Digital lithography for advanced interconnects Toward-Zero-Compromise: Performance & Yield Co-Optimization

  
  Mr. Kazuya Aoki

  General Manager, Global Sales Division, Technical Marketing Division and Customer Success Team, AUCC, USHIO INC.

Abstract:

Advanced packaging is moving faster than ever, and it is strongly driven by the demand for higher system performance.

AI accelerators, GPUs, and ASICs must deliver not only speed, but also reliability at scale.

In advanced packaging, chips are integrated into complex interconnect structures—so yield is not just an important metric; it is essential for time-to-market and cost efficiency.

Even small process variations or defects can translate into major production losses.

With USHIO’s Digital Lithography Technology, we provide world-leading patterning performance while directly addressing the factors that affect yield.

Our approach helps customers reduce defects, improve process stability, and achieve more consistent results across production.

We don’t work in isolation—we partner with global-leading customers and co-develop solutions that enable breakthrough advanced packaging architectures.

Together, we are pushing the frontier of interposers and advanced packaging, and ensuring our technology delivers real value in production—yield, quality, and scalable throughput.

Speaker's Biography: 

Mr. Aoki joined USHIO group in 2004, and he has more than two decades of professional experience focusing on semiconductor lithography and advanced packaging, with strong expertise in global business expansion and technology commercialization.

In the early stage of his career, he took charge of sales and marketing for packaging steppers, successfully promoting the large-scale application of relevant equipment across advanced packaging sectors.

Between 2015 and 2025, he led the commercialization of EUV light sources for mask inspection, engaging in technological iteration and market validation throughout the EUV industrial chain.

In April 2025, he shifted his focus back to packaging lithography, driving market cooperation and the deployment of digital lithography technology.

Appointed to his current role in April 2026, he now concentrates on technological innovation and process optimization for advanced interconnect manufacturing. Leveraging his deep industry insights, he actively facilitates cross-industry collaboration and strives to advance lithography solutions that meet the evolving demands of high-end electronic packaging.