From Round to Rectangle: NAURA Empowers the Development of Panel-Level Packaging

  
  Mr.Yang Wang

  Vice President, General Manager of PLP Business Unit，Beijing NAURA Vacuum Technology Co., Ltd.，China

Abstract:

In the post-Moore era, advanced packaging is replacing process scaling as the core engine driving semiconductor performance scaling. With the advent of the AI high-compute era, packaging is undergoing a paradigm shift — traditional wafer-level packaging is rapidly transitioning toward rectangular panel-level packaging. Computing architectures exemplified by Rubin continue to drive the trend toward larger package dimensions.

Currently, panel-level packaging technology routes such as CoPoS, FOPLP, and GCS are flourishing, yet their industrialization remains constrained by three major challenges: the control of large-area in-plane uniformity, warpage caused by CTE mismatch, and thermal budget management in multi-layer stacking systems — poses stringent demands on equipment innovation.

Leveraging years of deep experience in the advanced packaging sector, NAURA has built a solid technological foundation and comprehensive industrial portfolio, and is committed to providing high-quality, domestically manufactured equipment for China's semiconductor industry. With mature wafer-level packaging capabilities and proven mass production expertise, NAURA focuses on three core process tools — Descum, PIQ furnace, and PVD — to deliver complete, end-to-end system solutions. These solutions drive advanced packaging toward higher integration, lower costs, and superior performance, empowering high-quality industrial upgrading.

Speaker's Biography: 

Mr. Wang Yang serves as BG Vice President of NAURA Vacuum and General Manager of the PLP Business Unit. He holds a Master's degree in Materials Science and has over 11 years of experience in R&D of semiconductor plasma equipment and thermal processing equipment. He has held various leadership positions at NAURA, including Product Manager, Product Line General Manager, and Industry Development General Manager.