| Honorary Chair |
| Keyun BI Honorary president of Packaging Branch, CSIA, China |
| General Chair |
| Tianchun YE President of Academy of Integrated Circuit, Chinese Academy of Sciences、President of IC branch of China Semiconductor Industry Association、Secretary General of China Integrated Circuit Innovation Alliance Professor Ye Tianchun has engaged in studies on IC fabrication technology, novel devices and micro-fabrication for a long time. As subject principal and key backbone, he has completed a dozen of research subjects, which are supported by the 7th-10th“Five-Year National Key Technologies R&D Programme”, the National Climbing Project,“863”project,“973 Program”and project of Knowledge Innovation Program of the Chinese Academy of Sciences. Several achievements on deep submicron and nano-fabrication, UHF compound semiconductor and devices stand at the leading position at home or achieve international advanced level.
|
| Executive Chair |
| Bin Dai President of Shihezi University
Dai Bin is the Professor (T2), Ph.D. Supervisor, an expert entitled to State Council Special Allowance, President and Deputy Secretary of Shihezi University, Director of the State Key Laboratory Incubation Base for Green Processing of Chemical Engineering, Candidate of the National Millions of Talents Project, and the Leading Talent of Science and Technology of National Ten Thousand Talents Program. |
| Co-chairs |
| KITTY PEARSALL IEEE EPS President KITTY PEARSALL (AM’84-M’01-SM’02) received the BS degree in Metallurgical Engineering (1971) from the UT El Paso. Kitty received the MS and Ph.D. degree in Mechanical Engineering and Materials from the UT Austin in 1979 and 1983 respectively. Kitty worked for IBM from 1972 to 2013. In 2005 Kitty was appointed an IBM Distinguished Engineer and was elected to the IBM Academy of Technology. Kitty was a process consultant and subject matter expert working on strategic initiatives impacting component qualification and end quality of procured commodities. She engaged with worldwide teams implementing cross-brand, cross commodity processes/products that delivered high quality/high reliability end product. |
| Kouchi ZHANG Prof. of Delft University of Technology, Netherlands Prof. Kouchi ZHANG is a Chair Professor with the Department of Microelectronics, Delft University of Technology. He had been with Philips for 20 years as Principal Scientist, Technology Domain Manager, Senior Director of Technology Strategy, and Philips Research Fellow, until 2013. He is the co-chair of advisor board of International SSL Alliance (ISA); secretary general of IEEE 'International Technology Roadmap of Wide bandgap semiconductors' (ITRW). |
| Johan LIU Prof. of Shanghai University, China Prof. of Chalmers University of Science & Technology, Sweden Member of Royal Swedish Academy of Engineering, Sweden Dr. Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently a special recruited professor at Shanghai University, China (short term) and a professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden. |
| Xuejun FAN Prof. of Lamar University, USA Prof. Xuejun Fan is a Regents’ Professor of Texas State University System, and a Mary Ann and Lawrence E. Faust Endowed Professor at Lamar University, Beaumont, Texas. Dr. Fan is an IEEE Fellow, and an IEEE Distinguished Lecturer. He currently serves as a member-at-large of the IEEE Electronic Packaging Society (EPS) Board of Governors. Dr. Fan gained significant experience in the microelectronics industry between 1997 and 2007, at IME, Philips and Intel. |
 | Sheng LIU Prof. of Wuhan University, China Prof. Sheng Liu is the dean of the School of Power and Mechanical Engineering and the Institute of Technological Science of Wuhan University. He is the National Science Fund for Distinguished Young Scholars (Type B), Yangtze River Scholar Distinguished Professor, ASME Fellow, IEEE Fellow, and as a professionalism in the area of the “863 program” of the National High Technology Research and Development Program. |
| Liqiang CAO Deputy Director of Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), China CAO Liqiang，Research Interests : System Level Packaging and 3D Integration. Now Deputy Director and professor of Institute of microelectronics, Chinese Academy of Sciences. As the project leader and technical backbone, he has participated in 8 national scientific research projects, including major national science and technology projects and key projects of National Natural Science Foundation of China. |
| Secretary |
| Wen YIN | Institute of Microelectronics of Chinese Academy of Sciences, China |
Janey SHI | Beijing Hengrenzhixin Consulting Company |
| Hongkun WANG | The College of Mechanical and Electrical Engineering ,Shihezi University |
| Pan GAO | The Information Science and Technology（School Of Cyber Science and Engineering）, Shihezi University |