Advanced Packaging Solutions and Thermo Mechanical Reliability Investigation for High Performance Embedded Power Modules

  
  Dr. Jing Zhang

  R&D Director，Heraeus Electronics China

Abstract:

With the rapid advancement of wide bandgap power electronics, embedded power modules are increasingly requiring advanced material and interconnection solutions to meet stringent thermal and reliability specifications. This keynote provides a holistic overview of key enabling technologies for high performance embedded packaging, including sintered metallic bonding materials, fluxless solder systems for PCB integration, and Active Metal Brazed (AMB) ceramic substrates.

Among these technical routes, this presentation focuses on simulation based thermo mechanical reliability assessment of representative sintering solutions. Comparative investigations are performed to characterize the long term performance of sintered silver and sintered copper under typical service conditions, offering insights into their respective advantages and constraints for embedded module applications.

In addition, recent R&D progress on integrated copper sintering technologies developed will be briefly highlighted. This work aims to deliver high level guidance for material selection and reliability optimization, supporting the development of robust and scalable embedded power module packaging for next generation power electronic systems.

Speaker's Biography: 

Dr. Jing Zhang, currently serving as the R&D Director of Heraeus Electronics China, specializes in high-power electronic packaging materials and reliability. He holds a Ph.D. from Delft University of Technology in the Netherlands and has dedicated 15 years to this field. Since joining Heraeus Germany in 2017, Dr. Zhang has shifted his research focus to advanced packaging materials and technologies for third-generation semiconductor devices, as well as their reliability assessment.

Dr. Zhang has published over 40 papers and authored one academic book. He holds several prominent positions in the international academic community, including the founding Chair of the Benelux Chapter of the IEEE Electronics Packaging Society (EPS), Executive Secretary and Packaging Committee Member of the International Technology Roadmap for Wide Bandgap Semiconductors (ITRW), and Technical Committee Member of the ICEPT Conference. Additionally, he serves as a Technical Committee Member of the Shanghai Engineering Research Center for Silicon Carbide Power Devices.

Beyond his professional achievements, Dr. Zhang is currently acting as off-campus master's supervisor at both Fudan University and Shanghai Jiao Tong University.