2022 23rd International Conference on Electronic Packaging Technology
English
Chinese
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ORGANIZED BY
CONTACT US
School of Microelectronics, Dalian University of Technology, Dalian, Liaoning
Haoran MA
0086-15040454286
icept2022@dlut.edu.cn
Zhenzhong ZHANG
0086-18626668329
Wen YIN
0086-010-82995675
Conference Registration
Juanjuan Zhou
0086-010-64655241
support@fsemi.tech
0086-13683163150
Jing Ren
0086-010-64655251
0086-18633617772
ren.jing@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Academician of CAS
Academician of CAE
Prof. of Institute of Microelectronics of Chinese Academy of Sciences,
China
Former Vice-President of Tsinghua University, China
Rolf
ASCHENBERENNER
Former President of IEEE-CPMT, USA;
Deputy Director of IZM, Fraunhofer, Germany
Former Vice-President of IEEE-CPMT, USA
Prof. of HKUST, Hong Kong, China
Former President of IEEE-CPMT
Senior Director of ASE, USA
Foreign Academician of CAS
Prof. of Georgia Institute of Technology, USA
Pettit Chair Prof. & Director of Packaging Research Center,
Georgia Institute of Technology, USA
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