Advanced Semiconductor Engineering ). Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs. |
| Dr. Chengqiang CUI Professor of Guangdong University of Technology, China Professor of Guangdong University of Technology (GDUT)and CEO of Guang Dong FoZhiXin microelectronics Technology Research Co.Ltd. He received his PhD in Chemistry from the University of Essex (ESSEX) in 1991, bachelor's and master's degrees in Department of Chemical Engineering , Tianjin University in 1983 and 1985, respectively. He has hosted various national R&D projects including national 02 project and 863 project. He has almost 30 years’ experience in the development and production of microelectronic advanced packaging technology and materials, especially, high-density packaging substrates. |
| Yifan GUO, Shanghai Yibu Semiconductor Co., Ltd., Co-Founder Guo obtained a Ph.D. in Engineering Science in the United States in 1988. Afterwards, Guo worked for many years at globally renowned high-tech companies such as IBM, Motorola, Skyworks, and ASE. Dr. Guo obtained a Master of Business Administration (MBA) degree in the United States in 2005 and currently serves as the Executive Vice President of Yibu Semiconductor Co., Ltd. |
Secretary |
Longnv LI | Tiangong University |