TECHNICAL COMMITTEE
Chairs

TECHNICAL COMMITTEE

Yun-Hui Mei Pro. of School of Electrical Engineering, Tiangong University

Mei Yunhui is a professor and executive dean of the School of Electrical Engineering, Tiangong University. He has long been engaged in the research of power electronic device packaging and reliability. In recent years, he has presided over more than 30 projects, including the national science foundation of China (NSFC) outstanding youth fund project, the Tianjin municipal distinguish youth fund project, the national defense project, aviation fund, Huawei, Azure Automobile, Huichuan Technology, etc. He has also participated in the key projects of the National Fund, 863 projects. He is the director of the China Power Supply Society, deputy director of the Component Committee, deputy director of the Expert Advisory Committee, IEEE Senior Member, editorial board member of the Journal of Power Supply, deputy director of the Tianjin Power Supply Society, etc.

TECHNICAL COMMITTEE

Qidong WANG  Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences.

Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSc degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. 

Co-Chairs

TECHNICAL COMMITTEE

Fei XIAO Prof. of Fudan University, China

Associate Professor and Professor at the Department of Materials Science, Fudan University; 2000.3 -2000.12 Visiting scholar at the National Science Foundation Coatings Research Center at the University of East Michigan in the United States; 2005.1 -2006.11 Visiting scholar at the Electronic Packaging Research Center of the National Science Foundation of Georgia Institute of Technology in the United States. The main research directions are electronic packaging materials, processes and reliability, and organic optoelectronic materials.

TECHNICAL COMMITTEE

Yong LIU  Chief Engineer of Fairchild, USA

Dr. Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015.

TECHNICAL COMMITTEE

Rong SUN  Professor and director of the institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences、Director of the Center for Advanced Electronic Materials at SIAT、Dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT.

Rong Sun is the director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Science (CAS). She is also the founding dean of Shenzhen Institute of Advanced Electronic Materials. She is doctoral supervisor, senior member of IEEE, State Council special allowance expert, and was selected as top 2% global scientists released by Stanford University in 2021.

TECHNICAL COMMITTEE

Wenhui ZHU  Prof. of Central South University, China

Prof. Wenhui Zhu is professor with Central South University, China and Founder of Changsha AMQ Intelligent Technology Pte Ltd. He was elected as National Elite Talent. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He was Chief Scientist of 973 program on IC wafer level 3D integration, and has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon and UTAC.

TECHNICAL COMMITTEE

Jingbin Li  Dean of the College of Mechanical and Electrical Engineering, Shihezi University

Leading figure in the field of agricultural engineering. He is council member of the Chinese Society of Agricultural Engineering, Animal Husbandry Engineering Branch of China Agricultural Engineering Society, Agricultural Society of Xinjiang Uygur Autonomous Region, and a committee member of the Agricultural Mechanization Branch of the Chinese Society of Agricultural Machinery. His research interests are developing and applying the key technologies and equipment for the mechanical production of Xinjiang specialty crops, key technologies and equipment for livestock breeding, and image acquisition and processing systems.

TECHNICAL COMMITTEE

Dr. Hongwei LIANG  Executive Vice-President of School of Microelectronics, Dalian University of Technology, China

Professor Hongwei Liang, Vice Dean of School of Microelectronics, Dalian University of Technology, Director of Dalian Key Laboratory of Wide Bandgap Semiconductor Device Integration and System. He received his Ph.D. from Chinese Academy of Sciences. He is currently a member of the Nuclear Electronics and Nuclear Detection Technology Branch of the Chinese Institute of Electronics and a member of the Young Scientists Club, and a special expert of the Expert Committee of the Talent Reserve Base of the Integrated Circuit Branch of the China Semiconductor Industry Association. 

TECHNICAL COMMITTEE

Scott CHEN  Scott Chen, Sr. VP of Central Development Engineering in ASE (Advanced Semiconductor Engineering ).

Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs. 

TECHNICAL COMMITTEE

Dr. Chengqiang CUI  Professor of Guangdong University of Technology, China

Professor of Guangdong University of Technology (GDUT)and CEO of Guang Dong FoZhiXin microelectronics Technology Research Co.Ltd.  He received his PhD in Chemistry from the University of Essex (ESSEX) in 1991, bachelor's and master's degrees in Department of Chemical Engineering , Tianjin University in 1983 and 1985, respectively. He has hosted various national R&D projects including national 02 project and 863 project. He has almost 30 years’ experience in the development and production of microelectronic advanced packaging technology and materials, especially, high-density packaging substrates. 

TECHNICAL COMMITTEE

Yifan GUO, Shanghai Yibu Semiconductor Co., Ltd., executive vice president

Guo obtained a Ph.D. in Engineering Science in the United States in 1988. Afterwards, Guo worked for many years at globally renowned high-tech companies such as IBM, Motorola, Skyworks, and ASE. Dr. Guo obtained a Master of Business Administration (MBA) degree in the United States in 2005 and currently serves as the Executive Vice President of Yibu Semiconductor Co., Ltd.

Secretary
Longnv LITiangong University


Session 1 – Advanced Packaging


Chairs

TECHNICAL COMMITTEE

Wei  WANG  Peking University, Permanent professor, doctoral supervisor

In 1999, he received  Doctor's degree from the School of Aeronautics and Astronautics, Tsinghua University, the tutor of Academician Zengyuan.  After that, he joined the Department of Micro/Nano Electronics and the National Key Laboratory of Micro/Nano Processing Technology in the School of Information Science and Technology, Peking University.  Now he is the Executive Deputy Director of the National Key Laboratory of Micro/Nano Processing Technology and the Deputy Director of the Department of Micro/Nano Electronics, Peking University.  Director, Institute of Integrated Micro/Nano Systems (MEMS), Peking University. 

TECHNICAL COMMITTEE

Qidong WANG  Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences.

Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSc degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences. 

Members
Shuan DUHygon
Hongwen HEPayton Technology (Shenzhen) Co., Ltd.
LiYI LISOUTHEAST UNIVERSITY
Yifei LUShanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
Shenglin MAXIAMEN UNIVERSITY
Min MIAOBeijing Information Science and Technology University
Xuefei MINGThe 58th Research Institute, CETC
Junlei TAOHiSilicon Technologies Co.,limited
Zhaohuan TANGCHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
Junsha WANGTHE UNIVERSITY OF TOKYO
Qian WANGTsinghua University
Daowei WUThe 771st Research Institute, CASC
Cheng YANGJCET Group
Shuye ZHANGHARBIN INSTITUTE OF TECHNOLOGY
Hongze ZHANGThe 55th Research Institute, CETC
Kai ZHENGSemiconductor Technology Innovation Center


Session 2 – Packaging Materials & Processes


Chairs

TECHNICAL COMMITTEE

Zhiquan LIU  Group Leader in Shenzhen Institute of Advanced Technology (SIAT) Chinese Academy of Sciences (CAS)、Doctoral Supervisor of University of Chinese Academy of Sciences (UCAS).

Technology (SIAT) Chinese Academy of Sciences (CAS), and a Doctoral Supervisor of University of Chinese Academy of Sciences (UCAS). After graduated with PhD in April 2000, he worked in Japan for more than seven years, and then returned China as a Hundred Talent Scholar of CAS. His research expertise spans across property related microstructure characterization and phase transformation, focusing on microstructure and reliability of microelectronic interconnect materials. 

TECHNICAL COMMITTEE

Tao HANG  Full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University.

He has worked in the University of Michigan (US), Waseda University (Japan), and Northwestern University (US) as the visiting scholar and postdoctoral fellow for 5 years. Currently, he is a full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University. His research interest mainly focused 3D packaging materials and technology (interconnection, low temperature bonding), nanostructured materials and functional thin films fabricated by electrochemical method (electrodeposition, electro-grafting, electrochemical-etching). 

Members
Jieshi CHENShanghai University of Engineering Science
Chuantong CHENOsaka University, Japan
Liyin GAOShenzhen Institute of Advanced Technology, CAS, China
Xiaowu HUNanchang University, China
Hongjun JIHarbin Institute of Technology (Shenzhen), China
Changqing LIULoughborough University, UK
Liyi LISoutheast University, China
Yujie LIHarbin Institute of Technology (Weihai), China
Liangliang LITsinghua University, China
Zhuo LIFudan University, China
Caifu LISun Yat-sen University, China
Haoran MADalian University of Technology
Fengwen MU Innovative Semiconductor Substrate Technology Co., Ltd., China
Huicai MABeijing Xiaomi Mobile Software Co., ltd 
Panju SHANGHuawei Technologies Co., Ltd., China
Junhe WANGHuawei Digital Power Technologies Co., Ltd.
Liang ZHANGXiamen University of Technology
Cong ZHANG Western Digital, China


Session 3 – Packaging Design & Modeling


Chairs

TECHNICAL COMMITTEE

Fengman LIU  Professor of Institute of Microelectronics of Chinese Academy of Sciences(CAS),China

Fengman Liu received the Ph.D.degree in Microelectronics and Solid-State Electronics from the Institute of Semiconductor of CAS. His research interests include System in Packaging,Wafer level packaging and optoelectronics hybrid integration. Prof. Fengman Liu has led and joined a number of research projects, including the National Key R&D Program of China, NSFC funding and and projects from enterprises. he has published over 60 papers ,hold over 30 patents and co-authored one book.

TECHNICAL COMMITTEE

Daoguo YANG  Professor of Guilin University of Electronic Technology、Duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices、Director of Guangxi Electronic Packaging and assembly technology Engineering Research Center.

Prof. Daoguo Yang received his Master degree from Zhejiang University, China, and Ph.D. from Delft University of Technology (TUDelft), the Netherlands. He is currently a professor of Guilin University of Electronic Technology and the duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices and the director of Guangxi Electronic Packaging and assembly technology Engineering Research Centre.

Members

Pei CHEN

Beijing University of Technology, China

Haibo FANNexperia Hong Kong, HK, China
Hu HECentral South University, China
Jun LIIMECAS, China
Xu LONGNorthwestern Polytechnical University, China
Min MIAOBeijing Information Science and Technology University, China
Hongbo QINGuilin University of Electronic Technology, China
Hongbin SHIHuawei Technologies Co. Ltd, China
Meiying SUIMECAS, China
Xingchang WEIZhejiang University, China
Jun WANGFudan University, China
Xiaowu ZHANGInstitute of Microelectronics (IME),Singapore
Tonglong ZHANGHuawei Technologies Co. Ltd, China


Session 4 – Interconnection Technologies


Chairs

TECHNICAL COMMITTEE

Jian CAI  Prof. of Tsinghua University, China

Graduated from the Department of Materials Science at Tsinghua University in July 1998 with a PhD in Engineering, as a postdoctoral researcher at the Hong Kong University of Science and Technology from 1999 to 2001, mainly engaging in the development and research of flip chip packaging technology; From 2001 to 2002, worked in technical research and development at Shenzhen Meilongxiang Company, leading the development of enhanced heat dissipation solder ball array packaging substrates; I have been working at the Institute of Microelectronics at Tsinghua University since 2002.

TECHNICAL COMMITTEE

Mingliang HUANG  Prof. of Dalian University of Technology, China

Prof. Dr. Mingliang Huang, Head of Laboratory for Electronic Packaging Materials, Dean of School of Materials Science & Engineering of Dalian University of Technology, Dalian, China. Experts in the national plan for ten thousand people, Young and Middle-aged talents in Science and Technology Innovation of the Ministry of Science and Technology, Humboldt Fellow. Research interest focuses on the advanced interconnection technology and materials in electronic packaging.

Members

Leida CHEN

Xi'an Institute of Microelectronics Technology, China

Zhuo CHENCentral South University, China
Yingzhuo HUANGBeijing Institute of Microelectronics Technology, China
Yongjun HUOBeijing Institute of Technology, China
Wangyun LIGuilin University of Electronic Technology
Pan LIUFudan University, China
Yingxia LIUCity University of Hong Kong, HONG KONG, China
Ziyu LIUFudan University, China
Shuying MAHuatian Technology (Kunshan) Electronics Co., Ltd,China
Bo PENGHuawei Technologies Co., Ltd
Chenxi WANGHarbin Institute of Technology, China
Tiwei WEIPurdue University,USA 
Yunwen WUShanghai Jiao Tong University, China
Chaoqi ZHANGQualcomm Inc., USA
Dingyou ZHANGBroadcom Inc., USA


Session 5 – Advanced Manufacturing 


Chairs

TECHNICAL COMMITTEE

Zhiwen CHEN  Wuhan University

Associate Professor. Zhiwen CHEN,  Master's and Doctoral Supervisors of Industrial Science Research Institute of Wuhan University, and teacher of Academician Liu Sheng's Research Group, mainly engaged in research on the mechanics and simulation of advanced packaging materials for chips. In the past five years, Chen has published 43 academic papers, obtained 6 invention patents (including 1 US patent), 2 PCTs, and 1 software copyright.

TECHNICAL COMMITTEE

Yu ZHANG  Associate Professor,  Master Supervisor of Guangdong University of Technology

In January 2016, ZHANG graduated from Shenzhen Institute of Advanced Technology, University of Chinese Academy of Sciences as Ph.D. , core member of "State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment Jointly Built by the Ministry of Education" and "Key Laboratory of Microelectronic Precision Manufacturing Technology and Equipment", and Class A talents introduced by the University's "100 Young Talents Program".He is mainly engaged in the research and development of advanced semiconductor packaging technologies and key materials such as microelectronics and power electronics, including micro-nano metal materials, flexible printed electronics, high-density three-dimensional interconnection technology and key materials.

Members
Lei DONGSoutheast University
Guanghan HUANGGuangdong University of Technology
Lingde KONGKunming Institute of Physics
Li LIUWuhan University of Technology
Shuibao LIANGHefei University of Technology
Liang TANGLizhu intelligent equipment (Tianjin) Co., Ltd.
Gaowei XUShanghai Institute of Microsystem and Information Technology
Lezhi YEBeijing University of Technology
Jianhong YANGChina Wafer Level CSP Co., Ltd.
Guannan YANGGuangdong University of Technology
Kenny YEPiotech
Zili ZHANGInstitute of Microelectronics of the Chinese Academy of Sciences
Fulong ZHUHuazhong University of Science and Technology, China
Wenbo ZHUHarbin Institute of Technology, Shenzhen


Session 6 – Quality & Reliability


Chairs

TECHNICAL COMMITTEE

Fei QIN  Prof. of Beijing University of Technology, China 

Director of the Institute of Electronic Packaging Technology and Reliability at Beijing Institute of Technology. He has been engaged in research on microelectronic packaging technology and reliability for a long time, and has formed his own characteristics in this field. In 2018, he officially established the Institute of Electronic Packaging Technology and Reliability. Hosted over 30 projects including the National Natural Science Foundation of China and major national projects, and published over 200 papers in core journals and academic conferences at home and abroad, including over 80 journal papers and over 100 conference papers.

TECHNICAL COMMITTEE

Xiaofeng YANG  Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT.

Xiaofeng YANG, received his M.Sc. and Ph.D. degrees from Xiamen University, Xiamen, China, in 2016 and 2020. Currently, he is a Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT. His main research interests include advanced packaging reliability technology, thermal-mechanial reliability, advanced sensing technology and flexible electronics. 

Members
Si CHENThe 5th Electronics Research Institute of MIIT
Yanwei DAIBeijing University of Technology
Yuzheng GUOWuhan University
Zhiyuan HEChina Electronic Product Reliability and Environmental Testing Research Institute
Jianhui LIUSky Chip Interconnection Technology Company., Ltd
Haitao MADalian University of Technology
Puqi NINGInstitute of Electrical Engineering, Chinese Academy of Sciences
Bin XIESmart Power & Energy Semi. Co., Limited (Shenzhen) 
Sha XUGuangdong University of Technology
Minglu XIAHong Kong Applied Science and Technology Research Institute Company Limited
Yi ZHONGXiamen University


Session 7 – Power Electronics


Chairs

TECHNICAL COMMITTEE

Huaiyu YE  Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech)

Prof. Huaiyu Ye, has received BS degree in Shanghai Jiao Tong University, China, MA degree and Ph.D. degree in Delft University of Technology, the Netherlands (TUDelft). Currently, he is Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech). He has worked in Materials innovation institute (M2i) and Netherlands Organisation for Applied Scientific Research (TNO) in Europe. He has also worked in Chongqing University as Senior Researcher from 2016 to 2019. He is the committee member of the IEEE International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power Electronics Committee of the Chinese Electrical Engineering Society, and ICEPT, CSEE, EuroSimE, China SSL & IFWS. 

TECHNICAL COMMITTEE

Zhaozheng HOU  Huawei Digital Power Technology Co., Ltd.
Members
Cai CHENHuazhong University of Soience And Technology
Ziyang GAOHong Kong Applied Science and Technology Research Institute
Fengze HOUInstitute of Microelectronics of the Chinese Academy of Sciences
Yan HUOSIPLP Microelectronics (Chongqing) Limited
Hongjun JI

Harbin Institute of Technology

Renkuan LIUUniversity of Electronic Science and Technology of China
Weijian PANHuawei Digital Power Technology Co., Ltd.
Mian TAOThe Hong Kong University of Science and Technology
Bin XIESmart Power & Energy Semi. Co. Ltd
Fengtao YANGXi’an Jiaotong University
Kexiong ZHANGDalian University of Technology
Gaojia ZHUTiangong University
Jing ZHANGHeraeus Materials Technology Shanghai Ltd


Session 8 – Optoelectronics and New Display


Chairs

TECHNICAL COMMITTEE

Jianhua ZHANG  Prof. Of Shanghai University, China

Prof. Jianhua Zhang is the executive dean of School of microelectronics, Shanghai University. She won the National Science Fund for Distinguished Young Scholars in 2018. She is Yangtze River Scholar Distinguished Professor, Young and Youth Science and technology Innovation Leader s for scientific and technological innovation in the national 'ten thousand talents plan', and Science and Technology Innovation Leader.

TECHNICAL COMMITTEE

Pingjuan Niu  Deputy Director of the Information Science Department of Tiangong University, Executive Vice Dean of the School of Electronic & Information Engineering

Director of the Ministry of Education Engineering Research Center for High Power Solid-state Lighting Application Systems, and Director of the Tianjin Solid-state Lighting Technology Engineering Center. She is also the head of the Semiconductor Light Source System Committee of the China Electrotechnical Society and Deputy Secretary General of CSA. Her main research areas include semiconductor light source systems and power electronic device technology. 

Members
Xingwei DingKey Lab of Advanced Display and System Applications Ministry of Edication
Weiling GUOBeijing University of Technology
Haiqiang JIA Institute of Physics, Chinese Academy of Sciences
Zhaojun LIUSouthern University of Science and Technology
Haohui LONGHuawei
Xiuzhen LuShanghai University
Xurui MAOInstitute of Semiconductors,Chinese Academy of Sciences 
Dajian WANGTianjin University of Technology
Zheng XUBeijing Jiaotong University
Jianjun XUBeijing KMT Technology Co., Ltd. 
Zihui ZHANGGuangdong University of Technology


Session 9 – MEMS, Sensors and IoT


Chairs

TECHNICAL COMMITTEE

Jintang SHANG  Prof. of Southeast University

From 2008 to 2009, As a visiting scholar, he went to the Microsystem Packaging Research Center at Georgia Institute of Technology in the United States. Currently, he is a professor and doctoral supervisor at the School of Electronic Science and Engineering, Southeast University. Main research interests include the manufacturing and packaging of microelectronic mechanical systems (MEMS), biological and nanomanufacturing and packaging, integrated circuit (IC) system integration packaging technology, and advanced packaging materials for microelectronic systems.

TECHNICAL COMMITTEE

Ke XIAO Shanghai Institute of Microsystems, CAS

As a senior expert in the field of electronic packaging, he graduated from Tsinghua University with a bachelor's degree in Materials Science and Engineering, and later obtained a doctoral degree from the Shanghai Institute of Microsystems, Chinese Academy of Sciences.He has held technical development and management positions in well-known companies such as Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., Intel, RFMD, etc., and has formed technical and operational teams multiple times. He has also published multiple packaging technology papers and related patents.

Members

Jian CUI

Peking University

Zhikuang CAINanjing University of Posts and Telecommunications
Scott CHENASE Group
Wenwen KONGXinjiang Institute of Physical and Chemical Technology, Chinese Academy of Sciences
Chenxi WANGHarbin Institute of Technology
Zhaoyang XING13th Research Institute of the 9th R&D and Production Complexes, CASC
Libo ZHAOXi'an Jiaotong University


Session 10 – Emerging Technologies


Chairs

TECHNICAL COMMITTEE

Daquan YU  Distinguished Professor of Xiamen University,Founder of Xiamen Sky Semiconductor Co., Ltd

Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the founder of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. Before that, he was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 200 peer-reviewed technical publications and holds more than 70 patents. 

TECHNICAL COMMITTEE

Yanhong TIAN  Tenured Professor at the Harbin Institute of Technology,Vice director of the State Key Laboratory of Advanced Welding and Joining

Dr. Yanhong Tian is currently a Tenured Professor at the Harbin Institute of Technology and the vice director of the State Key Laboratory of Advanced Welding and Joining. She is a National High-level Talent, received the Excellent Young Scientists Fund of the National Natural Science Foundation of China, and the Funding of New Century Excellent Talents from the Ministry of Education of China. Her research interests are advanced packaging technology and reliability, flexible printed electronic materials and devices.

Members
Guotao DUANHuazhong University of Science and Technology, China
Su DINGXidian University
Pan GAOShihezi University
Xiaoliang JI Beijing University of Technology
Lei LIUTsinghua University
Luchan LINShanghai Jiaotong University
Shenglin MAXiamen University
Ying TIANSichuan Institute of Aerospace Electronic Equipment
Guoqiang WUWuhan University,China
Shang WANGHarbin Institute of Technology
He ZHANGThe University of Hong Kong