Mastering 3D-IC Design Challenges Through Advanced Simulation

  Mr. Minggang Hou

  Principal Engineer，Synopsys     

Abstract: 

We are seing trends today in semiconductor and high tech product development There's an increasing demand for computational power and data processingat higher frequencies. Low oss at higher speeds results in designs that are more tightly integrated with higher power density, like 3D IC.From a simulationperspective,this means we need to be able to accurately simulate performance at high frequency while handling increasingly complex designs that maycontain hundreds of nets and ports With tight integration, modeling complex coupling mechanisms and capturing ll the 3D effects means that we need tosolve larger portions of the design all at once instead of using a divide and conquer approach.When it comes to co-simulating chip/chiplets and package with a high capacity high accuracy 3D solve, HFSs-IC and HPC enables you to sove increasinglycomplex designs at scale,special for two key application areas in 3D IC design: signaland power intgrity analysis for interposer design and chipto systemassemblies.