Simulation of Interconnection in Advanced Packaging with COMSOL Multiphysics

   Dr. Leming HE

   Application Engineer, COMSOL China

Abstract：
As chip integration density keeps rising, advanced packaging processes have garnered growing industry attention. A wide range of packaging and interconnection technologies, including flip chip, hybrid bonding, TSVs and TGVs, face prevalent challenges such as residual stress, interfacial failure and warpage deformation. Multiphysics coupling simulation technology enables precise analysis of the various physical phenomena — including electromagnetics, heat transfer, structural behavior, and fluid flow — and their interactions in packaging interconnect technologies. By helping engineers understand process mechanisms, optimize process parameters, and improve product reliability and yield, multiphysics modeling has become an indispensable part of process R&D and optimization. 

This presentation will focus on the applications of COMSOL Multiphysics in packaging interconnection technologies. It will cover common physical phenomena and simulation approaches in bonding and TSV/TGV processes, including bonding wave propagation in hybrid bonding, the D2W (Die-to-Wafer) bonding process, as well as simulation analysis of through-via fabrication processes and device reliability. By converting specialized simulation models into user-friendly simulation Apps, multiphysics modeling will enhance team collaboration and accelerate the R&D process.

Speaker's Biography: 

Leiming He earned his PhD in Microelectronics and Solid-State Electronics from Fudan University. He previously worked at a renowned enterprise in the semiconductor industry, where his core research areas cover power devices, MEMS devices, as well as structural design and manufacturing processes of various chips. Since joining COMSOL China, he has been in charge of technical support and customer consulting services, with a primary focus on advanced packaging processes and structural design.