Packaging Technologies for Smartphone RF Front-End Modules: Technical Challenges and Emerging Trends

  Dr. Yue Sun

  Senior Wireless Engineer，Xiaomi，China

Abstract:

This presentation focuses on packaging technologies for smartphone RF front-end devices, with a systematic discussion of key challenges in high-frequency interconnects, heterogeneous integration, electromagnetic isolation, and thermomechanical reliability. It also examines emerging trends, including shorter interconnects, heterogeneous co-packaging, advanced packaging architectures, and coordinated electromagnetic, thermal and mechanical design. The presentation aims to provide technical insights into the design, development, and commercialization of next-generation RF front-end modules featuring compact form factors, low loss, high levels of integration, and enhanced reliability.

Speaker's Biography: 

Dr. Yue Sun earned his Ph.D. in Microelectronics from Delft University of Technology. His research focuses on RF technologies for consumer electronics, particularly device design, module packaging, and reliability, with the goal of advancing high-performance and highly integrated RF solutions for next-generation consumer electronic devices. His work has been published in internationally recognized journals and leading conference proceedings, including the IEEE International Electron Devices Meeting, IEEE Transactions on Electron Devices, and Applied Physics Letters.