CONFERENCE ORGANIZERS
Hosted by  

Institute of Microelectronics, Chinese Academy of Sciences

Shihezi University
IEEE Electronics Packaging Society (IEEE EPS)  

Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)  

Organized by
Mechanical and Electrical Engineering at Shihezi University

Shihezi University College of Sciences （Xinjiang Production & Construction Corps Key Laboratory of  Advanced Energy Storage Materials and Technology）

Shihezi University College of Information Science and Technology（School of Cyber Science and Technology）

Xinjiang Key Laboratory of Electronic Information Materials and Devices

National Center for Advanced Packaging (NCAP)  

BeiJing Hengrenzhixin Consulting Company

Co-Organized by  

IEEE Electronics Packaging Society (IEEE-EPS) Beijing Chapter


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