Material Technologies Enabling Co-Packaged Optics: Challenges and Solutions in Electronic-Photonic Hybrid Integration

  Dr. Yasuharu Murakami

  Senior Director of the Research Institute Strategy Department, Resonac Corporation

Abstract:

With the rapid expansion of AI and data-center demand, semiconductor packaging must achieve significant advancements in bandwidth, power efficiency, and integration density. Co-Packaged Optics (CPO) is attracting attention as an optical interconnect technology that replaces electrical interconnects and requires advanced integration of electronics and photonics.

This presentation outlines the requirements and challenges of hybrid integration in advanced electronic-photonic packaging, focusing on key technical issues in the optical engine domain, including optical path design, coupling, assembly precision, thermal management, and reliability. It also presents our material technology developments, including polymer waveguides, optical adhesives, and thermal management materials.

Speaker's Biography: 

Yasuharu Murakami is Senior Director of the Research Institute Strategy Department at Resonac Corporation. He received a Ph.D. in Engineering from the Institute of Science Tokyo and has over 20 years of experience in the development of electronic materials such as dry film resists, photodefinable redistribution materials, and transparent display materials.