CONFERENCE ORGANIZERS
Hosted by  

Institute of Microelectronics, Chinese Academy of Sciences

Tiangong University

IEEE Electronics Packaging Society (IEEE EPS)  

Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)  

Organized by

Tiangong University of Electrical Engineering

Tiangong University of electronics & information engineering

National Local Joint Engineering Research Center of Electrical Machine System Design and Manufacturing

Engineering Research Center of High Power Solid State Lighting Application System  Ministry of  Education

National Center for Advanced Packaging (NCAP)  

BeiJing Hengrenzhixin Consulting Company

Co-Organized by  

IEEE Electronics Packaging Society (IEEE-EPS) Beijing Chapter

Tianjin Integrated Circuit lndustry Association

Shennan Circuits Co., Ltd.

China Electronic Product Reliability and Environmental Testing Research Institute (China CEPREI Laboratory)

SABers Co., Ltd