| Hosted by |
Institute of Microelectronics, Chinese Academy of Sciences | Xiamen University |
| IEEE Electronics Packaging Society (IEEE EPS) | Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT) |
| Organized by |
| School of Electronic Science and Engineering (national Model Microelectronics College) | Xiamen Semiconductor Investment Group Co., Ltd. |
| Xiamen Sky Semiconductor | National Center for Advanced Packaging (NCAP) |
| Beijing Faith Information Consultant Ltd |
|
| Co-Organized by |
| JCET Group | Shennan Circuits Company Limited |
| NAURA Technology Group Co., Ltd. | The 5th Electronics Research Institute of the Ministry of Industry and Information Technology（MIIT） |
| IEEE EPS Beijing Chapter Beijing Faith Information Consultant Ltd. | Xiamen Semiconductor Industry Association |
| Payton Technology (Shenzhen) Co.,Ltd. | ASTRI |