The Next 3D Frontier: Equipment Perspectives on D2W Hybrid Bonding Challenges

   Mr. Jonathan Abdilla

   Director Technology, Besi

Abstract: 

The speech will discuss the market trends in D2W hybrid bonding and highlight its importance and relevance to advanced packaging and the ongoing trend for higher processing power, higher data transfer speeds and lower power consumption, all while attempting to reduce footprint.  It will also highlight some key equipment factors necessary for successful D2W Hybrid bonding equipment and possible solutions to some process challenges.

Speaker's Biography:

Jonathan has a degree in Mechanical Engineering and an Executive MBA from the University of Malta and a diploma in Computing Information Systems from the University of London. He has over 20 years of packaging experience in the semiconductor industry. Before joining BESI, Jonathan worked for STMicroelectronics as production process specialist. He then joined BESI taking on roles of Manager for Process Development, Product Manager for Hybrid Bonding and currently Director in the CTO office. He resides on several technical committees for semiconductor packaging conferences.