CONFERENCE ORGANIZERS
Hosted by  

Institute of Microelectronics, Chinese Academy of Sciences

Dalian University Of Technology

IEEE Electronics Packaging Society (IEEE EPS)  Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics, China (CIE-EMPT)  
Organized by
School of Microelectronics,Dalian University Of TechnologyNational Center for Advanced Packaging (NCAP)  
BeiJing Hengrenzhixin Consulting Company
Co-Organized by  

Dalian Semiconductor Industry Association

Beijing branch of IEEE Electronics Packaging Society (IEEE-EPS)
The 5th Electronics Research Institute of the Ministry of Industry and Information Technology(MIIT)Shennan Circuits Company Limited

Payton Technology (Shenzhen) Co.,Ltd

ASTRI