TBD

  Mr. Farhang Yazdani

  CEO,BroadPak Corporation   

Abstract: 

Speaker Biography:

Farhang Yazdani is a semiconductor executive, inventor, investor, author, and technology strategist with more than two decades of industry experience. He has played a pivotal role in advancing next-generation semiconductor packaging technologies, heterogeneous integration, chiplet architectures, silicon photonics, and co-packaged optics.

Farhang is the Founder and CEO of BroadPak Corporation and inventor of the groundbreaking 3DHI HiRise Packaging Technology. He is widely regarded as one of the industry's foremost experts in advanced packaging and 3D heterogeneous integration. He has authored numerous technical publications, holds more than 40 issued and pending patents, and has contributed extensively to the commercialization of innovative packaging technologies adopted throughout the global semiconductor ecosystem. He is the author of “Foundations of Heterogeneous Integration: An Industry-Based 2.5D/3D Pathfinding and Co-Design Approach”, a widely respected reference book on advanced semiconductor integration and system-level co-design methodologies.

Farhang is a frequent keynote speaker, an industry advisor, and lecturer for the United States Patent and Trademark Office (USPTO). He has presented, chaired, and served as General/Technical program chair at major global conferences, including IEEE ECTC, ICEPT, ICEP, DAC, DATE, IMAPS, IEEE BUSS, and OIP. Farhang serves as the Co-Chair of the IMAPS Silicon Valley Chapter and contributes actively to industry roadmaps, technical committees, and professional development initiatives. He also serves on the Boards of Directors and Advisory Boards of several technology companies. He is the recipient of the NIPSIA Award for his significant contributions to semiconductor packaging innovation and technology advancement.

Farhang received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle. He collaborates with startups, industry leaders, research institutions, and technology innovators worldwide to advance heterogeneous integration technologies and help shape the future of AI-driven computing systems.