2025 26th International Conference on Electronic Packaging Technology
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Meeting Secretary
Xiaoxiao JI(Submit Contact)
18621199790
icept@fsemi.tech
Wen YIN
0086-010-82995675
Conference Registration
Yico WANG
0086-13121110782
0086-010-64655251
support@fsemi.tech
Conference Sponsorship
Janey SHI
0086-13661508648
janey@fsemi.tech
Judy ZHOU
0086-13683163150
juanjuan.zhou@fsemi.tech
Sponsored by
Shanghai University
IEEE Electronics Packaging Society (IEEE EPS)
Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)
Organized by
School of Microelectronics, Shanghai University(Shanghai School Microelectronic Industries)
National Center for Advanced Packaging Co., Ltd. (NCAP China)
Beijing Herogees Consulting Company
Co-Organized by
IEEE Electronics Packaging Society (IEEE EPS) , Beijing Branch
Key Laboratory of Advanced Display and System Applications Ministry of Education
Shanghai Collaborative Innovation Center of Intelligent Sensing Chip Technology
Shanghai Key Laboratory of Chips and Systems for Intelligent Connected Vehicle
Shanghai Integrated Circuit and New Display Materials Engineering Research Center
Shennan Circuits Co., Ltd.
China Electronic Product Reliability and Environmental Testing Research Institute (China CEPREI Laboratory)
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