Failure Mechanism and Reliability Evaluation of Interconnection Structures for SiP

  
  Dr. Ling LI

  Deputy Chief Engineer，Xi'an Microelectronics Technology Institute，China

Abstract:

The high-density interconnection structures of 3D heterogeneous microsystems consist of diverse materials and numerous interfaces. Mismatched coefficients of thermal expansion at interfaces generate interfacial stress under temperature cycling loads, inducing fatigue failures including delamination and cracking. Taking typical interconnection structures (redistribution layers (RDLs), through-silicon vias (TSVs) and micro-bumps) as research objects, this study adopts temperature cycling accelerated life tests to explore the parameter degradation laws and microscopic failure mechanisms of interconnections under coupled thermal-mechanical loads. Based on degradation data, consistency verification of failure mechanisms, optimization selection of life distribution models and confidence analysis are conducted. Combined with acceleration models, fatigue life calculation is performed to realize quantitative reliability evaluation of SiP interconnection structures. The research results can provide theoretical support for structural optimization and life design of 3D integrated SiP.

Speaker's Biography: 

She is a member of the Expert Group of CASC. She has conducted systematic research covering failure modes and mechanisms of microsystems and microelectronic devices, defect identification and non-destructive testing, accelerated life testing as well as reliability evaluation technologies. She has presided over and participated in more than 10 research projects, including National Natural Science Foundation programs, basic research projects for major equipment special projects, life tests and reliability assessments for life extension projects. Her relevant technical research and engineering application achievements are at the leading level among domestic counterparts. As the first author, She has published more than 20 scientific papers and several conference papers. The methodologies and research outcomes developed have been successfully applied to quality assurance, failure analysis and life assessment programs for microsystems and microelectronic products.