Photonic Packaging

  
  Dr. Yik-Yee TAN
  Principal Market & technology Analyst, Yole Group, Singapore

Abstract:

The exponential growth of data-intensive applications, including artificial intelligence (AI), high-performance computing (HPC), and hyperscale data centers, is driving unprecedented demand for higher bandwidth, improved energy efficiency, and lower latency interconnects. Traditional electrical interconnects are approaching their physical and power limits, positioning photonic integration as a key solution. Photonic packaging plays a critical role in enabling this transition by integrating photonic integrated circuits (PICs) with electronic integrated circuits (EICs), bringing optical interconnects closer to compute engines.

A central theme in this domain is heterogeneous integration of PICs and EICs, where advanced packaging technologies allow the co-integration of optics and electronics within a unified platform. Approaches such as 2.5D interposers, fan-out packaging, and 3D stacking are increasingly adopted to support this integration. Industry developments highlight the diversity of architecture from TSMC’s COUPE, ASE FOCoS and other emerging solutions.

This presentation will focus on the market trends, technology trends and the challenges of photonic packaging. How the transition reshapes the supply chain, opportunity for OSATs, and also driving new partnerships across the photonics and semiconductor ecosystems.

Speaker's Biography: 

Yik Yee (YY) Tan Ph.D. is a Principal Technology & Market Analyst, Semiconductor Packaging & Assembly at Yole Group. Dr. Tan holds a Ph.D. in Engineering from Multimedia University (MMU, Malaysia). She has more than 25 years of experience in semiconductor packaging. Based on her technical expertise and market knowledge, she develops technology & market reports and is engaged in dedicated custom projects.

Prior to Yole, Dr. Tan worked as a failure analyst and interconnect champion at Infineon Technologies (Malaysia) and later as an open innovation senior manager at Onsemi (Malaysia).

She published more than 30 papers and hold 4 patents and award winner for IEEE EPS - Regional 10 Contribution Award 2024 and IEEE Malaysia Section – Outstanding Industry Volunteer Award 2024. Adjunct Professor at Nottingham Malaysia.