CONFERENCE ORGANIZERS

Sponsored by  

Shanghai University

IEEE Electronics Packaging Society (IEEE EPS)  

Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)  


Organized by

School of Microelectronics, Shanghai University(Shanghai School Microelectronic Industries)

National Center for Advanced Packaging Co., Ltd. (NCAP China) 

Beijing Herogees Consulting Company


Co-Organized by  

IEEE Electronics Packaging Society (IEEE EPS) , Beijing Branch

Key Laboratory of Advanced Display and System Applications Ministry of Education

Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology 

Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle

Shanghai Integrated Circuit and New Display Materials Engineering Research Center

Shennan Circuits Co., Ltd.

China Electronic Product Reliability and Environmental Testing Research Institute (China CEPREI Laboratory)