Advanced Organic Substrates enabling co-package optics at scale

  Mr. Bula Wang

  TDI Director，AT&S 

Abstract: 

High speed data infrastructure with very high efficiency is necessary to meet the demands of increasing AI workloads, next generation datacenters and HPC. Several industrial leading companies are working on CPO to reap performance benefits like reduced power, low latency and improved signal integrity. With these increasing architectural complexities and innovative approaches in advanced packaging, IC substrates have also evolved overtime to meet the market trends and demands. This talk focuses on how IC substrates play a crucial role in addressing CPO manufacturing, performance and functionality challenges.

Speaker Biography:

Bula Wang, as the Director of Technology Development for AT&S Microelectronics Business Unit, is responsible for leading and managing engineering solutions for ABF substrate products. He has more than 20 years of extensive experience in the advanced packaging field, including OSAT and ABF substrates manufacturers. Prior to joining AT&S, Bula worked for ASE and Access for R&D and technical role.