2023 24th International Conference on Electronic Packaging Technology
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Meeting Secretary
Hongkun WANG
0086-18099937231
icept@fsemi.tech
Wen YIN
0086-010-82995675
Pan GAO
0086-13179930011
Zhaoquan ZENG
0086-18199936165(Submit Contact)
ling ZHANG
0086-17799431176(Submit Contact)
Conference Registration
Yico WANG
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support@fsemi.tech
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Manager YU
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Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Institute of Microelectronics, Chinese Academy of Sciences
Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)
Shihezi University College of Sciences (Xinjiang Production & Construction Corps Key Laboratory of Advanced Energy Storage Materials and Technology)
Shihezi University College of Information Science and Technology(School of Cyber Science and Technology)
Xinjiang Key Laboratory of Electronic Information Materials and Devices
National Center for Advanced Packaging (NCAP)
BeiJing Hengrenzhixin Consulting Company
IEEE Electronics Packaging Society (IEEE-EPS) Beijing Chapter
Sky Semiconductor
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