| Chairs |
| Daquan YU
Prof. of Xiamen University, China
|
| Liqiang CAO
Prof. of Institute of Microelectronics of Chinese Academy of Sciences, China
|
| Co-Chairs |
| Chiming LAI CEO’s special adviser of JCET Group |
| Fei XIAO Prof. of Fudan University, China |
| Sheng LIU
Prof. of Wuhan University, China |
| Jian CAI Prof. of Tsinghua University, China |
| Yong LIU | Chief Engineer of Fairchild, USA |
| Yanhong TIAN
Prof. of Harbin Institute of Technology, China |
| Rong SUN
Prof. of Shenzhen Institutes of Advanced Technology, CAS, China |
| Fei QIN
Prof. of Beijing University of Technology, China |
| Daoguo YANG
Prof. of Guilin University of Electronic Technology, China |
| Ming LI
Prof. of Shanghai Jiao Tong University, China |
| Daniel SHI Senior Director of ASTRI, HK, China |
| Mingliang HUANG
Prof. of Dalian University of Technology, China
|
| Secretary |
| Qijin CHENG
A/Prof. of Xiamen University, China |
| Yi ZHONG
A/Prof. of Xiamen University, China |
Session 1 – Advanced Packaging
| Chairs |
| Yifan GUO | ASE |
| Qidong WANG | Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China |
| Members |
Bing DANG | IBM, USA |
| Li ZHANG | Zhexin Semiconductor （Zhejiang）Co.，Ltd |
| Guoping ZHANG | Shenzhen Institute of Advanced Technology, CAS, China |
| Xiangmeng JING | HiSilicon, China |
| Teng WANG | MIXOSENSE, China |
| Shuying MA | Huatian Technology (Kunshan) Electronics Co., Ltd, China |
| Feng JIANG | Xiamen Sky Semiconductor, China |
| Qian WANG | Tsinghua University, China |
Chengqian Wang | Wuxi Zhongwei High-tech Electronics Co.,Ltd., China |
Daping YAO | Zhongke Zhixin, China |
| Fengwei DAI | NCAP, China |
Qian LI | NAURA Technology Group Co., Ltd, China
|
Session 2 – Packaging Materials & Processes
| Chairs |
| Zhiquan LIU | Shenzhen institute of advanced technology, CAS, China |
| Tao HANG | Shanghai Jiao Tong University, China |
| Members |
Guisheng ZOU | Tsinghua University, China |
Yanhong TIAN
| Harbin Institute of Technology, China
|
Zhuo LI | Fudan University, China |
Mingliang HUANG
| Dalian University of Technology, China
|
Jingdong GUO | Institute of Metal Research, CAS, China |
| Fengwen MU | Institute of Microelectronics, CAS, China |
Panju SHANG | Huawei Technologies Co., Ltd., China |
Liang ZHANG
| Jiangsu Normal University, China
|
Caifu LI | Sun Yat-sen University, China |
C. Robert KAO
| National Taiwan University, Taiwan, China
|
Chih CHEN | National Chiao Tung University, Taiwan, China |
| Hiroshi NISHIKAWA | Osaka University, Japan
|
Session 3 – Packaging Design & Modeling
| Chairs |
| Jun WANG | Fudan University, China |
| Min MIAO | Beijing Information Science and Technology University, China |
| Members |
Jun LI | IMECAS, China |
Daoguo YANG | Guilin University of Electronic Technology, China |
Pei CHEN | Beijing University of Technology, China |
| Hua LU | Greenwich University, UK |
Xiaowu ZHANG | Institute of Microelectronics (IME),Singapore |
Haibo FAN | Nexperia Hong Kong, HK, China |
Xinping ZHANG | South China University of Technology, China |
| Hu HE | Central South University, China
|
| Daohui LI | Dynex Semiconductor Ltd., UK |
| Xu LONG | Northwestern Polytechnical University, China |
| Hongbo QIN | Guilin University of Electronic Technology, China |
| Tonglong ZHANG | Huawei Technologies Co. Ltd, China |
| Changxing WEI | Zhejiang University, China |
| Lei SHAN | IBM，USA |
| Hongbin SHI | Huawei Technologies Co. Ltd, China |
Session 4 – Interconnection Technologies
| Chairs |
| Jian CAI | Tsinghua University, China |
| Xin GU | Shennan Circuit Co., Ltd., China |
| Members |
Lingzhi CHEN | JCETGroupCo. LTD, China |
Zhuo CHEN | Central South University, China |
Jun LI | Shennan Circuit Co., Ltd., China |
| Yingxia LIU | Beijing Institute of Technology, China |
Ziyu LIU | Fudan University, China |
CS TAN | National Technology University, Singapore |
Chenxi WANG | Harbin Institute of Technology, China |
| Chaoqi ZHANG | Qualcomm Inc., USA |
| Dingyou ZHANG | Broadcom Inc., USA |
| Ning ZHAO | Dalian University of Technology, China |
| Yi ZHONG | Xiamen University, China |
Session 5 – Advanced Manufacturing
| Chairs |
| Sheng LIU | Wuhan University, China |
| Chengqiang CUI | Guangdong University of Technology, China |
| Members |
Qiushi XIE | NAURA Technology Group Co., Ltd., China |
Zhiyin GAN | Huazhong University of Science and Technology, China |
Fuping CHEN | ACM Shanghai, China |
| Hongjie WANG | TF-AMD, China |
Fulong ZHU | Huazhong University of Science and Technology, China |
Haitao SHI | JCET Group Co., Ltd., China |
Xinjun ZHOU | InnoLight Technology (Suzhou), China |
| Yi SONG | Wuhan University, China |
| Fuliang WANG | Central South University |
| Ning ZHAO | Dalian University of Technology, China |
| Yi ZHONG | Xiamen University, China |
Session 6 – Quality & Reliability
| Chairs |
| Fei QIN | Beijing University of Technology, China |
| Yunfei EN | The 5th Institute of MIIT, China |
| Members |
Bin LIU | Intel Asia-Pacific Research & Development Ltd., China |
Weiqiang LI | Huawei Technologies Co., Ltd., China |
Jianli ZHANG | BYD Company Limited, China |
| Andy DAI | Coresing Semiconductor Technology Co., Ltd., China |
Zhiwen CHEN | Wuhan University, China |
Ke XUE | Southern University of Science and Technology, China |
Bin XIE | Applied Science and Technology Research Institute (ASTRI), Hong Kong, China |
| Wayne LIN | Shenzhen Institute of Wide-Bandgap Semiconductors, China |
| Puqi NING | Institute of Electrical Engineering, Chinese Academy of Sciences, China |
| Miao CAI | Guilin University of Electronic Technology, China |
| Yanwei DAI | Beijing University of Technology, China |
| Xuefei MING | Wuxi Zhongwei Hi-technology Corporation, China |
Session 7 – Power Electronics
| Chairs |
| Huaiyu YE | Shenzhen Institute of Wide-Bandgap Semiconductors, China |
| Ziyang GAO | Applied Science and Technology Research Institute (ASTRI), Hong Kong, China |
| Members |
Yuhua CHENG | Peking University, China |
Qinsong QIAN | Southeast University, China |
Shunfeng LI | Huagong Semi, China |
| Hongyu YU | South University of Science and Technology of China, China |
Jefferson HSU | Great Team Backend Foundry, Inc., TW, China |
Zhaozhen HOU | Huawei, China |
Bin ZHANG | ZTE, China |
| Yunhui MEI | Tianjin University, China |
| Weiwei HE | Basic, China |
| River LI | Applied Science and Technology Research Institute (ASTRI), HK, China |
| Joyce WANG | EPC Corporation, USA |
| Jimmy LIU | GaN Systems, Canada |
Session 8 – Optoelectronics and New Display
| Chairs |
| Jianhua ZHANG | Shanghai University, China |
| Fengman LIU | Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China |
| Members |
Honglong NING | South China University of Technology |
Luqiao YIN | Shanghai University |
Hongbin CHENG | Cedar Electronics, China |
| Zhaojun LIU | Southern University of Science and Technology, China |
Yu SUN | National center for advanced packaging, China |
Yi LUO | Dalian University of Technology, China |
Liancheng WANG | Central South University, China |
| Guoqiao TAO | Ampleon Netherlands BV, Netherlands |
| Jifang TAO | Shandong University, China |
| Haiyun XUE | Institute of Microelectronics of Chinese Academy of Sciences, China |
| Yaming FAN | Sinano, China |
| Ping CHEN | Institute of Semiconductors of Chinese Academy of Sciences, China |
| Yijun LU | Xiamen University, China |
| Haohui LONG | HUAWEI device company |
Session 9 – MEMS, Sensor &IoT
| Chairs |
| Shenglin MA | Xiamen University, China |
| Chaoyang XING | Beijing Aerospace Control Instrument Research Institute, China |
| Members |
Daowei WU | Xi'an Institute of Microelectronics Technology, China |
Liulin HU | Southwest China Research Institute of Electronic Equipment, China |
Bin ZHOU | The 5th Institute of MIIT, China |
| Lin GUI | Technical Institute of Physics and Chemistry(CAS), China |
Xiangzhong CHEN | National center for advanced packaging, China |
Yi LUO | Dalian University of Technology, China |
Liancheng WANG | Department of Mechanical and Process Engineering, Swiss Federal Institute of Technology in Zurich (ETHZ),Switzerland |
| Chunrong PENG | Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), China |
| Guangyi SHI | Wuxi Beiwei Sensor Technology Co., Ltd.,China |
| Guoqiang WU | Wuhan University,China |
| Guotao DUAN | Huazhong University of Science and Technology, China |
| Jian WANG | Beijing Institute of Telemetry Technology, China |
| Yunna SUN | Shanghai Jiao Tong University, China |
| Binzhen ZHANG | North University of China, China |
| Bin QI | Jiangsu Duowei Technology Co., Ltd., China |
| Min ZHANG | Peking University ShenZhen Graduate School, China |
| Qiannan XUE | Tianjin University, China |
Session 10 – Emerging Technologies
| Chairs |
| Jintang SHANG | Southeast University, China |
| Cheng LI | Xiamen University, China |
| Members |
Guannan YANG | Guangdong University of Technology, China |
Gaowei XU | Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, China |
Xiuzhen LU | Shanghai University, China |
| Jun ZHANG | Guangdong University of Technology, China |
Hongbin SHI | Huawei Technologies Co., Ltd., China |
Hongwen HE | Hisilicon Technologies Co., Ltd., China |
Shuhui YU | Shenzhen institute of advanced technology, CAS, China |
| Hui TANG | Guangdong University of Technology, China |
| Yan ZHANG | Shanghai University, China |
| Mingbin YU | Shanghai Institute of Microsystem & Information Technology |