Glass Substrates for Advanced Packaging: Opportunities and Challenges

Dr. Haipeng Zhang
  Director of R&D，Shandong Linuo Pharmaceutical Packaging Co., Ltd.

Abstract:

Glass substrates boast a long application history and have gained surging popularity recently driven by demands from advanced packaging. Featuring superior flatness, high temperature resistance, tunable CTE and low dielectric constant, they are well suited for substrate and interposer applications. Nevertheless, glass suffers from intrinsic brittleness and insufficient fracture toughness. Thermal expansion mismatch with copper wiring tends to trigger crack propagation. Meanwhile, the industry imposes stringent requirements on indicators such as bubbles, stones, compositional uniformity, residual stress, TTV and surface roughness.

Linuo Pharmaceutical Packaging has developed targeted integrated solutions. Strontium oxide and barium oxide are introduced into formulations to enhance toughness and inhibit crack growth. Drawing on 30 years of kiln operation expertise, the company optimizes melting, refining and homogenization processes via digital twins and CFD simulation. Precision forming technology is adopted to manufacture low-stress, ultra-flat substrates with customizable CTE and dielectric constant, delivering highly reliable glass base materials for advanced packaging.

Speaker's Biography: 

Ph.D. in Materials Science from Shandong University (bachelor, master and doctorate). He has published 8 SCI papers in journals such as Advanced Materials and Applied Catalysis B. Since joining Linuo Pharmaceutical Packaging Research Institute in 2024, he has acted as Assistant to the Chief Engineer. His research focuses on special glass formulation and engineering scaling-up. He led the optimization of glass refining systems and participated in more than ten R&D programs involving low-melting-point microtubes, antibacterial glass, high-strength pharmaceutical glass and semiconductor TGV substrate glass. He also leads lean improvement initiatives and has won multiple corporate innovation awards.