Experiment and Simulation on Mechanical Properties for Electronic Packaging Reliability

  
  Dr. Chuantao Hou

  Director，Beijing Institute of Structure and Environment Engineering，China

Abstract:

The semiconductor industry has been in a state of rapid evolution in recent years. The relentless march towards smaller device geometries has been one of the driving forces behind this transformation. With the smaller dimension, the reliability assessment of electronic packages demands more accurate and efficient methods, since it is an extremely important component of the design process.

Structural failure of electronic packaging under thermo-mechanical loads represents a typical mechanical problem. Establishing a forward design methodology for the structural reliability of electronic packaging based on mechanical analysis and testing techniques is of great significance for improving product reliability. Combining multi-scale computation and experimental measurements, this report correlates macroscopic failure phenomena with intrinsic damage mechanisms, develops a high-precision stress and strain analysis approach to predict service life, and advances measurement techniques for deformation and strain in electronic packaging structures. In this way, potential faults can be eliminated as far as possible at the initial stage of product design rather than remedying failures after they occur, fundamentally enhancing the quality and reliability of instruments and equipment.

Speaker's Biography: 

Dr. Chuantao Hou currently serves as Director of the Science and Technology on Reliability and Environment Engineering Laboratory, Beijing Institute of Structure and Environment Engineering. He is Deputy Editor of Strength and Environment and a Senior Expert at the China Academy of Launch Vehicle Technology. His research interests lie in the structural analysis of aerospace electronic devices subjected to extreme mechanical and thermal loads, multi-scale structural verification, and reliability analysis based on the Physics-of-Failure methodology.As chief technical expert and principal investigator, he has presided over dozens of major research programs. He is the recipient of more than 30 scientific and technical awards, holds over 100 granted invention patents, and has authored more than 50 peer-reviewed academic papers.