CONFERENCE ORGANIZERS
Hosted by  

Institute of Microelectronics, Chinese Academy of Sciences

Dalian University Of Technology

IEEE Electronics Packaging Society (IEEE EPS)  

Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)  

Organized by
School of Microelectronics,Dalian University Of TechnologyNational Center for Advanced Packaging (NCAP)  
BeiJing Hengrenzhixin Consulting Company
Co-Organized by  

Dalian Semiconductor Industry Association

Beijing branch of IEEE Electronics Packaging Society (IEEE-EPS)

The 5th Electronics Research Institute of the Ministry of Industry and Information Technology(MIIT)

Shennan Circuits Company Limited

Payton Technology (Shenzhen) Co.,Ltd

ASTRI

State Key Laboratory of Mobile Network and Mobile Multimedia Technology (ZTE)