Chairs |

| Daquan YU
Prof. of Xiamen University, China
|

| Liqiang CAO
Prof. of Institute of Microelectronics of Chinese Academy of Sciences, China
|
Co-Chairs |

| Chiming LAI CEO’s special adviser of JCET Group |

| Fei XIAO Prof. of Fudan University, China |

| Sheng LIU
Prof. of Wuhan University, China |

| Jian CAI Prof. of Tsinghua University, China |
Yong LIU | Chief Engineer of Fairchild, USA |

| Yanhong TIAN
Prof. of Harbin Institute of Technology, China |

| Rong SUN
Prof. of Shenzhen Institutes of Advanced Technology, CAS, China |

| Fei QIN
Prof. of Beijing University of Technology, China |

| Daoguo YANG
Prof. of Guilin University of Electronic Technology, China |

| Ming LI
Prof. of Shanghai Jiao Tong University, China |

| Daniel SHI Senior Director of ASTRI, HK, China |

| Mingliang HUANG
Prof. of Dalian University of Technology, China
|
Secretary |

| Qijin CHENG
A/Prof. of Xiamen University, China |

| Yi ZHONG
A/Prof. of Xiamen University, China |
Session 1 – Advanced Packaging
Chairs |
Yifan GUO | ASE |
Qidong WANG | Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China |
Members |
Bing DANG | IBM, USA |
Li ZHANG | Zhexin Semiconductor (Zhejiang)Co.,Ltd |
Guoping ZHANG | Shenzhen Institute of Advanced Technology, CAS, China |
Xiangmeng JING | HiSilicon, China |
Teng WANG | MIXOSENSE, China |
Shuying MA | Huatian Technology (Kunshan) Electronics Co., Ltd, China |
Feng JIANG | Xiamen Sky Semiconductor, China |
Qian WANG | Tsinghua University, China |
Chengqian Wang | Wuxi Zhongwei High-tech Electronics Co.,Ltd., China |
Daping YAO | Zhongke Zhixin, China |
Fengwei DAI | NCAP, China |
Qian LI | NAURA Technology Group Co., Ltd, China
|
Session 2 – Packaging Materials & Processes
Chairs |
Zhiquan LIU | Shenzhen institute of advanced technology, CAS, China |
Tao HANG | Shanghai Jiao Tong University, China |
Members |
Guisheng ZOU | Tsinghua University, China |
Yanhong TIAN
| Harbin Institute of Technology, China
|
Zhuo LI | Fudan University, China |
Mingliang HUANG
| Dalian University of Technology, China
|
Jingdong GUO | Institute of Metal Research, CAS, China |
Fengwen MU | Institute of Microelectronics, CAS, China |
Panju SHANG | Huawei Technologies Co., Ltd., China |
Liang ZHANG
| Jiangsu Normal University, China
|
Caifu LI | Sun Yat-sen University, China |
C. Robert KAO
| National Taiwan University, Taiwan, China
|
Chih CHEN | National Chiao Tung University, Taiwan, China |
Hiroshi NISHIKAWA | Osaka University, Japan
|
Session 3 – Packaging Design & Modeling
Chairs |
Jun WANG | Fudan University, China |
Min MIAO | Beijing Information Science and Technology University, China |
Members |
Jun LI | IMECAS, China |
Daoguo YANG | Guilin University of Electronic Technology, China |
Pei CHEN | Beijing University of Technology, China |
Hua LU | Greenwich University, UK |
Xiaowu ZHANG | Institute of Microelectronics (IME),Singapore |
Haibo FAN | Nexperia Hong Kong, HK, China |
Xinping ZHANG | South China University of Technology, China |
Hu HE | Central South University, China
|
Daohui LI | Dynex Semiconductor Ltd., UK |
Xu LONG | Northwestern Polytechnical University, China |
Hongbo QIN | Guilin University of Electronic Technology, China |
Tonglong ZHANG | Huawei Technologies Co. Ltd, China |
Changxing WEI | Zhejiang University, China |
Lei SHAN | IBM,USA |
Hongbin SHI | Huawei Technologies Co. Ltd, China |
Session 4 – Interconnection Technologies
Chairs |
Jian CAI | Tsinghua University, China |
Xin GU | Shennan Circuit Co., Ltd., China |
Members |
Lingzhi CHEN | JCETGroupCo. LTD, China |
Zhuo CHEN | Central South University, China |
Jun LI | Shennan Circuit Co., Ltd., China |
Yingxia LIU | Beijing Institute of Technology, China |
Ziyu LIU | Fudan University, China |
CS TAN | National Technology University, Singapore |
Chenxi WANG | Harbin Institute of Technology, China |
Chaoqi ZHANG | Qualcomm Inc., USA |
Dingyou ZHANG | Broadcom Inc., USA |
Ning ZHAO | Dalian University of Technology, China |
Yi ZHONG | Xiamen University, China |
Session 5 – Advanced Manufacturing
Chairs |
Sheng LIU | Wuhan University, China |
Chengqiang CUI | Guangdong University of Technology, China |
Members |
Qiushi XIE | NAURA Technology Group Co., Ltd., China |
Zhiyin GAN | Huazhong University of Science and Technology, China |
Fuping CHEN | ACM Shanghai, China |
Hongjie WANG | TF-AMD, China |
Fulong ZHU | Huazhong University of Science and Technology, China |
Haitao SHI | JCET Group Co., Ltd., China |
Xinjun ZHOU | InnoLight Technology (Suzhou), China |
Yi SONG | Wuhan University, China |
Fuliang WANG | Central South University |
Ning ZHAO | Dalian University of Technology, China |
Yi ZHONG | Xiamen University, China |
Session 6 – Quality & Reliability
Chairs |
Fei QIN | Beijing University of Technology, China |
Yunfei EN | The 5th Institute of MIIT, China |
Members |
Bin LIU | Intel Asia-Pacific Research & Development Ltd., China |
Weiqiang LI | Huawei Technologies Co., Ltd., China |
Jianli ZHANG | BYD Company Limited, China |
Andy DAI | Coresing Semiconductor Technology Co., Ltd., China |
Zhiwen CHEN | Wuhan University, China |
Ke XUE | Southern University of Science and Technology, China |
Bin XIE | Applied Science and Technology Research Institute (ASTRI), Hong Kong, China |
Wayne LIN | Shenzhen Institute of Wide-Bandgap Semiconductors, China |
Puqi NING | Institute of Electrical Engineering, Chinese Academy of Sciences, China |
Miao CAI | Guilin University of Electronic Technology, China |
Yanwei DAI | Beijing University of Technology, China |
Xuefei MING | Wuxi Zhongwei Hi-technology Corporation, China |
Session 7 – Power Electronics
Chairs |
Huaiyu YE | Shenzhen Institute of Wide-Bandgap Semiconductors, China |
Ziyang GAO | Applied Science and Technology Research Institute (ASTRI), Hong Kong, China |
Members |
Yuhua CHENG | Peking University, China |
Qinsong QIAN | Southeast University, China |
Shunfeng LI | Huagong Semi, China |
Hongyu YU | South University of Science and Technology of China, China |
Jefferson HSU | Great Team Backend Foundry, Inc., TW, China |
Zhaozhen HOU | Huawei, China |
Bin ZHANG | ZTE, China |
Yunhui MEI | Tianjin University, China |
Weiwei HE | Basic, China |
River LI | Applied Science and Technology Research Institute (ASTRI), HK, China |
Joyce WANG | EPC Corporation, USA |
Jimmy LIU | GaN Systems, Canada |
Session 8 – Optoelectronics and New Display
Chairs |
Jianhua ZHANG | Shanghai University of Technology, China |
Fengman LIU | Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China |
Members |
Honglong NING | South China University of Technology |
Luqiao YIN | Shanghai University |
Hongbin CHENG | Cedar Electronics, China |
Zhaojun LIU | Southern University of Science and Technology, China |
Yu SUN | National center for advanced packaging, China |
Yi LUO | Dalian University of Technology, China |
Liancheng WANG | Central South University, China |
Guoqiao TAO | Ampleon Netherlands BV, Netherlands |
Jifang TAO | Shandong University, China |
Haiyun XUE | Institute of Microelectronics of Chinese Academy of Sciences, China |
Yaming FAN | Sinano, China |
Ping CHEN | Institute of Semiconductors of Chinese Academy of Sciences, China |
Yijun LU | Xiamen University, China |
Session 9 – MEMS, Sensor &IoT
Chairs |
Shenglin MA | Xiamen University, China |
Chaoyang XING | Beijing Aerospace Control Instrument Research Institute, China |
Members |
Daowei WU | Xi'an Institute of Microelectronics Technology, China |
Liulin HU | Southwest China Research Institute of Electronic Equipment, China |
Bin ZHOU | The 5th Institute of MIIT, China |
Lin GUI | Technical Institute of Physics and Chemistry(CAS), China |
Xiangzhong CHEN | National center for advanced packaging, China |
Yi LUO | Dalian University of Technology, China |
Liancheng WANG | Department of Mechanical and Process Engineering, Swiss Federal Institute of Technology in Zurich (ETHZ),Switzerland |
Chunrong PENG | Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), China |
Guangyi SHI | Wuxi Beiwei Sensor Technology Co., Ltd.,China |
Guoqiang WU | Wuhan University,China |
Guotao DUAN | Huazhong University of Science and Technology, China |
Jian WANG | Beijing Institute of Telemetry Technology, China |
Yunna SUN | Shanghai Jiao Tong University, China |
Binzhen ZHANG | North University of China, China |
Bin QI | Jiangsu Duowei Technology Co., Ltd., China |
Min ZHANG | Peking University ShenZhen Graduate School, China |
Qiannan XUE | Tianjin University, China |
Session 10 – Emerging Technologies
Chairs |
Jintang SHANG | Southeast University, China |
Cheng LI | Xiamen University, China |
Members |
Guannan YANG | Guangdong University of Technology, China |
Gaowei XU | Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, China |
Xiuzhen LU | Shanghai University, China |
Jun ZHANG | Guangdong University of Technology, China |
Hongbin SHI | Huawei Technologies Co., Ltd., China |
Hongwen HE | Hisilicon Technologies Co., Ltd., China |
Shuhui YU | Shenzhen institute of advanced technology, CAS, China |
Hui TANG | Guangdong University of Technology, China |
Yan ZHANG | Shanghai University of Technology, China |
Mingbin YU | Shanghai Institute of Microsystem & Information Technology |