Qidong WANG  Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences.

Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSc degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences.


Zhaomin LI  Vice President of Shihezi University

Zhaomin LI,who is the Professor, Ph.D. Supervisor and Vice President of Shihezi University, is a Technical Committee member of the National Energy Heavy Oil Engineering Technology Center, Chairman of the Foam Fluid Research Center of Shandong Province, Vice President of Shandong Provincial Marine Development Research Association, Director of 'Energy and Environment Nanotechnology Research Center' of Qingdao International Science and Technology Cooperation Base and Director of the Academic Committee of the Enterprise Key Laboratory of 'Tianjin Offshore Oil Difficult to Develop Reserves Exploitation.'

Executive Chair


Liming XU  Vice Dean of the School of Mechanical and Electrical Engineering at,Shihezi University

Dr. XU Liming received his PhD in Mechanical Manufacturing and Automation from Shanghai Jiao Tong University. He worked as a Visiting Scholar at the University of Michigan in 2005. He currently is a professor and serves as the Vice Dean of the School of Mechanical and Electrical Engineering at Shihezi University, and holds the position of Doctoral Supervisor at Shanghai Jiao Tong University. His research interests include precision and intelligent manufacturing technology, digitalization of manufacturing equipment, fault diagnosis and intelligent maintenance. 



Lei SHI 

CEO of TongFu Microelectronics Co., Ltd., China


Li ZHENG  CEO of JCET Group, China

Mr. Zheng Li is a member of the board of directors and Chief Executive Officer at JCET Group Co., Ltd.  JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly and final test. 

Ming LI  

Prof. of Shanghai Jiao Tong University, China


Fei XIAO  Prof. of Fudan University, China


Wenhui ZHU  Prof. of Central South University, China、Founder of Changsha AMQ Intelligent Technology Pte Ltd.

Prof. Wenhui Zhu is professor with Central South University, China and Founder of Changsha AMQ Intelligent Technology Pte Ltd. He was elected as National Elite Talent. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He was Chief Scientist of 973 program on IC wafer level 3D integration, and has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon and UTAC.


Jianhua ZHANG  Executive dean of School of microelectronics, Shanghai University,China.

Prof. Jianhua Zhang is the executive dean of School of microelectronics, Shanghai University. She won the National Science Fund for Distinguished Young Scholars in 2018. She is Yangtze River Scholar Distinguished Professor, Young and Youth Science and technology Innovation Leader s for scientific and technological innovation in the national 'ten thousand talents plan', and Science and Technology Innovation Leader.


Daoguo YANG  Prof. of Guilin University of Electronic Technology, China

Prof. Daoguo Yang received his Master degree from Zhejiang University, China, and Ph.D. from Delft University of Technology (TUDelft), the Netherlands. He is currently a professor of Guilin University of Electronic Technology and the duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices and the director of Guangxi Electronic Packaging and assembly technology Engineering Research Centre.


Chengqian CUI  Prof. of Guangdong University of Technology, China

Chengqiang Cui, Professor of Guangdong University of Technology (GDUT)and CEO of Guang Dong FoZhiXin microelectronics Technology Research Co.Ltd.  He received his PhD in Chemistry from the University of Essex (ESSEX) in 1991, bachelor's and master's degrees in Department of Chemical Engineering , Tianjin University in 1983 and 1985, respectively. He has hosted various national R&D projects including national 02 project and 863 project. He has almost 30 years’ experience in the development and production of microelectronic advanced packaging technology and materials, especially, high-density packaging substrates. 


General Manager of Yan Tai Darbond Technology Co., Ltd., China


Zhiyi XIAO  General Manager of Huatian Technology(Kunshan) Co., Ltd., China


Institute of Microelectronics of Chinese Academy of Sciences, China

Bin Zhou

Research professor Deputy chief engineer of Key Laboratory in the 5th Electronics Research Institute of the Ministry of Industry and Information Technology


Juan HOU  Vice Dean of the College of Sciences, Shihezi University

Prof. Juan Hou, Vice Dean of the College of Sciences, Shihezi University, China.

Director of Xinjiang Production & Construction Corps Key Laboratory of Advanced Energy Storage Materials and Technology, China.

Her current research interests focus on photoelectric new energy materials and devices.


Hongkun WANG

The College of Mechanical and Electrical Engineering ,Shihezi University


The Information Science and Technology(School Of Cyber Science and Engineering), Shihezi University

Xingzao HUANGGeneral Manager of Beijing Faith Information Consultant Ltd.