TECHNICAL COMMITTEE
Chairs

TECHNICAL COMMITTEE

Daquan YU

Prof. of Xiamen University, China

TECHNICAL COMMITTEE

Liqiang CAO

Prof. of Institute of Microelectronics of Chinese Academy of Sciences, China

Co-Chairs

TECHNICAL COMMITTEE

Chiming LAI

CEO’s special adviser of JCET Group

TECHNICAL COMMITTEE

Fei XIAO

Prof. of Fudan University, China

TECHNICAL COMMITTEE

Sheng LIU

Prof. of Wuhan University, China

TECHNICAL COMMITTEE

Jian CAI

Prof. of Tsinghua University, China

Yong LIU

Chief Engineer of Fairchild, USA

TECHNICAL COMMITTEE

Yanhong TIAN

Prof. of Harbin Institute of Technology, China

TECHNICAL COMMITTEE

Rong SUN

Prof. of Shenzhen Institutes of Advanced Technology, CAS, China

TECHNICAL COMMITTEE

Fei QIN

Prof. of Beijing University of Technology, China

TECHNICAL COMMITTEE

Daoguo YANG

Prof. of Guilin University of Electronic Technology, China

TECHNICAL COMMITTEE

Ming LI

Prof. of Shanghai Jiao Tong University, China

TECHNICAL COMMITTEE

Daniel SHI

Senior Director of ASTRI, HK, China

TECHNICAL COMMITTEE

Mingliang HUANG

Prof. of Dalian University of Technology, China

Secretary

TECHNICAL COMMITTEE

Qijin CHENG

A/Prof. of Xiamen University, China

TECHNICAL COMMITTEE

Yi ZHONG

A/Prof. of Xiamen University, China


Session 1 – Advanced Packaging


Chairs
Yifan GUO

ASE

Qidong WANG

Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China

Members

Bing DANG

IBM, USA

Li ZHANG

 Zhexin Semiconductor (Zhejiang)Co.,Ltd 

Guoping ZHANG

Shenzhen Institute of Advanced Technology, CAS, China

Xiangmeng JING

HiSilicon, China 

Teng WANG

MIXOSENSE, China

Shuying MA

Huatian Technology (Kunshan) Electronics Co., Ltd, China

Feng JIANG

Xiamen Sky Semiconductor, China

Qian WANG

Tsinghua University, China

Chengqian Wang

Wuxi Zhongwei High-tech Electronics Co.,Ltd., China

Daping YAO

Zhongke Zhixin, China

Fengwei DAI

NCAP, China

Qian LI

NAURA Technology Group Co., Ltd, China


Session 2 – Packaging Materials & Processes


Chairs
Zhiquan LIU

Shenzhen institute of advanced technology, CAS, China

Tao HANG

Shanghai Jiao Tong University, China

Members

Guisheng ZOU

Tsinghua University, China

Yanhong TIAN

Harbin Institute of Technology, China 

Zhuo LI

Fudan University, China

Mingliang HUANG

Dalian University of Technology, China

Jingdong GUO

Institute of Metal Research, CAS, China

Fengwen MU

Institute of Microelectronics, CAS, China

Panju SHANG 

Huawei Technologies Co., Ltd., China 

Liang ZHANG

Jiangsu Normal University, China

Caifu LI

Sun Yat-sen University, China

C. Robert KAO

National Taiwan University, Taiwan, China

Chih CHEN

National Chiao Tung University, Taiwan, China

Hiroshi NISHIKAWA

Osaka University, Japan


Session 3 – Packaging Design & Modeling


Chairs
Jun WANG

Fudan University, China

Min MIAO

Beijing Information Science and Technology University, China

Members

Jun LI

IMECAS, China

Daoguo YANG

Guilin University of Electronic Technology, China

Pei CHEN

Beijing University of Technology, China

Hua LU

Greenwich University, UK

Xiaowu ZHANG

Institute of Microelectronics (IME),Singapore

Haibo FAN

Nexperia Hong Kong, HK, China

Xinping ZHANG

South China University of Technology, China

Hu HE

Central South University, China

Daohui LI

Dynex Semiconductor Ltd., UK

Xu LONG

Northwestern Polytechnical University, China

Hongbo QIN

Guilin University of Electronic Technology, China

Tonglong ZHANG

Huawei Technologies Co. Ltd, China

Changxing WEI

Zhejiang University, China

Lei SHAN

IBM,USA

Hongbin SHI

Huawei Technologies Co. Ltd, China


Session 4 – Interconnection Technologies


Chairs
Jian CAI

Tsinghua University, China

Xin GU

Shennan Circuit Co., Ltd., China

Members

Lingzhi CHEN

JCETGroupCo. LTD, China

Zhuo CHEN

Central South University, China

Jun LI

Shennan Circuit Co., Ltd., China

Yingxia LIU

Beijing Institute of Technology, China

Ziyu LIU

Fudan University, China

CS TAN

National Technology University, Singapore

Chenxi WANG

Harbin Institute of Technology, China

Chaoqi ZHANG

Qualcomm Inc., USA

Dingyou ZHANG

Broadcom Inc., USA

Ning ZHAO

Dalian University of Technology, China

Yi ZHONG

Xiamen University, China

Yu ZhangGuangdong University of Technology, China




Session 5 – Advanced Manufacturing 


Chairs
Sheng LIU

Wuhan University, China

Chengqiang CUI

Guangdong University of Technology, China

Members

Qiushi XIE

NAURA Technology Group Co., Ltd., China

Zhiyin GAN

Huazhong University of Science and Technology, China

Fuping CHEN

ACM Shanghai, China

Hongjie WANG

TF-AMD, China

Fulong ZHU

Huazhong University of Science and Technology, China

Haitao SHI

JCET Group Co., Ltd., China

Xinjun ZHOU

InnoLight Technology (Suzhou), China

Yi SONG

Wuhan University, China

Fuliang WANG

Central South University

Ning ZHAO

Dalian University of Technology, China

Yi ZHONG

Xiamen University, China


Session 6 – Quality & Reliability


Chairs
Fei QIN

Beijing University of Technology, China

Yunfei EN

The 5th Institute of MIIT, China

Members

Bin LIU

Intel Asia-Pacific Research & Development Ltd., China

Weiqiang LI

Huawei Technologies Co., Ltd., China

Jianli ZHANG

BYD Company Limited, China

Andy DAI

Coresing Semiconductor Technology Co., Ltd., China

Zhiwen CHEN

Wuhan University, China

Ke XUE

Southern University of Science and Technology, China

Bin XIE

Applied Science and Technology Research Institute (ASTRI), Hong Kong, China

Wayne LIN

Shenzhen Institute of Wide-Bandgap Semiconductors, China

Puqi NING

Institute of Electrical Engineering, Chinese Academy of Sciences, China

Miao CAI

Guilin University of Electronic Technology, China

Yanwei DAI

Beijing University of Technology, China

Xuefei MING

Wuxi Zhongwei Hi-technology Corporation, China


Session 7 – Power Electronics


Chairs
Huaiyu YE

Shenzhen Institute of Wide-Bandgap Semiconductors, China

Ziyang GAO

Applied Science and Technology Research Institute (ASTRI), Hong Kong, China

Members

Yuhua CHENG

Peking University, China

Qinsong QIAN

Southeast University, China

Shunfeng LI

Huagong Semi, China

Hongyu YU

South University of Science and Technology of China, China

Jefferson HSU

Great Team Backend Foundry, Inc., TW, China

Zhaozheng HOU

Huawei, China

Bin ZHANG

ZTE, China

Yunhui MEI

Tianjin University, China

Weiwei HE

Basic, China

Joyce WANG

EPC Corporation, USA

Jimmy LIU

GaN Systems, Canada


Session 8 – Optoelectronics and New Display


Chairs
Jianhua ZHANG

Shanghai University, China

Fengman LIU

Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China

Members

Honglong NING

South China University of Technology

Luqiao YIN

Shanghai University

Hongbin CHENG

Cedar Electronics, China

Zhaojun LIU

Southern University of Science and Technology, China

Yu SUN

National center for advanced packaging, China

Yi LUO 

Dalian University of Technology, China

Liancheng WANG

Central South University, China

Guoqiao TAO

Ampleon Netherlands BV, Netherlands

Jifang TAO

Shandong University, China

Haiyun XUE

Institute of Microelectronics of Chinese Academy of Sciences, China

Yaming FAN

Sinano, China

Ping CHEN

Institute of Semiconductors of Chinese Academy of Sciences, China

Yijun LU

Xiamen University, China

Haohui LONGHUAWEI device company


Session 9 – MEMS, Sensor &IoT


Chairs
Shenglin MA

Xiamen University, China

Chaoyang XING

Beijing Aerospace Control Instrument Research Institute, China

Members

Daowei WU

Xi'an Institute of Microelectronics Technology, China

Liulin HU

Southwest China Research Institute of Electronic Equipment, China

Bin ZHOU

The 5th Institute of MIIT, China

Lin GUI

Technical Institute of Physics and Chemistry(CAS), China

Xiangzhong CHEN

Department of Mechanical and Process Engineering, Swiss Federal Institute of Technology in Zurich (ETHZ),Switzerland

Yi LUO 

Dalian University of Technology, China

Liancheng WANG

National center for advanced packaging, China

Chunrong PENG

Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), China

Guangyi SHI

Wuxi Beiwei Sensor Technology Co., Ltd.,China

Guoqiang WU

Wuhan University,China

Guotao DUAN

Huazhong University of Science and Technology, China

Jian WANG

Beijing Institute of Telemetry Technology, China

Yunna SUN

Shanghai Jiao Tong University, China

Binzhen ZHANG

North University of China, China

Bin QI

Jiangsu Duowei Technology Co., Ltd., China

Min ZHANG

Peking University ShenZhen Graduate School, China

Qiannan XUE

Tianjin University, China


Session 10 – Emerging Technologies


Chairs
Jintang SHANG

Southeast University, China

Cheng LI

Xiamen University, China

Members

Guannan YANG

Guangdong University of Technology, China

Gaowei XU

Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, China

Xiuzhen LU

Shanghai University, China

Jun ZHANG

Guangdong University of Technology, China

Hongbin SHI

Huawei Technologies Co., Ltd., China

Hongwen HE

Hisilicon Technologies Co., Ltd., China

Shuhui YU

Shenzhen institute of advanced technology, CAS, China

Hui TANG 

Guangdong University of Technology, China

Yan ZHANG

Shanghai University, China

Mingbin YU

Shanghai Institute of Microsystem & Information Technology